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Effect of oxide and nitride films on strength of silicon: A study using controlled small-scale flaws

Published online by Cambridge University Press:  01 December 2004

Yeon-Gil Jung ,
Antonia Pajares  and
Brian R. Lawn
Yeon-Gil Jung
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8500
Antonia Pajares
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8500
Brian R. Lawn*
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8500
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Strength properties of silicon substrates containing dense oxide and nitride surface films are investigated using nanoindentations to introduce small flaws of predetermined scale. The indentation flaws provide favored sites for failure in subsequent flexure loading, even in the subthreshold region for indentations without visible corner cracking, confirming that microflaws generated within the indentation zone act as effective crack sources in the substrate. Deposition of the oxide films increases the strength while the nitride films diminish it at any given indentation load. The strength shifts are attributed primarily to the presence of residual compressive stress in the oxide, tensile stress in the nitride. A fracture mechanics formulation based on a previous analysis for monolithic substrates is here adapted to allow for a superposed crack closing or opening stress-intensity factor term associated with the residual stresses. Allowance is also made in the mechanics for the influence of the film on effective hardness and modulus of the substrate. The formulation accounts for the basic strength shifts and enables evaluation of the magnitude of the residual stresses. The results quantify the susceptibility of basic device materials to damage from small-scale contacts and impacts.

Keywords

NanoindentationStrengthThin film
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 12 , December 2004 , pp. 3569 - 3575
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1Sargent, P.M. in Micro Indentation Hardness Testing, edited by Blau, P.J. and Lawn, B.R. (ASTM Special Technical Publication 899 ASTM, Philadelphia, PA, 1986), pp. 160–174Google Scholar
2Burnett, P.J. and Rickerby, D.S.: The mechanical properties of wear-resistant coatings. I. Modeling of hardness behavior. Thin Solid Films 148, 41 (1987).CrossRefGoogle Scholar
3Burnett, P.J. and Rickerby, D.S.: The mechanical properties of wear-resistant coatings. II. Experimental studies and interpretation of hardness. Thin Solid Films 148, 51 (1987).CrossRefGoogle Scholar
4Bhattacharya, A.K. and Nix, W.D.: Analysis of elastic and plastic deformation associated with indentation testing of thin films on substrates. Int. J. Solids Struct. 24, 1287 (1988).CrossRefGoogle Scholar
5Gao, H., Chiu, C-H. and Lee, J.: Elastic contact versus indentation modelling of multi-layered materials. Int. J. Solids Struct. 29, 2471 (1992).Google Scholar
6Larsson, P-L. and Peterson, I.R.M.: Evaluation of sharp indentation testing of thin films and ribbons on hard substrates. J. Test. Eval. 30, 64 (2002).CrossRefGoogle Scholar
7Tsui, T.Y., Ross, C.A. and Pharr, G.M.: A method for making substrate-independent hardness measurements of soft metallic films on hard substrates by nanoindentation. J. Mater. Res. 18, 1383 (2003).CrossRefGoogle Scholar
8Bhushan, B.: Nanomechanical characterization of solid surfaces and thin films. Int. Mater. Rev. 48, 125 (2003).CrossRefGoogle Scholar
9Perriot, A. and Barthel, E.: Elastic contact to a coated half-space: Effective elastic modulus and real penetration. J. Mater. Res. 19, 600 (2004).CrossRefGoogle Scholar
10Jung, Y-G., Lawn, B.R., Martyniuk, M., Huang, H. and Hu, X.: Evaluation of elastic modulus and hardness of thin films by nanoindentation. J. Mater. Res. 19, 3076 (2004).CrossRefGoogle Scholar
11Pajares, A., Chumakov, M. and Lawn, B.R.: Strength of silicon containing nanoscale flaws. J. Mater. Res. 19, 657 (2004).CrossRefGoogle Scholar
12Jung, Y-G., Pajares, A., Banerjee, R. and Lawn, B.R.: Strength of silicon, sapphire and glass in the subthreshold flaw region. Acta Mater. 52, 3459 (2004).CrossRefGoogle Scholar
13Freund, L.B. and Suresh, S.: Thin Film Materials: Stress, Defect Formation and Surface Evolution (Cambridge University Press, Cambridge, U.K., 2004)CrossRefGoogle Scholar
14Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
15Chai, H., Lawn, B.R. and Wuttiphan, S.: Fracture modes in brittle coatings with large interlayer modulus mismatch. J. Mater. Res. 14, 3805 (1999).CrossRefGoogle Scholar
16Rhee, Y-W., Kim, H-W., Deng, Y. and Lawn, B.R.: Contact-induced damage in ceramic coatings on compliant substrates: Fracture mechanics and design. J. Am. Ceram. Soc. 84, 1066 (2001).CrossRefGoogle Scholar
17Miranda, P., Pajares, A., Guiberteau, F., Deng, Y. and Lawn, B.R.: Designing damage-resistant brittle-coating structures: I. Bilayers. Acta Mater. 51, 4347 (2003).CrossRefGoogle Scholar
18Fischer-Cripps, A.C.: Nanoindentation (Springer-Verlag, New York, NY 2002)Google Scholar
19Lawn, B.R., Dabbs, T.P. and Fairbanks, C.J.: Kinetics of shear-activated indentation crack initiation in soda-lime glass. J. Mater. Sci. 18, 2785 (1983).CrossRefGoogle Scholar
20Chan, H.M. and Lawn, B.R.: Indentation deformation and fracture of sapphire. J. Am. Ceram. Soc. 71, 29 (1988).CrossRefGoogle Scholar
21Bradby, J.G., Williams, J.S., Wong-Leung, J., Swain, M.V. and Munroe, P.: Mechanical deformation in silicon by micro-indentation. J. Mater. Res. 16, 1500 (2001).CrossRefGoogle Scholar
22Bradby, J.G., Williams, J.S., Wong-Leung, J., Kucheyev, S.O., Swain, M.V. and Munroe, P.: Spherical indentation of compound semiconductors. Philos. Mag. A 82, 1931 (2002).CrossRefGoogle Scholar
23Zarudi, I., Zhang, L.C. and Swain, M.V.: Microstructure evolution in monocrystalline silicon in cyclic microindentations. J. Mater. Res. 18, 758 (2003).CrossRefGoogle Scholar
24Lawn, B.R.: Fracture and deformation in brittle solids: A perspective on the issue of scale. J. Mater. Res. 19, 22 (2004).CrossRefGoogle Scholar
25Marshall, D.B. and Lawn, B.R.: Residual stress effects in sharp-contact cracking: I. Indentation fracture mechanics. J. Mater. Sci. 14, 2001 (1979).CrossRefGoogle Scholar
26Lawn, B.R. and Fuller, E.R.: Measurement of thin-layer surface stresses by indentation fracture. J. Mater. Sci. 19, 4061 (1984).CrossRefGoogle Scholar
27Gruninger, M.F., Lawn, B.R., Farabaugh, E.N. and Wachtman, J.B.: Measurement of residual stresses in coatings on brittle substrates by indentation fracture. J. Am. Ceram. Soc. 70, 344 (1987).CrossRefGoogle Scholar
28Marshall, D.B., Lawn, B.R. and Chantikul, P.: Residual stress effects in sharp-contact cracking: II. Strength degradation. J. Mater. Sci. 14, 2225 (1979).CrossRefGoogle Scholar
29Lawn, B.R., Evans, A.G. and Marshall, D.B.: Elastic/plastic indentation damage in ceramics: The median/radial crack system. J. Am. Ceram. Soc. 63, 574 (1980).CrossRefGoogle Scholar
30Lawn, B.R.: Fracture of Brittle Solids (Cambridge University Press, Cambridge, U.K., 1993)CrossRefGoogle Scholar
31Chen, X. and Vlassak, J.J.: Numerical study on the measurement of thin film mechanical properties by means of nanoindentation. J. Mater. Res. 16, 2974 (2001).CrossRefGoogle Scholar
32Wang, H. and Hu, X.Z.: Surface properties of ceramic laminates fabricated by die pressing. J. Am. Ceram. Soc. 79, 553 (1996).CrossRefGoogle Scholar
33Lee, K.S., Lee, S.K., Lawn, B.R. and Kim, D.K.: Contact damage and strength degradation in brittle/quasi-plastic silicon nitride bilayers. J. Am. Ceram. Soc. 81, 2394 (1998).CrossRefGoogle Scholar
34Callister, W.D.: Materials Science and Engineering: An Introduction (John Wiley & Sons, New York, NY, 1997)Google Scholar
35Lide, D.R. in Handbook of Chemistry and Physics (CRC Press, Boca Raton, FL, 2003), pp. 12–97.Google Scholar