Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
LaLonde, A.
Emelander, D.
Jeannette, J.
Larson, C.
Rietz, W.
Swenson, D.
and
Henderson, D. W.
2004.
Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy.
Journal of Electronic Materials,
Vol. 33,
Issue. 12,
p.
1545.
Telang, A. U.
Bieler, T. R.
Lucas, J. P.
Subramanian, K. N.
Lehman, L. P.
Xing, Y.
and
Cotts, E. J.
2004.
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys.
Journal of Electronic Materials,
Vol. 33,
Issue. 12,
p.
1412.
Lehman, L. P.
Athavale, S. N.
Fullem, T. Z.
Giamis, A. C.
Kinyanjui, R. K.
Lowenstein, M.
Mather, K.
Patel, R.
Rae, D.
Wang, J.
Xing, Y.
Zavalij, L.
Borgesen, P.
and
Cotts, E. J.
2004.
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder.
Journal of Electronic Materials,
Vol. 33,
Issue. 12,
p.
1429.
Telang, Adwait U.
and
Bieler, Thomas R.
2005.
The Role of Special Boundaries during Solidification and Microstructure Evolution in Lead Free Solder Joints.
Materials Science Forum,
Vol. 495-497,
Issue. ,
p.
1419.
Telang, A. U.
and
Bieler, T. R.
2005.
The orientation imaging microscopy of lead-free Sn-Ag solder joints.
JOM,
Vol. 57,
Issue. 6,
p.
44.
Lehman, L.P.
Kinyanjui, R.K.
Wang, J.
Xing, Y.
Zavalij, L.
Borgesen, P.
and
Cotts, E.J.
2005.
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints.
Vol. 2,
Issue. ,
p.
674.
Puttlitz, Karl J.
and
Galyon, George T.
2006.
Lead-Free Electronic Solders.
p.
347.
Mattila, T. T.
and
Kivilahti, J. K.
2006.
Reliability of lead-free interconnections under consecutive thermal and mechanical loadings.
Journal of Electronic Materials,
Vol. 35,
Issue. 2,
p.
250.
Puttlitz, Karl J.
and
Galyon, George T.
2006.
Impact of the ROHS Directive on high-performance electronic systems.
Journal of Materials Science: Materials in Electronics,
Vol. 18,
Issue. 1-3,
p.
347.
Bieler, T.R.
Jiang, H.
Lehman, L.P.
Kirkpatrick, T.
and
Cotts, E.J.
2006.
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints.
p.
1462.
Jud, P. P.
Grossmann, G.
Sennhauser, U.
and
Uggowitzer, P. J.
2006.
Local Fatigue in Lead‐Free SnAg3.8Cu0.7 Solder.
Advanced Engineering Materials,
Vol. 8,
Issue. 3,
p.
179.
Zhiheng Huang
Conway, P.P.
and
Thomson, R.C.
2006.
Microstructural Considerations for Ultrafine Lead Free Solder Joints.
p.
1.
Swenson, D.
2006.
The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.
Journal of Materials Science: Materials in Electronics,
Vol. 18,
Issue. 1-3,
p.
39.
Swenson, D.
2007.
Lead-Free Electronic Solders.
p.
39.
NOUSIAINEN, O.
PUTAALA, J.
KANGASVIERI, T.
RAUTIOAHO, R.
and
VÄHÄKANGAS, J.
2007.
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies.
Journal of Electronic Materials,
Vol. 36,
Issue. 3,
p.
232.
Laurila, T.
Mattila, T.
Vuorinen, V.
Karppinen, J.
Li, J.
Sippola, M.
and
Kivilahti, J.K.
2007.
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.
Microelectronics Reliability,
Vol. 47,
Issue. 7,
p.
1135.
Lall, Pradeep
Panchagade, Dhananjay
Iyengar, Deepti
Shantaram, Sandeep
Suhling, Jeff
and
Schrier, Hubert
2007.
High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics.
p.
924.
Park, Seungbae
Dhakal, Ramji
Lehman, Lawrence
and
Cotts, Eric
2007.
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading.
Acta Materialia,
Vol. 55,
Issue. 9,
p.
3253.
Park, Seungbae
Dhakal, Ramji
Lehman, Lawrence
and
Cotts, Eric J.
2007.
Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling.
IEEE Transactions on Components and Packaging Technologies,
Vol. 30,
Issue. 1,
p.
178.
Kang, Sung K.
Cho, Moon Gi
Lauro, Paul
and
Shih, Da-Yuan
2007.
Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process.
p.
1597.