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Layered intermetallic compounds and stress evolution in Sn and Ni(P) films

Published online by Cambridge University Press:  31 January 2011

Jae Yong Song
Jae Yong Song
Affiliation:
Division of Advanced Technology, Korea Research Institute of Standards and Science, Yuseong-gu, Daejeon, 305-600, South Korea
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Abstract

In situ measurements of stresses due to the phase transformation in Sn and Ni(P) films were analyzed relating to the formation of layered intermetallic compounds such as Ni3Sn4, Ni3Sn2, Ni3P, and the crystallization of Ni(P) films. When Sn/Ni(11.7P) films were heated up to 480 °C, the first tensile stress developed due to formation of Ni3Sn4 and Ni3P around 220 °C, and the second one appeared at 335 °C due to formation of Ni3Sn2 as well as the self-crystallization of Ni(11.7P). For Sn/Ni(3P), a tensile stress developed mildly with the temperature between 300 and 410 °C due to formation of Ni3Sn2 and precipitation of Ni3P. The onset temperatures of self-crystallization of Ni(P) and Ni3P precipitation decreased due to the Ni–Sn reaction.

Keywords

LayeredPhase transformation
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 7 , July 2007 , pp. 2025 - 2031
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Electroless Plating: Fundamentals and Applications edited by G.O. Mallory and J.B. Hajdu American Electroplaters and Surface Finishers Society, Orlando, FL 1990 59Google Scholar
2Allen, R.M. van der Sande, J.B.: The structure of electroless Ni–P films as a function of composition. Scripta Metall. 16, 1161 1982CrossRefGoogle Scholar
3Song, J.Y. Yu, J.: Residual stress measurements in electroless plated Ni–P films. Thin Solid Films 415, 167 2002CrossRefGoogle Scholar
4Färber, B., Cadel, E., Menand, A., Schmitz, G. Kirchheim, R.: Phosphorus segregation in nanocrystalline Ni-3.6 at.%P alloy investigated with the tomographic atom probe (TAP). Acta Mater. 48, 789 2000CrossRefGoogle Scholar
5Hentschel, T.H., Isheim, D., Kirchheim, R., Müller, F. Kreye, H.: Nanocrystalline Ni-3.6 at.% P and its transformation sequence studied by atom-probe field-ion microscopy. Acta Mater. 48, 933 2000CrossRefGoogle Scholar
6Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R. Thompson, P.: Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 1999CrossRefGoogle Scholar
7Alam, M.O., Chan, Y.C. Hung, K.C.: Interfacial reaction of Pb–Sn solder and Sn–Ag solder with electroless Ni deposit during reflow. J. Electron. Mater. 31, 1117 2002CrossRefGoogle Scholar
8Jeon, Y.D., Paik, K.W., Ostmann, A. Reichl, H.: Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni–P UBMs. J. Electron. Mater. 34, 80 2005CrossRefGoogle Scholar
9Chen, Z., He, M. Qi, G.: Morphology and kinetic study of the interfacial reaction between the Sn–3.5Ag solder and electroless Ni–P metallization. J. Electron. Mater. 33, 1465 2004CrossRefGoogle Scholar
10Chan, Y.C., Tu, P.L., Tang, C.W., Hung, K.C. Lai, J.K.L.: Reliability studies μBGA solder joints-effect of Ni–Sn intermetallic compound. IEEE Trans. Adv. Packag. 24, 25 2001CrossRefGoogle Scholar
11Song, J.Y. Yu, J.: Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films. J. Mater. Res. 21, 2261 2006CrossRefGoogle Scholar
12Song, J.Y., Yu, J. Lee, T.Y.: Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films. J. Mater. Res. 19, 1257 2004CrossRefGoogle Scholar
13Stoney, G.G.: The tension of metallic films deposited by electrolysis. Proc. R. Soc. London Ser. A 82, 172 1909Google Scholar
14Nix, W.D.: Mechanical properties of thin films. Metall. Trans. A 20, 2217 1989CrossRefGoogle Scholar
15Kang, S.K. Ramachandran, V.: Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface. Scripta Metall. 14, 421 1980CrossRefGoogle Scholar
16Bader, S., Gust, W. Hieber, H.: Rapid formation of intermetallic compounds by interdiffusion in the Cu–Sn and Ni–Sn systems. Acta Metall. Mater. 43, 329 1995Google Scholar
17Gur, D. Bamberger, M.: Reactive isothermal solidification in the Ni–Sn system. Acta Mater. 46, 4917 1998CrossRefGoogle Scholar
18Sohn, Y.C., Yu, J., Kang, S.K., Choi, W.K. Shih, D.Y.: Study of reaction mechanism between electroless Ni–P and Sn and its effect on the crystallization of Ni–P. J. Mater. Res. 18, 4 2003CrossRefGoogle Scholar
19Sohn, Y.C., Yu, J., Kang, S.K., Shih, D.Y. Choi, W.K.: Effects of phosphorous content on the reaction of electroless Ni–P with Sn and crystallization of Ni–P. J. Electron. Mater. 33, 790 2004CrossRefGoogle Scholar