Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Chen, Sinn-wen
and
Lin, Shih-kang
2006.
Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions.
Journal of Materials Research,
Vol. 21,
Issue. 12,
p.
3065.
Chen, Sinn-wen
Wang, Chao-hong
Lin, Shih-kang
Chiu, Chen-nan
and
Chen, Chih-chi
2007.
Phase transformation and microstructural evolution in solder joints.
JOM,
Vol. 59,
Issue. 1,
p.
39.
Yen, Yee-Wen
Liou, Wei-Kai
Wei, Hong-Yao
and
Lee, Chiapyng
2009.
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.
Journal of Electronic Materials,
Vol. 38,
Issue. 1,
p.
93.
Lin, Shih-kang
Chen, Kuen-da
Chen, Hao
Liou, Wei-kai
and
Yen, Yee-wen
2010.
Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions.
Journal of Materials Research,
Vol. 25,
Issue. 12,
p.
2278.
Chen, Sinn-wen
Hsu, Che-wei
Lin, Shih-kang
and
Hsu, Chia-ming
2013.
Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples.
Journal of Materials Research,
Vol. 28,
Issue. 23,
p.
3257.
Lin, Shih-kang
Hsu, Che-wei
Chen, Sinn-wen
and
Hsu, Chia-ming
2013.
Interfacial reactions in Sn–20In–2.8Ag/Cu couples.
Materials Chemistry and Physics,
Vol. 142,
Issue. 1,
p.
268.
Lin, Shih-Kang
Chang, Ru-Bo
Chen, Sinn-Wen
Tsai, Ming-Yueh
and
Hsu, Chia-Ming
2014.
Effects of zinc on the interfacial reactions of tin–indium solder joints with copper.
Journal of Materials Science,
Vol. 49,
Issue. 10,
p.
3805.
Lin, Shih-kang
Wang, Yu-hsiang
and
Kuo, Hui-chin
2015.
Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C.
Intermetallics,
Vol. 58,
Issue. ,
p.
91.
Lin, Shih-kang
Chang, Ru-Bo
Chen, Sinn-wen
Tsai, Ming-yueh
and
Hsu, Chia-ming
2015.
Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates.
Materials Chemistry and Physics,
Vol. 154,
Issue. ,
p.
60.
Zhou, Shiqi
Yang, Chih-han
Lin, Shih-kang
AlHazaa, Abdulaziz N.
Mokhtari, Omid
Liu, Xiangdong
and
Nishikawa, Hiroshi
2019.
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy.
Materials Science and Engineering: A,
Vol. 744,
Issue. ,
p.
560.
Dreval, Liya
and
Watson, Andrew
2021.
In-Ni-Sn Ternary Phase Diagram Evaluation.
MSI Eureka,
Vol. 89,
Issue. ,
p.
10.17913.1.1.
Yang, Chih-han
Liu, Yu-chen
Hirata, Yuki
Nishikawa, Hiroshi
and
Lin, Shih-kang
2021.
High-Strength Sn-Bi-Based Low-Temperature Pb-Free Solders with High Toughness Designed with the Guidance of High-Throughput Thermodynamic Modeling.
SSRN Electronic Journal ,
Yang, Chih-han
Liu, Yu-chen
Hirata, Yuki
Nishikawa, Hiroshi
and
Lin, Shih-kang
2021.
On the Design of Sn-Bi-Ag-In and Sn-Bi-Ag-Zn Low-Temperature Pb-Free Solders Using High-Throughput CALPHAD Modeling and Key Experiments.
SSRN Electronic Journal ,
Yang, Chih-Han
Liu, Yu-Chen
Hirata, Yuki
Nishikawa, Hiroshi
and
Lin, Shih-Kang
2022.
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders.
p.
37.
Yang, Chih-han
Liu, Yu-chen
Hirata, Yuki
Nishikawa, Hiroshi
and
Lin, Shih-kang
2022.
High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1.
Science and Technology of Welding and Joining,
Vol. 27,
Issue. 7,
p.
572.
Lin, Shih-Kang
Yang, Chih-Han
Liu, Yu-Chen
Hirata, Yuki
and
Nishikawa, Hiroshi
2023.
How to enhance Sn-Bi low-temperature solder by alloying?.
p.
53.