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A new solder wetting layer for Pb-free solders

Published online by Cambridge University Press:  31 January 2011

Chang Yul Oh ,
Hee-Ra Roh ,
Young Min Kim ,
Jin Soo Lee ,
Hae Young Cho  and
Young-Ho Kim
Young-Ho Kim*
Affiliation:
Division of Materials Science & Engineering, Hanyang University, Seoul 133-791, Korea
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.

Keywords

AlloyCuZn
Type
Rapid Communications
Information
Journal of Materials Research , Volume 24 , Issue 2 , February 2009 , pp. 297 - 300
Copyright
Copyright © Materials Research Society 2009

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References

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