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Method for preparing dispersed crystalline copper particles for electronic applications

Published online by Cambridge University Press:  31 January 2011

Dan V. Goia*
Affiliation:
Center for Advanced Materials Processing, Clarkson University, Potsdam, New York 13699
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Dispersed crystalline copper particles were prepared by reacting aqueous dispersions of CuCl with ferrous citrate. We report that the Fe(II) citrate complex can reduce rapidly and completely cuprous chloride to metallic copper and propose a mechanism for the reaction observed. By changing the precipitation conditions, copper particles with sizes varying from 250 nm to 2.0 µm were obtained. The method described represents a simple and versatile approach for preparing copper powders for electronic applications.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2009

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References

1.Kodas, T.T., Hampden-Smith, M.J., Caruso, J., Skamser, D.J., Powell, Q.H., and Chandler, C.D.: Copper powders methods for producing powders and devices fabricated from same. US patent 7317725 B2 (2008).Google Scholar
2.Cordani, J.L.: Process for fabricating multilayer circuit boards. US patent 4775444 (1988).Google Scholar
3.Tani, H., Oshita, K., and Ikeda, T.: Copper paste for forming conductive thick film. US patent 5418193 (1995).Google Scholar
4.Tamura, K., and Takeda, T.: A study of the production of copper powder by atomization. Trans. Natl. Res. Inst. Metals 5, 252 (1963).Google Scholar
5.Rosenband, V. and Gany, A.: Preparation of nickel and copper submicrometer particle s by pyrolysis of their formats. J. Mater. Process. Technol. 153154, 1058 (2004).Google Scholar
6.Nikolić, N.D., Pavlović, Lj.J., Pavlović, M.G., and Popov, K.I.: Morphologies of electrochemically formed copper powder particles and their dependence on the quantity of evolved hydrogen. Powder Technol. 185, 195 (2008).CrossRefGoogle Scholar
7.Joshi, S.S., Patil, S.F., Iyer, V., and Mahumuni, S.: Radiation induced synthesis and characterization of copper nanoparticles. Nanostruct. Mater. 10, 1135 (1998).CrossRefGoogle Scholar
8.Lisiecki, I.: Size control of spherical metallic nanocrystals. Colloids Surf., A 250, 499 (2004).CrossRefGoogle Scholar
9.Songping, W.: Preparation of ultra fine nickel–copper bimetallic powder for BME-MLCC. Microelectron. J. 38, 41 (2007).CrossRefGoogle Scholar
10.Songping, W. and Shuyuan, M.: Preparation of micron size copper powder with chemical reduction method. Mater. Lett. 60, 2438 (2006).Google Scholar
11.Goia, D.V.: Preparation and formation mechanisms of uniform metallic particles in homogeneous solutions. J. Mater. Chem. 14, 451 (2004).Google Scholar
12.Hsu, W.P., Yu, R., and Matijević, E.: Preparation and characterization of uniform particles of pure and coated metallic copper. Powder Technol. 63, 265 (1990).CrossRefGoogle Scholar
13.Wu, S.: Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC. Mater. Lett. 61, 1125 (2007).CrossRefGoogle Scholar
14.Goia, D.V., Andreescu, D., and Farrell, B.P.: Polyol-based method for producing ultra-fine copper powders. US patent 2006/0090600 A1 (2006).Google Scholar
15.Khanna, P.K., Gaikwad, S., Adhyapak, P.V., Singh, N., and Marimuthu, R.: Synthesis and characterization of copper nanoparticles. Mater. Lett. 61, 4711 (2007).CrossRefGoogle Scholar
16.Sun, J., Jing, Y., Jia, Y., Tillard, M., and Belin, C.: Mechanism of preparing ultrafine copper powder by polyol process. Mater. Lett. 59, 3933 (2005).CrossRefGoogle Scholar
17.Wu, S.P., Gao, R.Y., and Xu, L.H.: Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor. J. Mater. Process. Technol. 209, 1129 (2009).Google Scholar
18.Lisiescki, I., Boulanger, L., Lixon, P., and Pileni, M.P.: Synthesis of copper metallic particles using functionalized surfactants in w/o and o/w microemulsions. Prog. Colloid Polym. Sci. 89, 103 (1992).Google Scholar
19.Cason, J.P., Miller, M.E., Thompson, J.B., and Roberts, C.B.: Solvent effects on copper nanoparticle growth behavior in AOT reverse micelle systems. J. Phys. Chem. B 105, 2297 (2001).CrossRefGoogle Scholar
20.Patterson, A.L.: The Scherrer formula for x-ray particle size determination. Phys. Rev. 56, 978 (1939).CrossRefGoogle Scholar
21.Andreescu, D., Goia, C., and Goia, D.V.: Copper powders and flakes for electronic applications, in Proceedings of 25th Symposium for Passive Components, CARTS, Palm Springs, CA, March 2124 (2005).Google Scholar
22.Turkevich, J. and Hillier, J.: Electron microscopy of colloidal systems. Anal. Chem. 21, 475 (1949).CrossRefGoogle Scholar
23.Lea, M.C.: On the allotropic forms of silver. Am. J. Sci. 37, 476 (1889).Google Scholar
24.Grau, F.H. and Halliday, W.J.: Oxidation and decarboxylation of citrate in the presence of ferrous iron. Nature 179, 733 (1957).CrossRefGoogle ScholarPubMed
25.Battistini, L. and Lopez-Palacios, J.: Multistep mechanism in the electrochemical oxidation-reduction of Fe-Citrate complexes. Anal. Chem. 66, 2005 (1994).CrossRefGoogle Scholar
26.Francis, A.J. and Dodge, C.J.: Influence of complex structure on the biodegradation of iron-citrate complexes. Appl. Environ. Microbiol. 59, 109 (1993).CrossRefGoogle ScholarPubMed
27.Millero, F.J., Sotolongo, S., and Izaguirre, M.: The oxidation kinetics of Fe(II) in seawater. Geochim. Cosmochim. Acta 51, 793 (1987).CrossRefGoogle Scholar
28.Wieland, H., and Franke, W.: Mechanism of oxidation processes. XIV. Activation of oxygen by iron. Ann. Chim. 464, 101 (1928).Google Scholar
29.Dodge, C.J. and Francis, A.J.: Photodegradation of a ternary iron (III)-uranium(VI)-citric acid complex. Environ. Sci. Technol. 36, 2094 (2002).CrossRefGoogle ScholarPubMed