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Formation of Metallic Nanowires by Utilizing Electromigration

Published online by Cambridge University Press:  03 March 2011

M. Saka*
Affiliation:
Department of Nanomechanics, Graduate School of Engineering, Tohoku University, Aoba-ku, Sendai 980-8579, Japan
R. Ueda
Affiliation:
Department of Nanomechanics, Graduate School of Engineering, Tohoku University, Aoba-ku, Sendai 980-8579, Japan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

A technique for forming metallic nanowires by utilizing electromigration, which is the phenomenon of atomic diffusion due to high current densities, is presented. These diffused atoms can be used for creating metallic nanowires. To specify the position at which a nanowire is formed, some specific conditions need to be established. These conditions are, first, to control the atomic diffusion so the accumulation of atoms produces the desired higher compressive stress; second, to design the structure to control the areas in which diffusion takes place; third, to adjust the thickness of the passivation layer deposited on the metal; and fourth, to form a small slot in the passivation layer through which the compressive stress is released by discharging the diffused atoms. It is shown that when these factors are satisfied, an Al nanowire can be successfully generated in a passivated metal track composed of an Al line buried in a W line.

Type
Articles
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1Büttiker, M., Imry, T., Landauer, R. and Pinhas, S.: Generalized many-channel conductance formula with application to small rings. Phys. Rev. B31, 6207 (1985).CrossRefGoogle Scholar
2Van Wees, B.J., Van Houten, H., Beenakker, C.W.J., Williamson, J.G., Kouwenhoven, L.P., Van der Marel, D. and Foxon, C.T.: Quantized conductance of point contacts in a two-dimensional electron gas. Phys. Rev. Lett. 60, 848 (1988).Google Scholar
3ITRS, International Technology Roadmap for Semiconductors, Austin, TX, (2004).Google Scholar
4Kizuka, T., Umehara, S. and Fujisawa, S.: Metal-insulator transition in stable one-dimensional arrangements of single gold atoms. Jpn. J. Appl. Phys. 40, L71 (2001).CrossRefGoogle Scholar
5Davis, Z.J., Adaval, G., Hansen, O., Borisé, X., Barniol, N., Pérez-Murano, F. and Boisen, A.: AFM lithography of aluminum for fabrication of nanomechanical systems. Ultramicroscopy 97, 467 (2003).Google Scholar
6Ho, P.S. and Kwok, T.: Electromigration in metals. Rep. Prog. Phys. 52, 301 (1989).Google Scholar
7Böhm, J., Volkert, C.A., Mönig, R., Balk, T.J. and Arzt, E.: Electromigration-induced damage in bamboo Al interconnects. J. Electron. Mater. 31, 45 (2002).Google Scholar
8Lee, B-Z. and Lee, D.N.: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, 3701 (1998).Google Scholar
9Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., MacDowell, A.A., Bong, Y.Y. and Nguyen, L.: Tin whiskers studied by synchrotron radiation scanning x-ray micro-diffraction. Acta Mater. 51, 6253 (2003).Google Scholar
10Huang, M.H., Wu, Y., Feick, H., Tran, N., Weber, E. and Yang, P.: Catalytic growth of zinc oxide nanowires by vapor transport. Adv. Mater. 13, 113 (2001).Google Scholar
11Makita, Y., Ikai, O., Hosokawa, J., Ookubo, A. and Ooi, K.: Preparation of long silver nanowires from silver matrix by electron beam irradiation. Chem. Lett. 31, 928 (2002).Google Scholar
12Makita, Y., Ikai, O., Hosokawa, J. and Ooi, K.: Synthesis of long silver nanowires by electron beam irradiation on Ag-exchanged material. J. Ion Exchange 14(Suppl.), 409 (2003).Google Scholar
13Ying, Z., Wan, Q., Song, Z.T. and Feng, S.L.: Controlled synthesis of branched SnO2 nanowhiskers. Mater. Lett. 59, 1670 (2005).CrossRefGoogle Scholar
14Li, C., Yang, X., Yang, B., Yan, Y. and Qian, Y.: A template-free oxide reduction route to silver nanowires. Mater. Lett. 59, 1409 (2005).CrossRefGoogle Scholar
15Yang, Q., Sha, J., Ma, X. and Yang, D.: Synthesis of NiO nanowires by a sol-gel process. Mater. Lett. 59, 1967 (2005).Google Scholar
16Lloyd, J.R., Smith, P.M. and Prokop, G.S.: The role of metal and passivation defects in electromigration-induced damage in thin film conductors. Thin Solid Films 93, 385 (1982).CrossRefGoogle Scholar
17Blech, I.A.: Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47, 1203 (1976).CrossRefGoogle Scholar
18Hu, C-K., Small, M.B. and Ho, P.S.: Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation. J. Appl. Phys. 74, 969 (1993).Google Scholar
19Lloyd, J.R. and Smith, P.M.: The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductors. J. Vac. Sci. Technol. A1, 455 (1983).CrossRefGoogle Scholar
20Doan, J.C., Lee, S., Lee, S-H., Flinn, P.A. and Bravman, J.C.: Effects of dielectric materials on electromigration failure. J. Appl. Phys. 89, 7797 (2001).CrossRefGoogle Scholar
21Sasagawa, K., Hasegawa, M., Naito, K., Saka, M. and Abé, H.: Effects of corner position and operating condition on electromigration failure in angled bamboo lines without passivation layer. Thin Solid Films 401, 255 (2001).CrossRefGoogle Scholar
22Sasagawa, K., Hasegawa, M., Saka, M. and Abé, H.: Prediction of electromigration failure in passivated polycrystalline line. J. Appl. Phys. 91, 9005 (2002).Google Scholar