Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Chen, Sinn-Wen
Wang, Chao-Hong
Lin, Shih-Kang
and
Chiu, Chen-Nan
2006.
Phase Diagrams of Pb-Free Solders and their Related Materials Systems.
Journal of Materials Science: Materials in Electronics,
Vol. 18,
Issue. 1-3,
p.
19.
Yang, Ching-Feng
Chen, Sinn-Wen
Wu, Kuan-Hsien
and
Chin, Tsung-Shune
2007.
Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates.
Journal of Electronic Materials,
Vol. 36,
Issue. 11,
p.
1524.
Yen, Yee-wen
and
Liou, Wei-kai
2007.
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate.
Journal of Materials Research,
Vol. 22,
Issue. 10,
p.
2663.
Huang, Yu-chih
Chen, Sinn-wen
Gierlotka, Wojcieh
Chang, Chia-hua
and
Wu, Jen-chin
2007.
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders.
Journal of Materials Research,
Vol. 22,
Issue. 10,
p.
2924.
Chen, Chih-ming
and
Chen, Chih-hao
2007.
Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates.
Journal of Electronic Materials,
Vol. 36,
Issue. 10,
p.
1363.
Chen, Sinn-Wen
Wang, Chao-Hong
Lin, Shih-Kang
and
Chiu, Chen-Nan
2007.
Lead-Free Electronic Solders.
p.
19.
Gierlotka, Wojciech
and
Chen, Sinn-wen
2008.
Thermodynamic descriptions of the Cu–Zn system.
Journal of Materials Research,
Vol. 23,
Issue. 1,
p.
258.
Yen, Yee-Wen
Chou, Weng-Ting
Tseng, Yu
Lee, Chiapyng
and
Hsu, Chun-Lei
2008.
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders.
Journal of Electronic Materials,
Vol. 37,
Issue. 1,
p.
73.
Zhao, Ning
Wang, Jian Hui
Ma, Hai Tao
and
Wang, Lai
2008.
Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering.
Key Engineering Materials,
Vol. 373-374,
Issue. ,
p.
543.
Chen, Chih-Ming
Chen, Chih-Hao
Lin, Chi-Pu
and
Su, Wen-Chiung
2008.
Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface.
Journal of Electronic Materials,
Vol. 37,
Issue. 10,
p.
1605.
Chen, Xi
Hu, Anmin
Li, Ming
and
Mao, Dali
2008.
Study on the properties of Sn–9Zn–xCr lead-free solder.
Journal of Alloys and Compounds,
Vol. 460,
Issue. 1-2,
p.
478.
Kim, Seongjun
Kim, Keun-Soo
Suganuma, Katsuaki
and
Izuta, Goro
2009.
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates.
Journal of Electronic Materials,
Vol. 38,
Issue. 6,
p.
873.
Chen, Chih-ming
Hung, Yu-min
and
Lin, Ching-hsuan
2009.
Electromigration of Sn–8 wt.% Zn–3 wt.% Bi and Sn–9 wt.% Zn–1 wt.% Cu solders.
Journal of Alloys and Compounds,
Vol. 475,
Issue. 1-2,
p.
238.
Zhang, X.F.
Guo, J.D.
and
Shang, J.K.
2009.
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect.
Journal of Electronic Materials,
Vol. 38,
Issue. 3,
p.
425.
Liou, Wei-kai
Yen, Yee-Wen
and
Jao, Chien-Chung
2009.
Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates.
Journal of Electronic Materials,
Vol. 38,
Issue. 11,
p.
2222.
Chen, Chih-hao
Lin, Chi-pu
and
Chen, Chih-ming
2009.
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow.
Journal of Electronic Materials,
Vol. 38,
Issue. 1,
p.
61.
Liu, Lijuan
Zhou, Wei
Li, Baoling
and
Wu, Ping
2009.
Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate.
Journal of Alloys and Compounds,
Vol. 482,
Issue. 1-2,
p.
90.
Yu-chih Huang
Kuang-siang Wu
and
Sinn-wen Chen
2009.
Size and substrate effects upon undercooling of Pb-free solders.
p.
662.
Wang, Chao-hong
and
Chen, Hsien-hsin
2010.
Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C.
Journal of Electronic Materials,
Vol. 39,
Issue. 11,
p.
2375.
Yen, Yee-wen
Tsai, Po-hao
Fang, Yang-kai
Lo, Shao-cheng
Hsieh, Yu-Ping
and
Lee, Chiapyng
2010.
Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates.
Journal of Alloys and Compounds,
Vol. 503,
Issue. 1,
p.
25.