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Mechanical Properties of Intermetallic Compounds in the Au–Sn System

Published online by Cambridge University Press:  01 August 2005

R.R. Chromik ,
D-N. Wang ,
A. Shugar ,
L. Limata ,
M.R. Notis  and
R.P. Vinci
R.R. Chromik*
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
D-N. Wang
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
A. Shugar
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
L. Limata
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
M.R. Notis
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
R.P. Vinci
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Whitaker Laboratory, Bethlehem, Pennsylvania 18015
*
a) Address all correspondence to this author. Present address: U.S. Naval Research Laboratory, Code 6176, 4555 Overlook Ave. S.W., Washington, DC 20375.e-mail: [email protected]
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Abstract

The mechanical properties of intermetallic compounds in the Au–Sn system were investigated by nanoindentation. Measurements of hardness and elastic modulus were obtained for all of the confirmed room-temperature intermetallics in this system as well as the β phase (8 at.% Sn) and AuSn4. Overall, it was found that the Au–Sn compounds have lower hardness and stiffness than common Cu–Sn compounds found in solder joints. This finding is in contrast to common knowledge of “Au embrittlement” due to the formation of either AuSn4 or (Au,Ni)Sn4 intermetallic compounds. This difference in understanding of mechanical properties of these phases and the resulting joint strength is discussed in terms of reliability and possible failure mechanisms related to interface strength or microstructural effects. Indentation creep measurements performed on Au5Sn, Au–Sn eutectic (29 at.% Sn) and AuSn indicate that these alloys are significantly more creep resistant than common soft solders, in keeping with typical observations of actual joint performance.

Keywords

Intermetallic alloysNanoindentationPackaging
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 8 , August 2005 , pp. 2161 - 2172
Copyright
Copyright © Materials Research Society 2005

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References

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