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Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag

Published online by Cambridge University Press:  03 March 2011

Yee-Wen Yen ,
Chien-Chung Jao  and
Chiapyng Lee
Yee-Wen Yen
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
Chien-Chung Jao*
Affiliation:
Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China; and Department of Chemical and Materials Engineering, Ta Hwa Institute of Technology, Hsinchu 307, Taiwan, Republic of China
Chiapyng Lee
Affiliation:
Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The effect of Cu added eutectic Sn–9Zn solder reacting with the Ag substrate has been investigated in this study. Three Ag–Zn intermetallic compounds (IMCs), ∈–AgZn3, γ–Ag5Zn8, and ζ–AgZn, were formed on the Sn–9Zn/Ag interface at 260 °C. While Cu was gradually added to the Sn–9Zn alloy, microstructures of intermetallic compounds changed dramatically. The intermetallic compound microstructures became loose and Sn and Cu atoms in the Ag-Zn intermetallic compounds increased. If more than 3 wt% of Cu was added to the Sn-9Zn alloy, Ag-Sn intermetallic compounds were formed on the Ag surface and massive spalling of Ag–Zn IMC layers from the Ag surface occurred in a short reaction time.

Keywords

Soldering
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 12 , December 2006 , pp. 2986 - 2990
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1.Suganuma, K., Niihara, K.: Wetting and interface microstructure between Sn-Zn binary alloys and Cu. J. Mater. Res. 13, 2859 (1998).CrossRefGoogle Scholar
2.Suganuma, K., Murata, T., Noguchi, H., Toyoda, Y.: Heat resistance of Sn-9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 (2000).CrossRefGoogle Scholar
3.Vassilev, G.P., Evtimova, S.K., Tedenac, J.C., Dobrev, E.S.: Experimental study of the ternary Ag–Sn–Zn system through diffusion couples. J. Alloys Compd. 334, 182 (2002).CrossRefGoogle Scholar
4.Date, M., Shoji, T., Fujiyoshi, M., Sato, K., Tu, K.N.: Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test. Scripta Mater. 51, 641 (2004).CrossRefGoogle Scholar
5.Kim, K.S., Yang, J.M., Yu, C.H., Jung, I.O., Kim, H.H.: Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad. J. Alloys Compd. 379, 314 (2004).CrossRefGoogle Scholar
6.Song, J.M., Liu, P.C., Shih, C.L., Lin, K.L.: Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering. J. Electron. Mater. 34, 1249 (2005).CrossRefGoogle Scholar
7.Yu, D.Q., Xie, H.P., Wang, L.: Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. J. Alloys Compd. 385, 119 (2004).CrossRefGoogle Scholar
8.Lin, K.L., Liu, P.C., Song, J.M.Wetting Interaction between Pb-free Sn-Zn series solder and Cu, Ag substrates. Electronic Components and Technology Conference (IEEE,Las Vegas, NV, 2004), p. 1310.Google Scholar
9.Kim, H.K., Tu, K.N.: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996).CrossRefGoogle ScholarPubMed
10.Chen, S.W., Yen, Y.W.: Interfacial reactions in Ag-Sn/Cu couples. J. Electron. Mater. 28, 1203 (1999).CrossRefGoogle Scholar
11.Chen, S.W., Yen, Y.W.: Interfacial reactions in the Sn-Ag/Au couples. J. Electron. Mater. 30, 1133 (2001).CrossRefGoogle Scholar
12.Hwang, C.W., Kim, K.S., Suganuma, K.: Interfaces in lead-free soldering. J. Electron. Mater. 32, 1249 (2003).CrossRefGoogle Scholar
13.Jang, J.W., Ramanathan, L.N., Lin, J.K., Frear, D.R.: Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing. J. Appl. Phys. 95, 8286 (2004).CrossRefGoogle Scholar
14.Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R. Volume effect on the soldering reaction between SnAgCu solders and Ni. International Symposium on Advanced Packaging Materials (IEEE, Piscataway, NJ, 2005), p. 39.Google Scholar
15.Wang, K.Z., Chen, C.M.: Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering. J. Electron. Mater. 34, 1 (2005).CrossRefGoogle Scholar
16.Okamoto, H.: Binary Phase Diagram (ASM International, Materials Park, OH, 1990).Google Scholar
17.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleioser, M., Kelley, K.K.: Selected Values of Thermodynamic Properties of Binary Alloys (ASM International, Metals Park, OH, 1973).Google Scholar
18.Jao, C.C. and Yen, Y.W.: in preparation for publication.Google Scholar