Hostname: page-component-5cf477f64f-2wr7h Total loading time: 0 Render date: 2025-04-07T04:26:52.388Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples

Published online by Cambridge University Press:  01 July 2006

Chin-yi Chou ,
Sinn-wen Chen  and
Yee-shyi Chang
Chin-yi Chou
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
Sinn-wen Chen*
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
Yee-shyi Chang
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Sn–Zn-based alloys are promising low melting-point Pb-free solders, and it has been reported that their wetting properties and oxidation resistance can be improved with the addition of Cu. The interfacial reactions in the Sn–9 wt% Zn–xCu/Cu couples at 250 °C and Sn–9 wt% Zn–xCu/Ni at 280 °C were examined in this study. A thick γ–Cu5Zn8 phase layer and a very thin β′–CuZn phase layer were formed in both the Sn–9 wt% Zn/Cu and the Sn–9 wt% Zn–1 wt% Cu/Cu couples. The γ–Ni5Zn21 phase layer was formed in both the Sn–9 wt% Zn/Ni and Sn–9 wt% Zn–1 wt% Cu/Ni couples. With longer reaction time, the δ–Ni3Sn4 phase were formed in the Sn–9 wt% Zn/Ni couple as well. In both the Cu and Ni couples, the Zn-containing γ phases were uniform and planar and were the dominant reaction products. However, when the Cu content of the Sn–9 wt% Zn–xCu solders was 10 wt%, the interfacial reaction product becomes the η–Cu6Sn5 phase in both the Cu and Ni couples.

Keywords

Interfacial reactionsSnSolder
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 7 , July 2006 , pp. 1849 - 1856
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003: On the restriction of the use of certain hazardous substances in electronic equipment. Official J. Eur. Union L37/19 (2003).Google Scholar
2. Lead-free assembly projects, National Electronics Manufacturing Initiatives (NEMI): Herndon, VA. http://www.nemi.org/projects/ese/lf_assembly.html (1999).Google Scholar
3.Roadmap 2002 for Commercialization of Lead-free Solder, Lead-Free Soldering Roadmap Committee, Technical Standardization Committee on Electronics Assembly Technology, Japan Electronics and Information Technology Industries Association (JEITA), Tokyo, Japan (2002).Google Scholar
4.Loomans, M.E., Vaynman, S., Ghosh, G., Fine, M.E.: Investigation of multi-component lead-free solders. J. Electron. Mater. 23, 741 (1994).CrossRefGoogle Scholar
5.Huang, C.W., Lin, K.L.: Wetting properties of and interfacial reactions in lead-free Sn–Zn based solders on Cu and Cu plated with an electroless Ni–P/Au layer. Mater. Trans. 45, 588 (2004).CrossRefGoogle Scholar
6.Yu, D.Q., Xie, H.P., Wang, L.: Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. J. Alloys Compd. 385, 119 (2004).Google Scholar
7.Chan, Y.C., Chiu, M.Y., Chung, T.H.: Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates. Z. Metallkde. 93(2), 95 (2002).CrossRefGoogle Scholar
8.Suganuma, K., Niihara, K., Shoutoku, T., Nakamura, Y.: Wetting and interface microstructure between Sn–Zn binary alloys and Cu. J. Mater. Res. 13, 2859 (1998).Google Scholar
9.Lee, H.M., Yoon, S.W., Lee, B.J.: Thermodynamic prediction of interface phases at Cu/solder joints. J. Electron. Mater. 27, 1161 (1998).Google Scholar
10.Suganuma, K., Murata, T., Noguchi, H., Toyoda, Y.: Heat resistance of Sn–9Zn solder/Cu interface with or without coating. J. Mater. Res. 15,884 (2000).Google Scholar
11.Huang, C.W., Lin, K.L.: Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. J. Mater. Res. 19(12), 3560 (2004).CrossRefGoogle Scholar
12.Chou, C.Y., Chen, S.W.: Phase equilibria of the Sn–Zn–Cu ternary system. Acta Mater. 54(9), 2393 (2006).Google Scholar
13.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M., Kelley, K.K.: Selected Values of the Thermodynamic Properties of Binary Alloys (American Society for Metals, Washington, DC, 1973), p. 816.Google Scholar
14.Brandes, E.A., Brook, G.B.: Smithells Metals Reference Book (Butterworth Heinemann, Oxford, UK, 1992).Google Scholar
15.Su, L.H., Yen, Y.W., Chen, S.W.: Interfacial reactions in molten Sn/Cu and molten In/Cu couples. Metall. Mater. Trans. 28B, 927 (1997).Google Scholar
16.Gagliano, R.A., Fine, M.E.: Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper. J. Electron. Mater. 32, 1441 (2003).CrossRefGoogle Scholar
17.Chen, S.W., Wu, S.H., Lee, S.W.: Interfacial reactions in the Sn–(Cu)/Ni, Sn–(Ni)/Cu, and Sn/(Cu, Ni) systems. J. Electron. Mater. 32, 1188 (2003).Google Scholar
18.Gorlich, J., Schmitz, G., Tu, K.N.: On the mechanism of the binary Cu/Sn solder reaction. Appl. Phys. Lett. 86, 053106 (2005).Google Scholar
19.Abtew, M., Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95 (2000).Google Scholar
20.Chiu, M.Y., Wang, S.S., Chuang, T.H.: Intermetallic compounds formed during interfacial reactions between liquid Sn–8Zn–3Bi solders and Ni substrate. J. Electron. Mater. 31, 494 (2002).Google Scholar
21.Chen, S.W., Chang, C.A.: Phase equilibria of the Sn–Ag–Cu–Ni quaternary system at the Sn-rich corner. J. Electron. Mater. 33, 1071 (2004).Google Scholar
22.Lin, C.H., Chen, S.W., Wang, C.H.: Phase equilibria and solidification properties of Sn–Cu–Ni alloys. J. Electron. Mater. 31, 907 (2002).Google Scholar