Hostname: page-component-745bb68f8f-5r2nc Total loading time: 0 Render date: 2025-01-27T07:20:41.205Z Has data issue: false hasContentIssue false
  • English
  • Français

Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique

Published online by Cambridge University Press:  31 January 2011

Hsiu-yu Chang ,
Sinn-wen Chen ,
David Shan-hill Wong  and
Hsiu-Feng Hsu
Hsiu-yu Chang
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
Sinn-wen Chen*
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
Hsiu-Feng Hsu
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Wetting properties of lead-free solders, Sn–0.7 wt.% Cu and Sn–3.5 wt.% Ag, pure Sn, and conventional Sn–40 w.t% Pb on Ni, Cu, and Ag substrates at 250 and 240 °C were determined by using a wetting balance technique. Wetting times and wetting forces were determined directly from the wetting curves, and surface tensions of molten solders were calculated from the wetting force measurements. A statistic tool, analysis of variance (ANOVA), was used to analyze the experimental results. By using the wetting time as an indication, it was found that Sn–Pb exhibited the best wetting followed by Sn–Ag, Sn–Cu, and Sn, in that order. A very significant but frequently ignored issue is that most solders react with substrates, and the molten solders are not in contact with the original substrates but rather with intermetallic compounds. On the basis of theoretical analysis and experimental observations, it was concluded that the withdrawing forces and the surface tensions of the molten solders determined by the present technique are not significantly affected by the interfacial reactions if the interfacial reactions are not too excessive. However, wetting times are strong functions of both solders and substrates and the interfacial reactions between them.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 6 , June 2003 , pp. 1420 - 1428
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Jin, S., JOM 45(7), 13 (1993).CrossRefGoogle Scholar
2.Vianco, P.T. and Frear, D.R., JOM 45(7), 14 (1993).CrossRefGoogle Scholar
3.Morris, J.W., Jr., Goldstein, J.L., and Mei, Z., JOM 45(7), 25 (1993).CrossRefGoogle Scholar
4.Melton, C., JOM 45(7), 33 (1993).CrossRefGoogle Scholar
5.McCormack, M. and Jin, S., JOM 45(7), 36 (1993).CrossRefGoogle Scholar
6.Glazer, J., Int. Mater. Rev. 40, 63 (1995).CrossRefGoogle Scholar
7.Berg, J.C., Wettability (Marcel Dekker, New York, 1993), Chap. 2.CrossRefGoogle Scholar
8.Yost, F.G., O’Toole, E.J., Sackinger, P.A., and Swiler, T.P., Sandia Report (Sandia National Laboratories, Albuquerque, NM, 1998), pp. 1–7.Google Scholar
9.Yost, F.G., The Metal Science of Joining, edited by Cieslak, M.J., Perepezko, J.H., Kang, S., and Glicksman, M.E. (TMS, Warrendale, PA, 1992) pp. 49–59.Google Scholar
10.Boettinger, W.J., Handwerker, C.A., and Smith, L.C., The Metal Science of Joining edited by Cieslak, M.J., Perepezko, J.H., Kang, S., and Glicksman, M.E. (TMS, Warrendale, PA, 1992), pp. 183–189.Google Scholar
11.Yost, F.G. and Romig, A.D., Jr. in Electronic Packaging Materials Science II, edited by Sundahl, R.C., Jaccodine, R., and Jackson, K.A. (Mater. Res. Soc. Symp. Proc. 108, Pittsburgh, PA, 1988), pp. 385–390.Google Scholar
12.Aksay, I.A., Hoge, C.E., and Pask, J.A., J. Phys. Chem. 78, 1178 (1974).CrossRefGoogle Scholar
13.Boettinger, W.J., Handwerker, C.A., and Kattner, U.R., in The Mechanics of Solder Alloy Wetting and Spreading, edited by Yost, F.G., Hosking, F.M., and Frear, D.R. (Van Nostrand Reinhold, New York, 1993), pp. 103–140.CrossRefGoogle Scholar
14.Landry, K., Rado, C., Voitovich, R., and Eustathopoulos, N., Acta Mater. 45, 3079 (1997).CrossRefGoogle Scholar
15.Vianco, P.T., Hosking, F.M., and Rejent, J.A., in Proceedings of the Conference Nepcon West (1992), pp. 1730–1738.Google Scholar
16.Green, S., Lea, D., and Hunt, C., NPL Report CMMT(A)213 (NPL, Teddington, Middlesex, U.K., 1999), pp. 1–10.Google Scholar
17.Lee, J-I., Chen, S-W., Chang, H-Y., and Chen, C-M., J. Electron. Mater. 32, 117 (2003).CrossRefGoogle Scholar
18.Park, J.Y., Ha, J.S., Kang, C.S., Shin, K.S., Kim, M.I., and Jung, J.P., J. Electron. Mater. 29, 1145 (2000).CrossRefGoogle Scholar
19.Park, J.Y., Kang, C.S., and Jung, J.P., J. Electron. Mater. 28, 1256 (1999).CrossRefGoogle Scholar
20.Abtew, M. and Selvaduray, G., Mater. Sci. Eng. 27, 95 (2000).CrossRefGoogle Scholar
21.Artaki, I., Jackson, A.M., and Vianco, P.T., J. Electron. Mater. 23, 757 (1994).CrossRefGoogle Scholar
22.Vianco, P.T. and Mizik, P.M., International SAMPE Electronics Conference (1994), Vol. 7, pp. 366–380.Google Scholar
23.Jackson, A.M., Artaki, I., and Vianco, P.T., International SAMPE Electronics Conference (1994), Vol. 7, pp. 381–393.Google Scholar
24.Takemoto, T. and Miyazaki, M., Mater. Trans. 42, 745 (2001).CrossRefGoogle Scholar
25.Choi, M.K., Lee, C.Y., and Shur, C.J., J. Electron. Manuf. 8, 235 (1998).CrossRefGoogle Scholar
26.Montgomery, D.C., Design and Analysis of Experiments (Wiley, New York, 1997).Google Scholar
27.Chen, S-W. and Yen, Y-W., J. Electron. Mater. 30, 1133 (2001).CrossRefGoogle Scholar
28.Huang, C-Y. and Chen, S-W., J. Electron. Mater. 31, 152 (2002).CrossRefGoogle Scholar