Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-24T16:53:47.176Z Has data issue: false hasContentIssue false
  • English
  • Français

Fracture of SnBi/Ni(P) interfaces

Published online by Cambridge University Press:  01 April 2005

P.L. Liu  and
J.K. Shang
P.L. Liu
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
J.K. Shang*
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Fracture resistance of the interface between electroless Ni(P) and the eutectic SnBi solder alloy was examined in the as-reflowed and aged conditions, to investigate the potential role of Ni in inhibiting interfacial segregation of Bi in SnBi–Cu interconnect. In the as-reflowed condition, the fracture resistance of the SnBi/Ni(P) interface was about the same as that of the SnBi/Cu interface. Upon aging at 120 °C for 7 days the fracture resistance of the SnBi/Ni(P) interface was much higher than that of the SnBi/Cu interface. Such a difference was shown to result from the difference in fracture mechanism as the crack remained along the solder–intermetallic interface in the aged SnBi–Ni interconnect but propagated along the intermetallic–substrate interface in the aged SnBi–Cu interconnect. While fracture of the intermetallic–substrate interface in SnBi–Cu interconnect was due to Bi segregation onto that interface, no Bi was detected at the intermetallic-substrate interface in SnBi–Ni interconnects, implying that Ni(P) was effective in inhibiting the interfacial segregation of Bi.

Keywords

FractureMicrostructurePackaging
Type
Research Article
Information
Journal of Materials Research , Volume 20 , Issue 4 , April 2005 , pp. 818 - 826
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hua, F., Mei, Z.C., and Glazer, J.: Eutectic Sn–Bi as an alternative to Pb-free solders, in Proceedings—Electronic Components and Technology Conference (1998), p. 277.Google Scholar
2. Vianco, P.T., Kilgo, A.C. and Grant, R.: Intermetallic compound layer growth by solid state reactions between 58Bi–42Sn solder and copper. J. Electron. Mater. 24, 1493 (1995).CrossRefGoogle Scholar
3. Miao, H.W. and Buh, J.G.: Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging. Mater. Chem. Phys. 71, 255 (2001).CrossRefGoogle Scholar
4. Hwang, C.W., Lee, J.G., Suganuma, K. and Mori, H.: Interfacial microstructure between Sn–3Ag–xBi alloy and Cu substrate with or without electrolytic Ni plating. J. Electron. Mater. 32, 52 (2003).CrossRefGoogle Scholar
5. Glazer, J.: Metallurgy of low temperature Pb-free solders for electronic assembly. Int. Mater. Rev. 40, 65 (1995).CrossRefGoogle Scholar
6. Mei, Z., Morris, J.W. Jr.: Characterization of eutectic Sn–Bi solder joints. J. Electron. Mater. 21, 599 (1992).CrossRefGoogle Scholar
7. Tomlinson, W.J. and Collier, I.J.: The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder. J. Mater. Sci. 22, 1835 (1987).CrossRefGoogle Scholar
8. Felton, L.E., Raeder, C.H. and Knorr, D.B.: The properties of tin-bismuth alloy solders. J. Metals 45, 28 (1993).Google Scholar
9. Guan, Z.M., Liu, G.X. and Liu, T.: Kinetics of interface reaction in 40Sn–Bi/Cu and 40Sn–Bi-2Ag/Cu systems during aging in solid state. IEEE Trans. Adv. Packaging 23, 737 (2000).Google Scholar
10. Liu, P.L. and Shang, J.K.: Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect. Scripta Mater. 44, 1019 (2001).CrossRefGoogle Scholar
11. Liu, P.L. and Shang, J.K.: Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect. J. Mater. Res. 16, 1651 (2001).CrossRefGoogle Scholar
12. Lin, K.L. and Lee, C.Y.: Preparation of solder bumps incorporation electroless nickel-boron deposit and investigation on the interfacial interaction behavior and wetting kinetics. J. Mater. Sci. Electron. 8, 377 (1997).CrossRefGoogle Scholar
13. Lee, C.Y. and Lin, K.L.: The interaction kinetics and compound formation between electroless Ni–P and solder. Thin Solid Films 249, 201 (1994).CrossRefGoogle Scholar
14. Tomlinson, W.J. and Rhodes, H.G.: Kinetics of intermetallic compound growth between nickel, electroless Ni–P, electroless Ni–B and tin at 453 to 493 K. J. Mater. Sci. 22, 1769 (1987).CrossRefGoogle Scholar
15. Tu, K.N. and Zheng, K.: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).CrossRefGoogle Scholar
16. Yoon, J.W., Lee, C.B. and Jong, S.B.: Growth of an intermetallic compound layer with Sn–3.5Ag–5Bi on Cu and Ni-P/Cu during aging treatment. J. Electron. Mater. 32, 1195 (2003).CrossRefGoogle Scholar
17. Mallory, G.O. and Hajdu, J.B.: Electroless Plating, Fundamentals and Application (Noyes Publications, Park Ridge, NJ, 1990).Google Scholar
18. Riedel, W.: Electroless Nickel Plating (Finishing Publications, Herts, U.K., 1991).Google Scholar
19. Dennis, J.K. and Such, T.E.: Nickel and Chromium Plating, (University Press, Cambridge, U.K., 1986).Google Scholar
20. Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R. and Thompson, P.: Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 (1999).CrossRefGoogle Scholar
21. Liu, P.L., Xu, Z. and Shang, J.K.: Thermal stability of electroless-nickel/solder interface: Part A. Interfacial chemistry and microstructure. Metall. Mater. Trans. 31A, 2857 (2000).CrossRefGoogle Scholar
22. Young, B.Y. and Duh, J.G.: Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn-58Bi solder during annealing. J. Electron. Mater. 30, 878 (2001).CrossRefGoogle Scholar
23. Huang, C.S., Yeh, J.H., Young, B.L. and Duh, J.G.: Phenomena of electroless Ni–P and intermetallic-compound stripping and dissolving in Sn–Bi and Sn–Pb solder joints with Au/EN/Cu metallization. J. Electron. Mater. 31, 1230 (2002).CrossRefGoogle Scholar
24. Alam, M.O., Chan, Y.C. and Tu, K.N.: Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 94, 4108 (2003).CrossRefGoogle Scholar
25. Song, J.Y., Yu, J. and Lee, T.Y.: Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films. J. Mater. Res. 19, 1257 (2004).CrossRefGoogle Scholar
26. Duchenko, O.V. and Dybkov, V.I.: Determination of NiBi3 reaction-diffusion constants in Ni-Bi couples. J. Mater. Sci. Lett. 14, 1725 (1995).CrossRefGoogle Scholar
27. Lee, M.S., Liu, C.M. and Kao, C.R.: Interfacial reactions between Ni substrate and the component Bi in solder. J. Electron. Mater. 23, 57 (1999).CrossRefGoogle Scholar
28. Lee, J.I., Chen, S.W., Chang, H.Y. and Chen, C.M.: Reactive wetting between molten Sn–Bi and Ni substrate. J. Electron. Mater. 32, 117 (2003).CrossRefGoogle Scholar
29. Zhang, Z. and Shang, J.K.: Subcritical crack growth at bimaterial interfaces: Part I. Flexural peel technique. Metall. Mater. Trans. 27A, 205 (1996).CrossRefGoogle Scholar
30. Yao, D. and Shang, J.K.: Effect of aging on fatigue crack growth at Sn-Pb/Cu interfaces. Metall. Mater. Trans. 26A, 2677 (1995).CrossRefGoogle Scholar
31. Frear, D.R. and Vianco, P.T.: Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys. Metall. Mater. Trans. 25A, 1509 (1994).CrossRefGoogle Scholar
32. Sunwoo, A.J., Morris, J.W. Jr., Lucey, G.K. Jr.: The growth of Cu–Sn intermetallics at a pretinned copper-solder interface. Metall. Mater. Trans. 23A, 1323 (1992).CrossRefGoogle Scholar
33. Powell, B.D. and Mykura, H.: The segregation of bismuth to grain boundaries in copper-bismuth alloys. Acta Mater. 21, 1151 (1973).CrossRefGoogle Scholar
34. Alber, U., Mullejans, H. and Ruhle, M.: Bismuth segregation at copper grain boundaries. Acta Mater. 47, 4047 (1999).CrossRefGoogle Scholar
35. Chang, L.S., Rabkin, E., Hofmann, S. and Gust, W.: Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys. Acta Mater. 47, 2951 (1999).CrossRefGoogle Scholar
36. Hondros, E.D. and Seah, M.P.: Segregation to interfaces. Int. Metal Rev. 22, 262 (1977).CrossRefGoogle Scholar
37. Seah, M.P. and Lea, C.: Surface segregation and its relation to grain boundary segregation. Philos. Mag. 31, 627 (1975).CrossRefGoogle Scholar
38. Hondros, E.D. and McLean, D.: Surface Phenomena of Metals (Society of Chemical Industry, London, U.K., 1968).Google Scholar
39. Miedema, A.R. and Dorleijn, J.W.F.: Quantitative predictions of the heat of adsorption of metals on metallic substrates. Surf. Sci. 95, 447 (1980).CrossRefGoogle Scholar
40. Balluffi, R.W.: in Interfacial Segregation, edited by Johnson, W.C. and Blakely, J.M. (Metals Park, OH, 1977), p. 193.Google Scholar