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Grain growth in ultrathin films of CoPt and FePt

Published online by Cambridge University Press:  31 January 2011

R. A. Ristau ,
K. Barmak ,
K. R. Coffey  and
J. K. Howard
R. A. Ristau
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, Pennsylvania 18015
K. Barmak
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, Pennsylvania 18015
K. R. Coffey
Affiliation:
IBM Storage Systems Division, 5600 Cottle Road, San Jose, California
J. K. Howard
Affiliation:
IBM Storage Systems Division, 5600 Cottle Road, San Jose, California
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Abstract

The microstructure of sputtered 10-nm thin films of equiatomic binary alloys of CoPt and FePt was characterized using transmission electron microscopy (TEM). Grain growth kinetics was examined using manual and digital analysis of bright-field TEM images and was seen to take two stages during annealing in these films. A rapid growth stage concurrent with the formation of a [111] fiber texture was observed to occur within the first 5–10 min of annealing, followed by a much slower growth stage after the fiber texturing was well advanced. Differences in grain growth rate and ultimate grain size were also observed to depend on heating rate.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 8 , August 1999 , pp. 3263 - 3270
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Movchen, and Demchisin, , Fiz. Met. Metalloved. 28(4), 83 (1969).Google Scholar
2.Thornton, J.A., Ann. Rev. Mater. Sci. 7, 239 (1977).CrossRefGoogle Scholar
3.Grovenor, C.R.M, Hentzell, H.T.G, and Smith, D.A., Acta Metall. 32, 773 (1984).CrossRefGoogle Scholar
4.Barna, P.B. and Adamik, M. in Science and Technology of Thin Films, edited by Matacotta, F.C. and Ottaviani, G. (World Scientific, River Edge, NJ, 1995).Google Scholar
5.Thompson, C.V. and Carel, R., Mat. Sci. Eng. B 32, 211 (1995).CrossRefGoogle Scholar
6.Thompson, C.V., Scr. Metall. Mater. 28, 167 (1993).CrossRefGoogle Scholar
7.Sanchez, J.E. and Arzt, E., Scr. Metall. Mater. 27, 285 (1992).CrossRefGoogle Scholar
8.Thompson, C.V., Ann. Rev. Mater. Sci. 20, 245 (1990).CrossRefGoogle Scholar
9.Palmer, J.E., Thompson, C.V., and Smith, H.I., J. Appl. Phys. 62, 2492 (1987).CrossRefGoogle Scholar
10.Wong, C.C., Smith, H.I., Thompson, C.V., Appl. Phys. Lett. 48, 335 (1986).CrossRefGoogle Scholar
11.Longworth, H.P. and Thompson, C.V., J. Appl. Phys. 69, 3929 (1991).CrossRefGoogle Scholar
12.Burke, J.E., Trans. AIME 180, 73 (1949).Google Scholar
13.Mullins, W.W., J. Appl. Phys. 28, 333 (1957).CrossRefGoogle Scholar
14.Mullins, W.W., Acta Metall. 6, 414 (1958).CrossRefGoogle Scholar
15.Frost, H.J., Thompson, C.V., and Walton, D.T., Acta Metall. Mater. 38, 1455 (1990).CrossRefGoogle Scholar
16.Frost, H.J., Mater. Char. 32, 257 (1994).CrossRefGoogle Scholar
17.Zeng, Y., Alford, T.L., Zou, Y.L., Amali, A., Ullrich, B.M., Deng, F., and Lau, S.S., J. Appl. Phys. 83, 779 (1998).CrossRefGoogle Scholar
18.Rha, S.K., Lee, W.J., Lee, S.Y., Kim, D.W., Park, C.O., J. Mater. Sci.: Mater. in Elec. 8, 217 (1997).Google Scholar
19.Zielinski, E.M., Vinci, R.P., and Bravman, J.L., J. Appl. Phys. 76, 4516 (1994).CrossRefGoogle Scholar
20.Ristau, R.A., Barmak, K., Lewis, L.H., Coffey, K.R., and Howard, J.K. (unpublished).Google Scholar
21.Tang, L., Laughlin, D.E., J. Appl. Cryst. 29, 411 (1996).CrossRefGoogle Scholar
22.Pashley, D.W., Stowell, M.J., Phil. Mag. 8, 1605 (1963).CrossRefGoogle Scholar