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Mechanical properties of helically perforated thin films

Published online by Cambridge University Press:  01 May 2006

S.P. Fernando ,
A.L. Elias  and
M.J. Brett
S.P. Fernando*
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
A.L. Elias
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
M.J. Brett
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The mechanical behavior of a helically perforated thin film structure was simulated by finite element analysis. The validity of the results was confirmed by comparison to a nanoindentation measurement performed on a nickel helically perforated thin film sample. It was found that variation of the helical pitch angle from 35° to 70° resulted in a change of 1.5 times in the elastic modulus. Since the fabrication process used to create the actual samples allows for variation of the pitch angle, this result may enable the tailoring of materials for use in micro- and nanoscale devices.

Keywords

Elastic propertiesNanoscaleSimulation
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 5 , May 2006 , pp. 1101 - 1105
Copyright
Copyright © Materials Research Society 2006

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References

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