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Interfacial-shear strength of the perfluorocyclobutane films on silicon

Published online by Cambridge University Press:  01 July 2006

Srinivasa Rao Boddapati*
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Hong Ma
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Rajendra K. Bordia
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Alex K-Y. Jen
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The debonding behavior of perfluorocyclobutane (PFCB) films on silicon (Si) has been investigated using Vickers indentation as a function of cure temperature and film thickness. PFCB films on Si were processed by spin coating (1–4 μm) and solution casting (20–60 μm). The interfacial shear strength of solution-cast PFCB films was independent of film thickness. The interfacial shear strength increased with cure temperature. The PFCB/Si cured at 225 °C exhibited interfacial shear strength of 123 MPa, and the strength increased to 163 MPa when the cure temperature was raised to 275 °C. The increase in interfacial-shear strength with temperature has been attributed to the increase in the density of bonds between PFCB and Si due to an increase in the density of crosslinks. Spin-coated films exhibited cracking due to the penetration of the indenter into the substrate, and the extent of cracking increased with the load.

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Articles
Copyright
Copyright © Materials Research Society 2006

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References

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