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Continuous electrical in situ contact area measurement during instrumented indentation

Published online by Cambridge University Press:  31 January 2011

Lei Fang ,
Christopher L. Muhlstein ,
James G. Collins ,
Amber L. Romasco  and
Lawrence H. Friedman
Lei Fang
Affiliation:
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802
Christopher L. Muhlstein*
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
James G. Collins
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
Amber L. Romasco
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
Lawrence H. Friedman
Affiliation:
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The primary tool for mechanical characterization of surfaces and films is instrumented indentation using the Oliver-Pharr data analysis method. However, this method measures contact area between the indenter and sample indirectly, thus confounding instrumented indentation tests when characterizing dynamic properties, thin films, and materials that “pileup” around the indenter. Here, we demonstrate an electrical technique to continuously measure the in situ contact area by relating nonlinear electrical contact current–voltage (I–V) curves to the instantaneous contact area. Using this approach, we can obtain hardness as a continuous function of applied force.

Keywords

CuElectrical propertiesHardness
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 9 , September 2008 , pp. 2480 - 2485
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Bhushan, B.Li, X.: Nanomechanical characterisation of solid surfaces and thin films. Int. Mater. Rev. 48, 125 2003CrossRefGoogle Scholar
2Bull, S.J.: Nanoindentation of coatings. J. Phys. D: Appl. Phys. 38, R393 2005CrossRefGoogle Scholar
3Gouldstone, A., Chollacoop, N., Dao, M., Li, J., Minor, A.M.Shen, Y.L.: Indentation across size scales and disciplines: Recent developments in experimentation and modeling. Acta Mater. 55, 4015 2007Google Scholar
4Pharr, G.M.Oliver, W.C.: Measurement of thin film mechanical properties using nanoindentation. MRS Bull. 17, 28 1992CrossRefGoogle Scholar
5Oliver, W.C.Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 1992Google Scholar
6Oliver, W.C.Pharr, G.M.: Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology. J. Mater. Res. 19, 3 2004CrossRefGoogle Scholar
7Tsui, T.Y.Pharr, G.M.: Substrate effects on nanoindentation mechanical property measurement of soft films on hard substrates. J. Mater. Res. 14, 292 1999CrossRefGoogle Scholar
8Han, S.M., Saha, R.Nix, W.D.: Determining hardness of thin films in elastically mismatched film-on-substrate systems using nanoindentation. Acta Mater. 54, 1571 2006Google Scholar
9Saha, R.Nix, W.D.: Effects of the substrate on the determination of thin film mechanical properties by nanoindentation. Acta Mater. 50, 23 2002CrossRefGoogle Scholar
10Bolshakov, A.Pharr, G.M.: Influences of pileup on the measurement of mechanical properties by load and depth-sensing indentation techniques. J. Mater. Res. 13, 1049 1998CrossRefGoogle Scholar
11Cheng, Y.T.Cheng, C.M.: Effects of “sinking in” and “piling up” on estimating the contact area under load in indentation. Philos. Mag. Lett. 78, 115 1998CrossRefGoogle Scholar
12Sneddon, I.N.: The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profile. Int. J. Eng. Sci. 3, 47 1965Google Scholar
13Oliver, W.C.Pethica, J.B.: Methods for continuous determination of the elastic stiffness of contact between two bodies. U.S. Patent No. 4 848 141, July 18, 1989,Google Scholar
14Pethica, J.B., Hutchings, R.Oliver, W.C.: Hardness measurement at penetration depths as small as 20 nm. Philos. Mag. A 48, 593 1983CrossRefGoogle Scholar
15Chen, X.Vlassak, J.: Numerical study on the measurement of thin film mechanical properties by means of nanoindentation. J. Mater. Res. 16, 2974 2001Google Scholar
16Mann, A.B., van Heerden, D., Pethica, J.B., Bowes, P.Weihs, T.P.: Contact resistance and phase transformations during nanoindentation of silicon. Philos. Mag. A 82, 1921 2002CrossRefGoogle Scholar
17Ruffell, S., Bradby, J.E., Williams, J.S.Warren, O.L.: An in situ electrical measurement technique via a conducting diamond tip for nanoindentation in silicon. J. Mater. Res. 22, 578 2007Google Scholar
18Koval, V., Reece, M.J.Bushby, A.J.: Ferroelectric/ferroelastic behavior and piezoelectric response of lead zirconate titanate thin films under nanoindentation. J. Appl. Phys. 97, 74301 2005CrossRefGoogle Scholar
19Rar, A., Pharr, G.M., Oliver, W.C., Karapetian, E.Kalinen, S.V.: Piezoelectric nanoindentation. J. Mater. Res. 21, 552 2006CrossRefGoogle Scholar
20Sridhar, S., Giannakopoulos, A.E.Suresh, S.: Mechanical and electrical responses of piezoelectric solids to conical indentation. J. Appl. Phys. 87, 8451 2000CrossRefGoogle Scholar
21Howes, V.R., Goldsmid, H.J.Baird, C.A.: Hardness measurement at constant depth using an indenter partially coated with a conducting film. J. Phys. E: Sci. Instrum. 20, 1507 1987CrossRefGoogle Scholar
22Holm, R.: Electric Contacts: Theory and Applications Springer-Verlag New York 1967 516CrossRefGoogle Scholar
23Timsit, R.S.: Electrical contact resistance: Fundamental principles in Electrical Contacts: Principles and Applications edited by P.G. Slade Marcel Dekker 1999 1073Google Scholar
24Wieczorek, L., Howes, V.R.Goldsmid, H.J.: Electrical contact resistance and its relationship to hardness. J. Mater. Sci. 21, 1423 1986CrossRefGoogle Scholar
25Goldsmid, H.J., Howes, V.R.Baird, C.A.: Measurement of hardness using a semiconductor diamond indentor. J. Mater. Sci. Lett. 6, 1043 1987CrossRefGoogle Scholar
26Lim, Y.Y.Chaudhri, M.M.: The effect of the indenter load on the nanohardness of ductile materials: An experimental study on polycrystalline work-hardened and annealed oxygen-free copper. Philos. Mag. A 79, 2979 1999CrossRefGoogle Scholar
27Fischer-Cripps, A.C.: Nanoindentation Springer-Verlag New York 2004 266CrossRefGoogle Scholar
28Lampert, M.A.Mark, P.: Current Injections in Solids Academic Press New York and London 1970 351Google Scholar
29Press, W.H., Teukolsky, S.A., Flannery, B.P.Vetterling, W.T.: Numerical Recipes in Fortran: The Art of Scientific Computing 3rd ed.Cambridge University Press 2007 1356Google Scholar
30Properties and selection: Nonferrous alloys and special-purpose materials in Metals Handbook Vol. 2, ASM International 1990 1328Google Scholar
31Taylor, J.R.: An Introduction to Error Analysis: The Study of Uncertainties in Physical Measurements University Science Books 1997 327Google Scholar
32Nix, W.D.Gao, H.: Indentation size effects in crystalline materials: A law for strain gradient plasticity. J. Mech. Phys. Solids 46, 411 1998CrossRefGoogle Scholar