Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-24T13:38:52.008Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

Published online by Cambridge University Press:  23 January 2014

Wei-Hsun Chen ,
Pylin Sarobol ,
John R. Holaday ,
Carol A. Handwerker  and
John E. Blendell
Wei-Hsun Chen*
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
Pylin Sarobol
Affiliation:
Coatings and Surface Engineering, Sandia National Laboratories, Albuquerque, New Mexico 87123
John R. Holaday
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
Carol A. Handwerker
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
John E. Blendell
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

A strategy for identifying the preferred sites and overall propensity of a Sn film to form whiskers has been developed based on film textures, local grain orientations, and elastic strain energy densities (ESEDs), with preferred sites predicted to be grains with local high ESEDs. Using β-Sn films with various textures, ESED distributions were simulated for elastic and thermoelastic stresses depending on isothermal aging or thermal cycling conditions. Local high ESEDs are preferentially induced in (110) or (100) oriented grains with c-axes nearly parallel to the film plane; films with overall low ESEDs have strong (100) textures for elastic stresses and strong (001) textures for thermoelastic stresses, suggesting low propensities to form whiskers. This work establishes a model for understanding the effect of the β-Sn anisotropy on whisker formation and provides guidelines for testing whether engineering specific film textures will reduce a film's propensity to form whiskers.

Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 2 , 28 January 2014 , pp. 197 - 206
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Fisher, R.M., Darken, L.S., and Carroll, K.G.: Accelerated growth of tin whiskers. Acta Metall. 2(3), 368 (1954).Google Scholar
Tu, K-N. and Li, J.C.M.: Spontaneous whisker growth on lead-free solder finishes. Mater. Sci. Eng., A 409(1–2), 131 (2005).Google Scholar
Boettinger, W.J., Johnson, C.E., Bendersky, L.A., Moon, K.W., Williams, M.E., and Stafford, G.R.: Whisker and hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits. Acta Mater. 53(19), 5033 (2005).CrossRefGoogle Scholar
Chason, E., Jadhav, N., Chan, W.L., Reinbold, L., and Kumar, K.S.: Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes. Appl. Phys. Lett. 92(17), 171901 (2008).CrossRefGoogle Scholar
Lee, B.Z. and Lee, D.N.: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46(10), 3701 (1998).CrossRefGoogle Scholar
Kumar, K.S., Reinbold, L., Bower, A.F., and Chason, E.: Plastic deformation processes in Cu/Sn bimetallic films. J. Mater. Res. 23(11), 2916 (2008).CrossRefGoogle Scholar
Buchovecky, E., Jadhav, N., Bower, A.F., and Chason, E.: Finite element modeling of stress evolution in Sn films due to growth of the Cu6Sn5 intermetallic compound. J. Electron. Mater. 38(12), 2676 (2009).Google Scholar
Reinbold, L., Jadhav, N., Chason, E., and Kumar, K.S.: Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu “bimetal ledge specimen”. J. Mater. Res. 24(12), 3583 (2009).Google Scholar
Tu, K-N.: Irreversible-processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. Phys. Rev. B 49(3), 2030 (1994).Google Scholar
Clore, N.G.: Identification and counting procedure for tin whiskers, hillocks, and other surface defects. M.S. Thesis, Purdue University, West Lafayette, IN, 2011.Google Scholar
Suganuma, K., Baated, A., Kim, K.S., Hamasaki, K., Nemoto, N., Nakagawa, T., and Yamada, T.: Sn whisker growth during thermal cycling. Acta Mater. 59(19), 7255 (2011).Google Scholar
Williams, M.E., Moon, K.W., Boettinger, W.J., Josell, D., and Deal, A.D.: Hillock and whisker growth on sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds. J. Electron. Mater. 36(3), 214 (2007).CrossRefGoogle Scholar
Osenbach, J.W., DeLucca, J.M., Potteiger, B.D., Amin, A., Shook, R.L., and Baiocchi, F.A.: Sn corrosion and its influence on whisker growth. IEEE Trans. Electron. Packag. Manuf. 30(1), 23 (2007).CrossRefGoogle Scholar
Oberndorff, P., Dittes, M., Crema, P., Su, P., and Yu, E.: Humidity effects on Sn whisker formation. IEEE Trans. Electron. Packag. Manuf. 29(4), 239 (2006).Google Scholar
Zhang, W. and Schwager, F.: Effects of lead on tin whisker elimination efforts toward lead-free and whisker-free electrodeposition of tin. J. Electrochem. Soc. 153(5), C337 (2006).Google Scholar
Jadhav, N., Williams, M., Pei, F., Stafford, G., and Chason, E.: Altering the mechanical properties of Sn films by alloying with Bi: Mimicking the effect of Pb to suppress whiskers. J. Electron. Mater. 42(2), 312 (2013).Google Scholar
Pedigo, A.E., Handwerker, C.A., and Blendell, J.E.: Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films. In: Proceedings Electronic Components and Technology Conference, IEEE, New Brunswick, NJ, 2008; p. 1498.Google Scholar
Sarobol, P., Pedigo, A.E., Su, P., Blendell, J.E., and Handwerker, C.A.: Defect morphology and texture in Sn, Sn-Cu, and Sn-Cu-Pb electroplated films. IEEE Trans. Electron. Packag. Manuf. 33(3), 159 (2010).Google Scholar
Pedigo, A.E.: The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers, Ph.D. Thesis, Purdue University, West Lafayette, IN, 2011.Google Scholar
Fang, T., Mathew, S., Osterman, M., and Fecht, M.: Assessment of risk resulting from unattached tin whisker bridging. Circuit World 33(1), 5 (2007).Google Scholar
Sarobol, P., Blendell, J.E., and Handwerker, C.A.: Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration. Acta Mater. 61(6), 1991 (2013).CrossRefGoogle Scholar
Sarobol, P., Wang, Y., Chen, W.H., Pedigo, A.E., Koppes, J.P., Blendell, J.E., and Handwerker, C.A.: A predictive model for whisker formation based on local microstructure and grain boundary properties. JOM 65(10), 1350 (2013).Google Scholar
Sobiech, M., Wohlschlogel, M., Welzel, U., Mittemeijer, E.J., Hugel, W., Seekamp, A., Liu, W., and Ice, G.E.: Local, submicron, strain gradients as the cause of Sn whisker growth. Appl. Phys. Lett. 94(22), 3 (2009).CrossRefGoogle Scholar
Pei, F., Jadhav, N., and Chason, E.: Correlation between surface morphology evolution and grain structure: Whisker/hillock formation in Sn-Cu. JOM 64(10), 1176 (2012).Google Scholar
House, D.G. and Vernon, E.V.: Determination of the elastic moduli of tin single crystals, and their variation with temperature. Br. J. Appl. Phys. 11(6), 254 (1960).Google Scholar
Touloukian, Y.S., Kirby, R.K., Taylor, R.E., and Desai, P.D.: Thermal Expansion: Metallic Elements and Alloys, Vol. 12 (IFI/Plenum, New York, 1975).Google Scholar
Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., MacDowell, A.A., Bong, Y.Y., and Nguyen, L.: Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction. Acta Mater. 51(20), 6253 (2003).CrossRefGoogle Scholar
Sarobol, P., Chen, W.H., Pedigo, A.E., Su, P., Blendell, J.E., and Handwerker, C.A.: Effects of local grain misorientation and beta-Sn elastic anisotropy on whisker and hillock formation. J. Mater. Res. 28(5), 747 (2013).Google Scholar
Langer, S.A., Fuller, E., and Carter, W.C.: OOF: An image-based finite-element analysis of material microstructures. Comput. Sci. Eng. 3(3), 15 (2001).Google Scholar
Reid, A.C.E., Lua, R.C., Garcia, R.E., Coffman, V.R., and Langer, S.A.: Modelling microstructures with OOF2. Int. J. Mater. Prod. Technol. 35(3–4), 361 (2009).CrossRefGoogle Scholar
Blendell, J.E., Vaudin, M.D., and Fuller, E.R.: Determination of texture from individual grain orientation measurements. J. Am. Ceram. Soc. 82(11), 3217 (1999).Google Scholar
Dollase, W.A.: Correction of intensities for preferred orientation in powder diffractometry: Application of the March model. J. Appl. Cryst. 19, 267 (1986).CrossRefGoogle Scholar
Engler, O. and Randle, V.: Introduction to Texture Analysis: Macrotexture, Microtexture, and Orientation Mapping, 2nd ed. (CRC Press, Boca Raton, 2010).Google Scholar
Matthies, S. and Vinel, G.W.: On some methodical developments concerning calculations performed directly in the orientation space. Proceedings of the 10th International Conference on Textures of Materials: ICOTOM-10, Vol. 157–162, 1994, p. 1641.Google Scholar
Bunge, H.J.: Texture Analysis in Materials Science: Mathematical Methods, 2nd ed. (Butterworths, Boston, 1982).Google Scholar
Jadhav, N., Buchovecky, E.J., Reinbold, L., Kumar, S., Bower, A.F., and Chason, E.: Understanding the correlation between intermetallic growth, stress evolution, and Sn whisker nucleation. IEEE Trans. Electron. Packag. Manuf. 33(3), 183 (2010).Google Scholar
Sobiech, M., Welzell, U., Mittemeijer, E.J., Hügel, W., and Seekamp, A.: Driving force for Sn whisker growth in the system Cu-Sn. Appl. Phys. Lett. 93(1), 011906 (2008).Google Scholar
Park, C., Long, X., Haberman, S., Ma, S., Dutta, I., Mahajan, R., and Jadhav, S.G.: A comparison of impression and compression creep behavior of polycrystalline Sn. J. Mater. Sci. 42(13), 5182 (2007).Google Scholar
Wu, H., Wu, L., Wang, B., Yu, H., and Du, S.: Effective biaxial modulus and strain energy density of ideally (hkl)-fiber-textured hexagonal, tetragonal and orthorhombic films. Appl. Surf. Sci. 255(5), 2000 (2008).CrossRefGoogle Scholar
JEDEC Standard 201A: Environmental Acceptance Requirement for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes (JEDEC Solid State Technology Association, Arlington, VA, 2008).Google Scholar
Wanner, T., Fuller, E.R., and Saylor, D.M.: Homology metrics for microstructure response fields in polycrystals. Acta Mater. 58(1), 102 (2010).Google Scholar
Sarobol, P., Koppes, J.P., Chen, W-H., Su, P, Blendell, J.E., and Handwerker, C.A.: Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films. Mater. Lett. 99, 76 (2013).CrossRefGoogle Scholar