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In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation

Published online by Cambridge University Press:  31 January 2011

Kai-Jheng Wang ,
Yung-Chi Lin ,
Jenq-Gong Duh ,
Ching-Yuan Cheng  and
Jey-Jau Lee
Jenq-Gong Duh*
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
Jey-Jau Lee
Affiliation:
National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

In situ investigation of the interfacial reaction in the Sn/Cu thin film during aging, and reflow was carried out by synchrotron radiation with high intensity and high resolution of x-ray. With this technique, the phase transformation and evolution of the Sn/Cu thin film during heat treatment can be directly and continuously investigated. Moreover, the information for coefficient of thermal expansion in intermetallic compounds was also evaluated by this approach.

Keywords

SolderingPhase transformationX-ray diffraction (XRD)
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 5 , May 2010 , pp. 972 - 975
Copyright
Copyright © Materials Research Society 2010

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References

REFERENCES

1.Pan, C.C., Yu, C.H., Lin, K.L.The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate. Appl. Phys. Lett. 93, 061912 (2008)CrossRefGoogle Scholar
2.Yu, C.H., Lin, K.L.Early stage soldering reaction and interfacial microstructure formed between molten Sn–Zn–Ag solder and Cu substrate. J. Mater. Res. 20, 1242 (2005)CrossRefGoogle Scholar
3.Jackson, G.J., Lu, H., Durairaj, R., Hoo, N., Bailey, C., Ekere, N.N., Wright, J.Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction. J. Electron. Mater. 33, 1524 (2004)CrossRefGoogle Scholar
4.Jang, J.W., Liu, C.Y., Kim, P.G., Tu, K.N., Mal, A.K., Frear, D.R.Interfacial morphology and shear deformation of flip chip solder joints. J. Mater. Res. 15, 1679 (2000)CrossRefGoogle Scholar
5.Chen, K.C., Telang, A., Lee, J.G., Subramanian, K.N.Damage accumulation under repeated reverse stressing of Sn–Ag solder joints. J. Electron. Mater. 31, 1181 (2002)CrossRefGoogle Scholar
6.Lee, T.K., Liu, K.C., Bieler, T.R.Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn–Ag–Cu solder joints. J. Electron. Mater. 38, 2685 (2009)CrossRefGoogle Scholar
7.Jiang, N., Clum, J.A., Chromik, R.R., Cotts, E.J.Thermal expansion of several Sn-based intermetallic compounds. Scr. Mater. 37, 1851 (1997)CrossRefGoogle Scholar
8.Tsai, I., Wu, E., Yen, S.F., Chuang, T.H.Mechanical properties of intermetallic compounds on lead-free solder by Moiré techniques. J. Electron. Mater. 35, 1059 (2006)CrossRefGoogle Scholar
9.Sunwoo, A.J., Morris, J.W., Lucey, G.K.The growth of Cu–Sn intermetallics at pretinned copper-solder interface. Metall. Trans. A 23, 1323 (1992)CrossRefGoogle Scholar
10.Massalski, T.B., Okamoto, H.Binary Alloy Phase Diagrams 2nd ed. (ASM International, Materials Park, OH 1990)1481Google Scholar
11.Peng, W., Monlevade, E., Marques, M.E.Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu. Microelectron. Reliab. 47, 2161 (2007)CrossRefGoogle Scholar