Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-24T18:23:28.707Z Has data issue: false hasContentIssue false
  • English
  • Français

Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys

Published online by Cambridge University Press:  31 January 2011

U. Saeed ,
H. Flandorfer  and
H. Ipser
U. Saeed
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
H. Flandorfer*
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
H. Ipser
Affiliation:
Institute of Inorganic Chemistry/Materials Chemistry, University of Vienna, A-1090 Wien, Austria
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Partial and integral enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys were determined at 1000 °C by a drop calorimetric technique using a Calvet type microcalorimeter. They were obtained by adding Ni to the ternary Ag–Cu–Sn alloys with different composition. The data were evaluated by means of an extended Redlich–Kister–Muggianu polynomial fit for substitutional solutions. The minimum and maximum in the quaternary system were also calculated. It was found that the maximum integral enthalpy of mixing (13,310 J/mol at 41 at.% Ag) occurs in the binary Ag–Ni system while the minimum integral enthalpy of mixing (−21,390 J/mol at 61 at.% Ni) occurs in the binary Ni–Sn system. Moreover the experimental data were compared to values calculated by different extrapolation models based on binary data.

Keywords

CalorimetrySolderingLiquid
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 11 , November 2007 , pp. 3218 - 3225
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Wood, E.P.Nimmo, K.L.: In search of new lead-free electronic solders. J. Electron. Mater. 23, 709 1994CrossRefGoogle Scholar
2Jang, J.W., Frear, D.R., Lee, T.Y.Tu, K.N.: Morphology of interfacial reaction between Pb-free solders and electroless Ni(P) under-bump-metallization. J. Appl. Phys. 88, 6359 2000CrossRefGoogle Scholar
3Flandorfer, H., Gehringer, F.Hayer, E.: Individual solutions for control and data acquisition with the PC. Thermochim. Acta 382, 77 2002CrossRefGoogle Scholar
4Dinsdale, A.T.: SGTE data for pure elements. Calphad 15, 317 1991CrossRefGoogle Scholar
5Luef, C., Flandorfer, H.Ipser, H.: Lead-free solder materials: Experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems. Z. Metallkd. 95, 155 2004CrossRefGoogle Scholar
6Saeed, U., Flandorfer, H.Ipser, H.: Lead-free solders: Enthalpies of mixing of liquid alloys in the Ag–Ni and Ag–Ni–Sn systems. J. Mater. Res. 21, 1294 2006CrossRefGoogle Scholar
7Ansara, I.Dupin, N.: Cost 507 Thermochemical data base for light metal Alloys European Commission DG X11 Luxembourg 1998 1Google Scholar
8Luo, H-T.Chen, S.W.: Phase equilibria of the ternary Ag–Cu–Ni system and the interfacial reactions in the Ag–Cu/Ni couples. J. Mater. Sci. 31, 5059 1996CrossRefGoogle Scholar
9Flandorfer, H., Luef, C.Saeed, U.: On the temperature dependence of the enthalpies of mixing in liquid binary (Ag,Cu,Ni)–Sn alloys. J. Non-Cryst. Solids(submitted)Google Scholar
10Fiorani, J.M., Naguet, C., Hertz, J., Bourkba, A.Bouirden, L.: The enthalpy of mixing of the quaternary (In, Pb, Sn, Zn) liquid homogeneous phase. Z. Metallkd. 88, 711 1997Google Scholar
11Luef, C., Flandorfer, H.Ipser, H.: Lead-free solder materials: Experimental enthalpies of mixing of liquid Ag–In–Pd–Sn alloys. Metall. Mater. Trans. A 36, 1 2005CrossRefGoogle Scholar
12Waseda, Y.: The Structure of Non-crystalline Materials McGraw-Hill New York, NY 1980Google Scholar
13Hillert, M.: Empirical methods of predicting and representing thermodynamic properties of ternary solution phases. Calphad 4, 1 1980CrossRefGoogle Scholar
14Kohler, F.: Estimation of the thermodynamic data for a ternary system from the corresponding binary systems. Monatsh. Chem. 91, 738 1960CrossRefGoogle Scholar
15Muggianu, Y.M., Gambino, M.Bros, J.P.: Choices of an analytical representation of integral and partial excess quantities of mixing. J. Chem. Phys. 72, 83 1975Google Scholar
16Toop, G.W.: Predicting ternary activities using binary data. Trans. Met. Soc. AIME 233, 850 1965Google Scholar