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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Published online by Cambridge University Press:  11 February 2011

Kiju Lee ,
Keun-Soo Kim ,
Yutaka Tsukada ,
Katsuaki Suganuma ,
Kimihiro Yamanaka ,
Soichi Kuritani  and
Minoru Ueshima
Kiju Lee*
Affiliation:
Graduate School of Engineering, Osaka University, Ibaraki, Osaka 567-0047, Japan
Keun-Soo Kim
Affiliation:
Institute of Science and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
Yutaka Tsukada
Affiliation:
Institute of Science and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
Katsuaki Suganuma
Affiliation:
Institute of Science and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
Kimihiro Yamanaka
Affiliation:
Kyocera SLC Technologies Corporation, Advanced Packaging Laboratory, Yasu, Shiga 520-2362, Japan
Soichi Kuritani
Affiliation:
Espec Corporation, Electronic Device System Sales Engineering Department, Kita Ward, Osaka 530-8550, Japan
Minoru Ueshima
Affiliation:
Senju Metal Industry Co., Ltd., Senjuhasidocho, Tokyo 270-0021, Japan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Electromigration behavior and fast circuit failure with respect to crystallographic orientation of Sn grains were examined. The test vehicle was Cu/Sn–3.0 wt% Ag–0.5 wt% Cu/Cu ball joints, and the applied current density was 15 kA/cm2 at 160 °C. The experimental results indicate that most of the solder bumps show different microstructural changes with respect to the crystallographic orientation of Sn grains. Fast failure of the bump occurred due to the dissolution of the Cu circuit on the cathode side caused by the fast interstitial diffusion of Cu atoms along the c-axis of the Sn grains when the c-axis was parallel to the electron flow. Slight microstructural changes were observed when the c-axis was perpendicular to the electron flow. In addition, Cu6Sn5 intermetallic compound (IMC) was formed along the direction of the c-axis of the Sn grains instead of the direction of electron flow in all solder ball joints.

Keywords

ElectromigrationCrystallographic structureSn
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 3 , 14 February 2011 , pp. 467 - 474
Copyright
Copyright © Materials Research Society 2011

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