Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Tu, King-Ning
2007.
Solder Joint Technology.
Vol. 117,
Issue. ,
p.
305.
Yang, Dan
and
Chan, Y. C.
2007.
The characteristics of electromigration and thermomigration in flip chip solder joints.
p.
43.
Chen, Rong
and
Yang, Fuqian
2008.
Impression creep of a Sn60Pb40 alloy: the effect of electric current.
Journal of Physics D: Applied Physics,
Vol. 41,
Issue. 15,
p.
155406.
Chiu, Tsung-Chieh
and
Lin, Kwang-Lung
2008.
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination.
Journal of Materials Research,
Vol. 23,
Issue. 1,
p.
264.
Kumar, Aditya
Yang, Ying
Wong, Chee C.
Kripesh, Vaidhyanathan
and
Chen, Zhong
2009.
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
Journal of Electronic Materials,
Vol. 38,
Issue. 1,
p.
78.
Guo, Fu
Xu, Guangchen
and
He, Hongwen
2009.
Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints.
Journal of Materials Science,
Vol. 44,
Issue. 20,
p.
5595.
Liu, Haiyan
Zhu, Qingsheng
Zhang, Li
Wang, Zhongguang
and
Shang, Jian Ku
2010.
Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current.
Journal of Materials Research,
Vol. 25,
Issue. 6,
p.
1172.
Chen, Rong
and
Yang, Fuqian
2010.
Effect of DC Current on the Creep Deformation of Tin.
Journal of Electronic Materials,
Vol. 39,
Issue. 12,
p.
2611.
Chen, Chih
Tong, H.M.
and
Tu, K.N.
2010.
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints.
Annual Review of Materials Research,
Vol. 40,
Issue. 1,
p.
531.
Lu, Yu Dong
He, Xiao Qi
En, Yun Fei
Wang, Xin
and
Zhuang, Zhi Qiang
2010.
Failure of Flip-Chip Circuit Interconnects under High Current Density.
Advanced Materials Research,
Vol. 118-120,
Issue. ,
p.
449.
Yang, D.
Chan, Y.C.
and
Pecht, M.
2011.
Electromigration in Thin Films and Electronic Devices.
p.
285.
Wei, Guoqiang
Yao, Jian
and
Shi, Yonghua
2011.
The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100°C.
p.
1.
Kim, Doosoo
Chang, Jong-hyeon
Park, Jungil
and
Pak, James Jungho
2011.
Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.
Journal of Materials Science: Materials in Electronics,
Vol. 22,
Issue. 7,
p.
703.
Chen, Chih
Liang, Shih‐Wei
Chang, Yuan‐Wei
Hsiao, Hsiang‐Yao
Han, Jung Kyu
and
Tu, K. N.
2012.
Lead‐Free Solders: Materials Reliability for Electronics.
p.
375.
Zhao, Guangfeng
Liu, Ming
and
Yang, Fuqian
2012.
The effect of an electric current on the nanoindentation behavior of tin.
Acta Materialia,
Vol. 60,
Issue. 9,
p.
3773.
Lu, Y. D.
En, B. Y. F.
and
Shi, Z. Y.
2013.
Failure mechanism of flip-chip circuit interconnects induced by electromigration.
p.
595.
Chen, Y.J.
Chung, C.K.
Yang, C.R.
and
Kao, C.R.
2013.
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics.
Microelectronics Reliability,
Vol. 53,
Issue. 1,
p.
47.
Ma, Limin
Zuo, Yong
Guo, Fu
and
Shu, Yutian
2014.
Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint.
Journal of Materials Research,
Vol. 29,
Issue. 22,
p.
2738.
Zuo, Yong
Ma, Limin
Guo, Fu
Qiao, Lei
Shu, Yutian
and
Han, Jing
2014.
Effects of electromigration on the creep of Sn0.3Ag0.7Cu solder joint.
p.
898.
Kim, Youngseok
Nagao, Shijo
Sugahara, Tohru
Suganuma, Katsuaki
Ueshima, Minoru
Albrecht, Hans-Juergen
Wilke, Klaus
and
Strogies, Joerg
2014.
Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components.
Japanese Journal of Applied Physics,
Vol. 53,
Issue. 4S,
p.
04EB02.