Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-24T16:28:07.706Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of various deposition parameters on the co-deposition behavior of cobalt antimony in citric-based solution

Published online by Cambridge University Press:  31 January 2011

H. Cheng ,
H.H. Hng ,
J. Ma  and
X.J. Xu
H. Cheng*
Affiliation:
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798
H.H. Hng*
Affiliation:
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798
J. Ma
Affiliation:
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798
X.J. Xu
Affiliation:
Department of Engineering Materials, University of Sheffield, Sheffield S1 3JD, United Kingdom
*
a)Address all correspondence to these authors. e-mail: [email protected]
b)Address all correspondence to these authors. e-mail: [email protected]
Get access

Abstract

Direct current (dc) electrodeposition was used to co-deposit cobalt and antimony in citric-based solutions. Growth behavior of Co–Sb alloy thin films was systematically studied under various deposition conditions. Effects of deposition parameters (i.e., deposition potential, cobalt sulfate concentration, and pH value) on the microstructure, chemical, and phase composition of the deposited materials were also studied and are discussed in detail.

Keywords

Chemical compositionElectrodepositionMorphology
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 11 , November 2008 , pp. 3013 - 3020
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Tritt, T.M., Böttner, H., Chen, L.D.: Thermoelectrics: Direct solar thermal energy conversion. MRS Bull. 33, 366 2008CrossRefGoogle Scholar
2Tritt, T.M., Subramanian, M.A.: Thermoelectric materials, phenomena, and applications: A bird’s eye view. MRS Bull. 31, 188 2006Google Scholar
3Lin, Y.M., Dresselhaus, M.S.: Thermoelectric properties of superlattice nanowires. Phys. Rev. B 68, 0753041 2003CrossRefGoogle Scholar
4Dresselhaus, M.S., Chen, G., Tang, M.Y., Yang, R.G., Lee, H., Wang, D.Z., Ren, Z.F., Fleurial, J-P., Gogna, P.: New directions for low-dimensional thermoelectric materials. Adv. Mater. 19, 1043 2007Google Scholar
5Böttner, H., Chen, G., Venkatasubramanian, R.: Aspects of thin-film superlattice thermoelectric materials, devices, and applications. MRS Bull. 31, 211 2006Google Scholar
6Ghamaty, S., Bass, J.C., Elsner, N.B.: Quantum well thermoelectric devices and applications in Proceedings of the 22nd International Conference on Thermoelectrics, (La Grande Motte, France, August 17–21, 2003), p. 563Google Scholar
7Snyder, G.J., Lim, J.R., Huang, C.K., Fleurial, J.P.: Thermoelectric microdevice fabricated by a MEMS-like electrochemical process. Nat. Mater. 2, 528 2003Google Scholar
8Berkh, O., Rosenberg, Yu., Shacham-Diamand, Y., Gileadi, E.: Deposition of CoPtP films from citric electrolyte. Microelectron. Eng. 84, 2444 2007Google Scholar
9Park, D.Y., Park, K.S., Ko, J.M., Cho, D.H., Lim, S.H., Kim, W.Y., Yoo, B.Y., Myung, N.V.: Electrodeposited Ni1−xCox nanocrystalline thin films structure–property relationships. J. Electrochem. Soc. 153, C814 2006Google Scholar
10Baskaran, I., Narayanan, T.S.N. Sankara, Stephen, A.: Pulsed electrodeposition of nanocrystalline Cu–Ni alloy films and evaluation of their characteristic properties. Mater. Lett. 60, 1990 2006CrossRefGoogle Scholar
11Savall, C., Rebere, C., Sylla, D., Gadouleau, M., Refait, Ph., Creus, J.: Morphological and structural characterisation of electrodeposited Zn–Mn alloys from acidic chloride bath. Mater. Sci. Eng., A 430, 165 2006CrossRefGoogle Scholar
12Behnke, J.F.: Fabrication of thermoelectric wire-matrix composites using electrodeposition. Ph.D. Dissertation, University of California—Berkeley, 2000Google Scholar
13Seguin, H.: The investigation of the electrodeposition of antimony-cobalt alloys using pulse plating. M.Sc. Dissertation, Laurentian University, Sudbury, Ontario, Canada, 1993Google Scholar
14Sadana, Y.N., Kumar, R.: Electrodeposition of alloys. X. Electrodeposition of Sb–Co alloys. Surf. Technol. 11, 37 1980CrossRefGoogle Scholar
15Wen, S., Corderman, R.R., Seker, F., Zhang, A.P., Denault, L., Blohm, M.L.: Kinetics and initial stages of bismuth telluride electrodeposition. J. Electrochem. Soc. 153, C595 2006Google Scholar
16Cheng, H., Hng, H.H., Ma, J.: A study on the electrodeposition behavior of cobalt antimonides in citric based solutions. Solid State Phenom. 136, 75 2008Google Scholar
17Bozzini, B., Mele, C., D’urzo, L., Giovannelli, G., Natali, S.: A non-linear AC spectrometry study of the electrodeposition of Cu from acidic sulphate solutions in the presence of PEG. J. Appl. Electrochem. 36, 789 2006CrossRefGoogle Scholar
18Fang, J.: Electroplating of Multi-component Complexed Compounds Defense Industry Press Beijing 1983Google Scholar
19Zhou, Z.H., Deng, Y.F., Wan, H.L.: Structural diversities of cobalt(II) coordination polymers with citric acid. Cryst. Growth Des. 5, 1109 2005Google Scholar