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Effect of indentation unloading conditions on phase transformation induced events in silicon

Published online by Cambridge University Press:  31 January 2011

Tom Juliano
Affiliation:
Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104
Yury Gogotsi*
Affiliation:
Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104
Vladislav Domnich
Affiliation:
Department of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104
*
a)Address all correspondence to this author.
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Abstract

More than 2500 indentations were made on a silicon wafer surface using a range of different unloading rates and maximum applied loads. The unloading curves were examined for characteristic events (pop-out, kink pop-out, elbow followed by pop-out, and elbow) that were assigned to different phase transitions within the affected material based on Raman microspectroscopy analysis of residual imprints. The effect of unloading rate and maximum applied load on the average contact pressure at the beginning of the event was found. A permissible range for each event to occur was established.

Type
Articles
Copyright
Copyright © Materials Research Society 2003

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