Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-28T09:38:18.580Z Has data issue: false hasContentIssue false
  • English
  • Français

Crack propagation and mechanical properties of electrodeposited nickel with bimodal microstructures in the nanocrystalline and ultrafine grained regime

Published online by Cambridge University Press:  26 September 2017

Dominic Rathmann ,
Michael Marx  and
Christian Motz
Dominic Rathmann*
Affiliation:
Institute of Materials Science and Methods, Department of Materials Science, Saarland University, Saarbrücken 66123, Germany
Michael Marx
Affiliation:
Institute of Materials Science and Methods, Department of Materials Science, Saarland University, Saarbrücken 66123, Germany
Christian Motz
Affiliation:
Institute of Materials Science and Methods, Department of Materials Science, Saarland University, Saarbrücken 66123, Germany
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The article focuses on the fatigue performance after a moderate heat treatment of nanocrystalline (nc) nickel, which leads to the formation of a bimodal microstructure in the nc to ultrafine grained (ufg) regime. Electrodeposition was used to produce nc macro nickel samples with grain sizes of about 40 nm for mechanical testing. The thermal stability of the material as well as the influence on the mechanical properties and the fatigue crack propagation behavior was investigated. The results of tensile and fatigue tests are discussed in respect to the chosen production method and boundary conditions. In this context, the influence of the bath additives used during the plating process was investigated and rated as the major challenge for a further improvement of the thermal stability and mechanical properties of the material. Finally, a co-deposition of nickel and metal oxides with enhanced thermal stability is presented.

Keywords

nanostructureelectrodepositionfatigue
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 24: Focus Issue: Mechanical Properties and Microstructure of Advanced Metallic Alloys—in Honor of Prof. Haël Mughrabi PART B , 28 December 2017 , pp. 4573 - 4582
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: Mathias Göken

References

REFERENCES

Erb, U.: Electrodeposited nanocrystals: Synthesis, properties and industrial applications. Nanostruct. Mater. 6(5–8), 533 (1995).Google Scholar
Ebrahimi, F., Bourne, G., Kelly, M., and Matthews, T.: Mechanical properties of nanocrystalline nickel produced by electrodeposition. Nanostruct. Mater. 11(3), 343 (1999).Google Scholar
Meyers, M.A., Mishra, A., and Benson, D.J.: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51, 427 (2006).Google Scholar
Shen, Y.F., Xue, W.Y., Wang, Y.D., Liu, Z.Y., and Zuo, L.: Mechanical properties of nanocrystalline nickel films deposited by pulse plating. Surf. Coat. Technol. 202(21), 5140 (2008).Google Scholar
Yang, B., Vehoff, H., and Pippan, R.: Overview of the grain size effects on the mechanical and deformation behaviour of electrodeposited nanocrystalline nickel-from nanoindentation to high pressure torsion. Mater. Sci. Forum 633–634(1), 85 (2010).Google Scholar
Hahn, E.N. and Meyers, M.A.: Grain-size dependent mechanical behavior of nanocrystalline metals. Mater. Sci. Eng., A 646, 101 (2015).Google Scholar
Johnson, W., Doherty, J., Kear, B., and Giamei, A.: Confirmation of sulfur embrittlement in nickel alloys. Scr. Metall. 8, 971–974 (1974).Google Scholar
Briant, C.: Grain boundary segregation of sulfur in iron. Acta Metall. 33, 1241–1246 (1985).Google Scholar
Cziráki, Á., Gerőcs, I., Tóth-Kádár, E., and Bakonyi, I.: TEM and XRD study of the microstructure of nanocrystalline Ni and Cu prepared by severe plastic deformation and electrodeposition. Nanostruct. Mater. 6(5–8), 547 (1995).Google Scholar
Leitner, T., Hohenwarter, A., and Pippan, R.: Revisiting fatigue crack growth in various grain size regimes of Ni. Mater. Sci. Eng., A 646, 294 (2015).Google Scholar
Oniciu, L. and Mureşan, L.: Some fundamental aspects of levelling and brightening in metal electrodeposition. J. Appl. Electrochem. 21(7), 565 (1991).Google Scholar
Osaka, T.: Effects of saccharin and thiourea on sulfur inclusion and coercivity of electroplated soft magnetic CoNiFe film. J. Electrochem. Soc. 146(9), 3295 (1999).Google Scholar
Klement, U., Erb, U., El-Sherik, A., and Aust, K.: Thermal stability of nanocrystalline Ni. Sci. Eng. A 203, 177–186 (1995).Google Scholar
Tellkamp, V.L., Lavernia, E.J., and Melmed, A.: Mechanical behavior and microstructure of a thermally stable bulk nanostructured Al alloy. Metall. Mater. Trans. A 32(9), 2335 (2001).Google Scholar
Hosseini-Toudeshky, H. and Jamalian, M.: Simulation of micromechanical damage to obtain mechanical properties of bimodal Al using XFEM. Mech. Mater. 89, 229–240 (2015).Google Scholar
Höppel, H.W., Korn, M., Lapovok, R., and Mughrabi, H.: Bimodal grain size distributions in UFG materials produced by SPD: Their evolution and effect on mechanical properties. J. Phys.: Conf. Ser. 240, 12147 (2010).Google Scholar
Liu, Y.G., Mi, X.D., and Tian, S.F.: Effect of grain size on the fracture toughness of bimodal nanocrystalline materials. Adv. Mater. Res. 936, 400 (2014).Google Scholar
Kikuchi, S., Hayami, Y., Ishiguri, T., Guennec, B., Ueno, A., Ota, M., and Ameyama, K.: Effect of bimodal grain size distribution on fatigue properties of Ti–6Al–4V alloy with harmonic structure under four-point bending. Mater. Sci. Eng., A 687, 269–275 (2017).Google Scholar
Ames, M., Markmann, J., Karos, R., Michels, A., and Tschöpe, A.: Unraveling the nature of room temperature grain growth in nanocrystalline materials. Acta Mater. 56, 4255–4266 (2008).Google Scholar
Molodov, D. and Shvindlerman, L.: Impact of grain boundary character on grain boundary kinetics. Z. Metallkd. 94, 1117–1126 (2003).Google Scholar
Kirchheim, R.: Reducing grain boundary, dislocation line and vacancy formation energies by solute segregation. I. Theoretical background. Acta Mater. 55(15), 5129 (2007).Google Scholar
Choi, P., Da Silva, M., Klement, U., Al-Kassab, T., and Kirchheim, R.: Thermal stability of electrodeposited nanocrystalline Co–1.1 at.% P. Acta Mater. 53(16), 4473 (2005).Google Scholar
Färber, B., Cadel, E., Menand, A., Schmitz, G., and Kirchheim, R.: Phosphorus segregation in nanocrystalline Ni–3.6 at.% P alloy investigated with the tomographic atom probe (TAP). Acta Mater. 48(3), 789 (2000).Google Scholar
Liu, F. and Kirchheim, R.: Nano-scale grain growth inhibited by reducing grain boundary energy through solute segregation. J. Cryst. Growth 264(1–3), 385 (2004).CrossRefGoogle Scholar
Wimmer, A., Smolka, M., Heinz, W., Detzel, T., Robl, W., Motz, C., Eyert, V., Wimmer, E., Jahnel, F., Treichler, R., and Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Mater. Sci. Eng., A 618, 398 (2014).Google Scholar
Krill, C.E. III, Ehrhardt, H., and Birringer, R.: Thermodynamic stabilization of nanocrystallinity. Z. Metallkd. 96, 1134–1141 (2005).Google Scholar
Rollett, A., Humphreys, F., Rohrer, G., and Hatherly, M.: Recrystallization and related annealing phenomena, 2nd Edition. (Elsevier, Oxford, United Kingdom, 2004).Google Scholar
Koch, C.C., Scattergood, R.O., Saber, M., and Kotan, H.: High temperature stabilization of nanocrystalline grain size: Thermodynamic versus kinetic strategies. J. Mater. Res. 28, 1785–1791 (2013).Google Scholar
Morris, D. and Morris, M.: Microstructure and strength of nanocrystalline copper alloy prepared by mechanical alloying. Acta Metall. Mater. 39, 1763–1770 (1991).Google Scholar
Bachmaier, A., Hohenwarter, A., and Pippan, R.: New procedure to generate stable nanocrystallites by severe plastic deformation. Scr. Mater. 61, 1016–1019 (2009).Google Scholar
Bachmaier, A. and Pippan, R.: Generation of metallic nanocomposites by severe plastic deformation. Int. Mater. Rev. 58(1), 41 (2013).Google Scholar
Cahn, J.: The impurity-drag effect in grain boundary motion. Acta Metall. 10, 789–798 (1962).Google Scholar
Lücke, K. and Stüwe, H.: On the theory of impurity controlled grain boundary motion. Acta Metall. 19, 1087–1099 (1971).CrossRefGoogle Scholar
Choo, R., Toguri, J., El-Sherik, A., and Erb, U.: Mass transfer and electrocrystallization analyses of nanocrystalline nickel production by pulse plating. J. Appl. Electrochem. 25, 384–403 (1995).CrossRefGoogle Scholar
Natter, H. and Schmelzer, M.: Nanocrystalline nickel and nickel–copper alloys: Synthesis, characterization, and thermal stability. J. Mater. 13, 1186–1197 (1998).Google Scholar
Natter, H. and Hempelmann, R.: Nanocrystalline copper by pulsed electrodeposition: The effects of organic additives, bath temperature, and pH. J. Phys. Chem. 100(50), 19525 (1996).Google Scholar
Klement, U., Oikonomou, C., and Chulist, R.: Influence of additives on texture development of submicro-and nanocrystalline nickel. Mater. Sci. Forum 702, 928–931 (2012).Google Scholar
Stangl, M., Acker, J., Oswald, S., Uhlemann, M., Gemming, T., Baunack, S., and Wetzig, K.: Incorporation of sulfur, chlorine, and carbon into electroplated Cu thin films. Microelectron. Eng. 84(1), 54 (2007).Google Scholar
Oniciu, L. and Mureşan, L.: Some fundamental aspects of levelling and brightening in metal electrodeposition. J. Appl. Electrochem. 21, 565–574 (1991).CrossRefGoogle Scholar
Hibbard, G., Aust, K., Palumbo, G., and Erb, U.: Thermal stability of electrodeposited nanocrystalline cobalt. Scr. Mater. 44(3) (2001).Google Scholar
Qian, T., Karaman, I., and Marx, M.: Mechanical properties of nanocrystalline and ultrafine-grained nickel with bimodal microstructure. Adv. Eng. Mater. 16(11), 1323 (2014).CrossRefGoogle Scholar
Aronson, G. and Ritchie, R.: Optimization of the electrical potential technique for crack growth monitoring in compact test pieces using finite element analysis. J. Test. Eval. 7, 208–215 (1979).Google Scholar