Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-05T04:30:52.587Z Has data issue: false hasContentIssue false
  • English
  • Français

Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating

Published online by Cambridge University Press:  31 January 2011

Katsuaki Suganuma ,
Toshikazu Murata ,
Hiroji Noguchi  and
Yoshitaka Toyoda
Katsuaki Suganuma*
Affiliation:
Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8–1, Ibaraki, Osaka 567–0047, Japan
Toshikazu Murata
Affiliation:
Matsushita Battery Industrial Co., Ltd., Matsushita 1–1, Moriguchi, Osaka 570–8511, Japan
Hiroji Noguchi
Affiliation:
Matsushita Electric Co., Ltd., Matsushita 1–1, Ibaraki, Osaka 567–0026, Japan
Yoshitaka Toyoda
Affiliation:
Senju Metal Industry, Co., Ltd., Yatuka 405, Sohka, Saitama 340–0023, Japan
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The potential of the newly developed Sn–9Zn solder paste as a lead-free solder, especially focusing on the stability at high temperature, was examined. The initial interface strength between Sn–9Zn and Cu, about 50 MPa by the tensile test, is higher than other interfaces such as Sn–37Pb/Cu. While the Sn–9Zn/Cu interface maintains the high strength level after heat exposure at 125 °C, the heat exposure at 150 °C degrades strength seriously. The degradation at 150 °C is caused by dissipation and by disruption of the Cu–Zn reaction layer at the interface. Where the Cu–Zn layer is eroded to form a whole, Sn directly reacts with a Cu substrate to form a thick Sn–Cu reaction region. Such an interfacial morphology change causes the serious degradation. With the Ni/Pd/Au coating on a Cu substrate, the interface becomes much stronger than the direct interface. Even after heat exposure at 150 °C, strength degradation is not so significant. Zn segregates into the coating layer. During high-temperature exposure, Ni and Pd diffuse each other. Zn also diffuses into the coating layer to form compounds, and as a result, a depleted zone of Zn is formed in the solder close to the interface.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 4 , April 2000 , pp. 884 - 891
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.McCormack, M. and Jin, S., JOM 45, 36 (1993).CrossRefGoogle Scholar
2.Melton, C., JOM 45, 33 (1993).CrossRefGoogle Scholar
3.Suganuma, K., Nakamura, Y., and Niihara, K., J. Mater. Res. 13, 2859 (1998).CrossRefGoogle Scholar
4.Wood, E.P. and Nimmo, K.L., J. Electron. Mater. 23, 709 (1994).CrossRefGoogle Scholar
5.Loomans, M.E., Vaynman, S., Gosh, G., and Fine, M.E., J. Electron. Mater. 23, 741 (1994).CrossRefGoogle Scholar
6.Murata, T., Nomura, H., Kishida, S., Taguchi, N., Hiro, T., and Oishi, M., Japanese Patent No. PAJ-09277082 (1997).Google Scholar
7.Suganuma, K. and Nakamura, Y., J. Jpn. Inst. Met. 59, 1299 (1995).CrossRefGoogle Scholar