Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-24T19:52:37.588Z Has data issue: false hasContentIssue false

Microstructure and texture evolution of novel Cu–10Ni–3Al–0.8Si alloy during hot deformation

Published online by Cambridge University Press:  29 March 2016

Leinuo Shen
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Zhou Li*
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Qiyi Dong
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China; and State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, Hunan, China
Zhu Xiao
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Chang Chen
Affiliation:
Department of Metallic Materials, School of Materials Science and Engineering, Heifei University of Technology, Heifei 230009, Anhui, China
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The influence of temperature and strain rate on hot deformation behavior and microstructure of Cu–10Ni–3Al–0.8Si alloy was investigated. The true stress increased rapidly initially until it approached the peak values. The peak value of true stress and the Zener–Hollomon parameter decreased with the increase of temperature and the decrease of strain rate. The thermal activation energy of the alloy was about 396.57 kJ/mol, the processing map was established and the appropriate compression temperature was between 900 and 950 °C. The 〈001〉 and 〈011〉 fiber texture was the main type of texture. The increase of temperature or strain rate accelerated the formation of 〈001〉 fiber texture. Dynamic recrystallization nucleated and deformation bands formed at 750 °C. Recrystallization was accelerated with the increase of temperature and the decrease of Zener–Hollomon parameter. Both continuous recrystallization resulting from dynamic recovery and dynamic discontinuous recrystallization were softening mechanisms.

Type
Articles
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Hasegawa, T., Takagawa, Y., Watanabe, C., and Monzen, R.: Deformation of Cu–Be–Co alloys by aging at 593 K. Mater. Trans. 52, 1685 (2011).CrossRefGoogle Scholar
Xie, G-L., Wang, Q-S., Mi, X-J., Xiong, B-Q., and Peng, L-J.: The precipitation behavior and strengthening of a Cu–2.0 wt% Be alloy. Mater. Sci. Eng., A, 558, 326 (2012).Google Scholar
Henmi, Z. and Nagai, T.: Mechanism of precipitation hardening in Cu–Be alloys. Trans. Jpn. Inst. Met. 10, 166 (1969).CrossRefGoogle Scholar
Shen, L-N., Li, Z., Dong, Q-Y., Xiao, Z., Wang, M-Y., He, P-H., and Lei, Q.: Dry wear behavior of ultra-high strength Cu–10Ni–3Al–0.8 Si alloy. Tribol. Int. 92, 544 (2015).CrossRefGoogle Scholar
Shen, L-N., Li, Z., Dong, Q-Y., Xiao, Z., Li, S., and Lei, Q.: Microstructure evolution and quench sensitivity of Cu–10Ni–3Al–0.8Si alloy during isothermal treatment. J. Mater. Res. 30, 736 (2015).CrossRefGoogle Scholar
Oh, S-I., Semiatin, S-L., and Jonas, J-J.: An analysis of the isothermal hot compression test. Metall. Trans. A 23, 963 (1992).CrossRefGoogle Scholar
Petkovic, R-A., Luton, M-J., and Jonas, J-J.: Recovery and recrystallization of polycrystalline copper after hot working. Acta Metall. 27, 1633 (1979).CrossRefGoogle Scholar
Deng, Y., Yin, Z-M., and Huang, J.: Hot deformation behavior and microstructural evolution of homogenized 7050 aluminum alloy during compression at elevated temperature. Mater. Sci. Eng., A 528, 1780 (2011).CrossRefGoogle Scholar
Lei, Q., Li, Z., Wang, J., Li, S., Zhang, L., and Dong, Q-Y.: High-temperature deformation behavior of Cu–6.0Ni–1.0Si–0.5Al–0.15Mg–0.1Cr alloy. J. Mater. Sci. 47, 6034 (2012).CrossRefGoogle Scholar
Drucker, D-C.: Coulomb friction, plasticity, and limit loads, Brown univ. providence ri. div. of applied mathematics, 1953.
Ebrahimi, R. and Najafizadeh, A.: A new method for evaluation of friction in bulk metal forming. J. Mater. Process. Technol. 152, 136 (2004).CrossRefGoogle Scholar
Avitzur, B.: Metal Forming, Processes and Analysis (McGraw-Hill, New York, 1968); pp. 102.Google Scholar
Wanjara, P., Jahazi, M., Monajati, H., Yue, S., and Immarigeon, J-P.: Hot working behavior of near-α alloy IMI834. Mater. Sci. Eng., A 396, 50 (2005).CrossRefGoogle Scholar
Zhang, L., Li, Z., Lei, Q., Qiu, W-T., and Luo, H-T.: Hot deformation behavior of Cu–8.0 Ni–1.8 Si–0.15 Mg alloy. Mater. Sci. Eng., A 528, 1641 (2011).CrossRefGoogle Scholar
Prasad, Y., Gegel, H-L., Doraivelu, S-M., Malas, J-C., Morgan, J-T., Lark, K-A., and Barker, D-R.: Modeling of dynamic material behavior in hot deformation: Forging of Ti-6242. Metall. Trans. A 15, 1883 (1984).CrossRefGoogle Scholar
Anbuselvan, S. and Ramanathan, S.: Hot deformation and processing maps of extruded ZE41A magnesium alloy. Mater. Des. 31, 2319 (2010).CrossRefGoogle Scholar
Baudin, T., Etter, A-L., and Penelle, R.: Annealing twin formation and recrystallization study of cold-drawn copper wires from EBSD measurements. Mater. Charact. 58, 947 (2007).CrossRefGoogle Scholar
Zhao, Y-H., Zhu, Y-T., Liao, X-Z., Horita, Z., and Langdon, T-G.: Tailoring stacking fault energy for high ductility and high strength in ultrafine grained Cu and its alloy. Appl. Phys. Lett. 89, 121906 (2006).CrossRefGoogle Scholar
Su, J-Q., Nelson, T-W., Mishra, R., and Mahoney, M.: Microstructural investigation of friction stir welded 7050-T651 aluminium. Acta Mater. 51, 713 (2003).CrossRefGoogle Scholar
Gourdet, S. and Montheillet, F.: An experimental study of the recrystallization mechanism during hot deformation of aluminium. Mater. Sci. Eng., A 283, 274 (2000).CrossRefGoogle Scholar
Lei, Q., Li, Z., Wang, J., Xie, J-M., Chen, X., Li, S., Gao, Y., and Li, L.: Hot working behavior of a super high strength Cu–Ni–Si alloy. Mater. Des. 51, 1104 (2013).CrossRefGoogle Scholar
Li, Y-S., Zhang, Y., Tao, N-R., and Lu, K.: Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation. Acta Mater. 57, 761 (2003).CrossRefGoogle Scholar
Jafari, M. and Najafizadeh, A.: Correlation between Zener–Hollomon parameter and necklace DRX during hot deformation of 316 stainless steel. Mater. Sci. Eng., A 501, 16 (2009).CrossRefGoogle Scholar
Tan, J-C. and Tan, M-J.: Dynamic continuous recrystallization characteristics in two stage deformation of Mg–3Al–1Zn alloy sheet. Mater. Sci. Eng., A 339, 124 (2003).CrossRefGoogle Scholar
Gourdet, S. and Montheillet, F.: A model of continuous dynamic recrystallization. Acta Mater. 51, 2685 (2003).CrossRefGoogle Scholar