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Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system—Computational simulation and experimental studies

Published online by Cambridge University Press:  11 August 2011

Lei Chen ,
Kong Boon Yeap ,
Kai Yang Zeng ,
Chong Min She  and
Gui Rong Liu
Lei Chen
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576; and Center for Advanced Computations in Engineering Science (ACES), Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Kong Boon Yeap
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Kai Yang Zeng*
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Chong Min She
Affiliation:
Academy of Frontier Science, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Gui Rong Liu
Affiliation:
Center for Advanced Computations in Engineering Science (ACES), Department of Mechanical Engineering, National University of Singapore, Singapore 117576; and Singapore-MIT Alliance (SMA), Singapore, 117576
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The shapes of the interfacial delamination crack and stress states during wedge indentation in a soft-film-on-hard-substrate system were investigated systematically using the three-dimensional (3D) finite element simulation and wedge indentation experiment. In the simulation, a traction–separation law was used to characterize the failure behaviors of the interface. The effects of the wedge indenter tip length and the film thickness on the onset and growth of interfacial delamination were analyzed. It was shown that a two-dimensional (2D) to 3D transition of stress states occurred depending on the ratio of indenter length to film thickness. Furthermore, the interfacial delamination process by wedge indentation was conducted experimentally, and comparisons between the computational and experimental results yielded quantitative good agreement. Finally, a straightforward criterion based on the curvature of the delamination crack front was proposed to indicate the transition of stress states during the interfacial delamination. A guideline was therefore proposed to classify the 2D and 3D stress states for extracting the interface adhesion properties.

Keywords

AdhesionThin filmNanoindentation
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 19 , 14 October 2011 , pp. 2511 - 2523
Copyright
Copyright © Materials Research Society 2011

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