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Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Published online by Cambridge University Press:  31 January 2011

M.H. Tsai ,
Y.W. Lin ,
H.Y. Chuang  and
C.R. Kao
M.H. Tsai*
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Y.W. Lin
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
H.Y. Chuang
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
C.R. Kao*
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
*
a) Address all correspondence to this author. e-mail: [email protected]
b) This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/jmr_policy
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Abstract

The massive spalling of Cu3Sn in the soldering reaction between high-Pb solders and Cu substrates was studied to identify the mechanism behind this rather interesting and frequently observed phenomenon. Four different alloys (99.5 Pb 0.5 Sn, 99 Pb 1S n, 97 Pb 3 Sn, and 95 Pb 5 Sn, in wt%) were soldered at 350 °C for durations ranging from 10 s to 600 min. At low Sn concentration (0.5 or 1 Sn), massive spalling occurred as early as 20 min. However, at high Sn concentration (3 or 5 Sn), massive spalling was not completed even after 600 min. To the best of our knowledge, these results are the most detailed observations ever reported on the sequence of events that occur during massive spalling. The Pb–Sn–Cu phase diagram is used to rationalize the phenomenon.

Keywords

CompoundDiffusionSoldering
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 11 , November 2009 , pp. 3407 - 3411
Copyright
Copyright © Materials Research Society 2009

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