Hostname: page-component-669899f699-qzcqf Total loading time: 0 Render date: 2025-04-28T15:35:55.008Z Has data issue: false hasContentIssue false
  • English
  • Français

Atomic force microscopy study of the role of molecular weight of poly(acrylic acid) in chemical mechanical planarization for shallow trench isolation

Published online by Cambridge University Press:  01 February 2006

Chae-Woong Cho ,
Sang-Kyun Kim ,
Ungyu Paik ,
Jea-Gun Park  and
Wolfgang M. Sigmund
Chae-Woong Cho
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Sang-Kyun Kim
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Ungyu Paik*
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Jea-Gun Park
Affiliation:
Nano-SOI Process Laboratory, Hanyang University, Seoul 133-791, Korea
Wolfgang M. Sigmund
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, Florida, 32611-6400
*
a)Address all correspondence to this author. e-mail: upaik@hanyang.ac.kr
Get access

Abstract

The influence of the molecular weight of poly(acrylic acid) (PAA) on chemical mechanical planarization (CMP) for shallow trench isolation (STI) was investigated. The adsorption behaviors of PAA as a function of molecular weight on deposited plasma-enhanced tetraethylorthosilicate and chemical vapor deposition Si3N4 films were analyzed by the force measurement using atomic force microscopy (AFM). The AFM results revealed that the affinity of PAA with the nitride film is higher than the affinity with the oxide film, and thus a denser adsorption layer on the nitride film is formed with higher molecular weight of PAA, which leads to higher selectivity in STI CMP. Additionally, to determine the correlation between the dispersion stability of the CeO2 resulting from the presence of PAA with different molecular weight and CMP performance, the colloidal properties of the slurry as a function of the molecular weight of PAA were examined.

Keywords

AdsorptionMolecular weightPolymer
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 2 , February 2006 , pp. 473 - 479
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1.Itoh, A., Imai, M. and Arimoto, Y.: Photoresist chemical mechanical polishing for shallow trench isolation. Jpn. J. Appl. Phys. 37, 1697 (1997).CrossRefGoogle Scholar
2.Cheng, J.Y., Lei, T.F. and Chao, T.S.: A novel shallow trench isolation technique. Jpn. J. Appl. Phys. 36, 1319 (1997).CrossRefGoogle Scholar
3.Horiike, Y., Sakaue, H. and Shingubara, S.: Recent development of high aspect ratio processes in ULSI devices. J. Kor. Phys. Soc. 26, S75 (1993).Google Scholar
4.Park, H.S., Kim, K.B., Hong, C.K., Chung, U.I. and Lee, M.Y.: Control of microscratches in chemical-mechanical polishing process for shallow trench isolation. Jpn. J. Appl. Phys. 37, 5849 (1998).CrossRefGoogle Scholar
5.Nojo, H., Kodera, M. and Nakata, R.: Slurry engineering for self-stopping, dishing free SiO2-CMP. IEEE 96, 349 (1996).Google Scholar
6.Suphantharida, P. and Osseo-Asare, K. Cerium oxide slurries in chemical mechanical polishing: Silica/ceria interactions (201st Electrochem. Soc. Proc, PV 2002-1 Philadelphia, PA, 2002), p. 257.Google Scholar
7.Kim, S.K., Paik, U., Oh, S.G., Park, Y.K., Katoh, T. and Park, J.G.: Effects of the physical characteristics of cerium oxide on plasma-enhanced tetraethylorthosiliate removal rate of chemical mechanical polishing for shallow trench isolation. Jpn. J. App. Phys. 42, 1227 (2003).CrossRefGoogle Scholar
8.Kim, S.K., Yoon, P.W., Paik, U., Katoh, T. and Park, J.G.: Influence of physical characteristics of ceria particles on polishing rate of chemical mechanical planarization for shallow trench isolation. Jpn. J. App. Phys. 43, 7427 (2004).CrossRefGoogle Scholar
9.Kim, J.Y., Kim, S.K., Paik, U., Katoh, T. and Park, J.G.: Effect of crystallinity of ceria particles on the PETEOS removal rate in chemical mechanical polishing for shallow trench isolation. J. Kor. Phys. Soc. 41, 413 (2002).Google Scholar
10.Kim, J.P., Yeo, J.G., Paik, U., Jung, Y.G., Park, J.G. and Hackley, V.A.: Modification of electrokinetic behavior of CeO2 abrasive particles in chemical mechanical polishing for shallow trench isolation. J. Kor. Phys. Soc. 39, 197 (2001).Google Scholar
11.Kim, S.K., Lee, S., Paik, U., Katoh, T. and Park, J.G.: Influence of the electrokinetic behaviors of abrasive ceria particles and the deposited plasma-enhanced tetraethylorthosilicate and chemically vapor deposited Si3N4 films in an aqueous medium on chemical mechanical planarization for shallow trench isolation. J. Mater. Res. 18, 2163 (2003).CrossRefGoogle Scholar
12.Park, J.G., Katoh, T., Lee, W.M., Jeon, H. and Paik, U.: Surfactant effect on oxide-to-nitride removal selectivity of nano-abrasive ceria slurry for chemical mechanical polishing. Jpn. J. Appl. Phys. 42, 5420 (2003).CrossRefGoogle Scholar
13.Paik, U., Hackley, V.A. and Lee, H.W.: Disperant-binder interactions in aqueous silicon nitride suspensions. J. Am. Ceram. Soc. 82, 833 (1999).CrossRefGoogle Scholar
14.Paik, U., Hackley, V.A., Choi, S.C. and Jung, Y.G.: The effect of electrostatic repulsive forces on the stability of BaTiO3 particles suspended in non-aqueous media. Colloids Surf. A 135, 77 (1998).CrossRefGoogle Scholar
15.Cho, C.W., Cho, Y.S., Yeo, J.G., Choi, S.C., Kim, J. and Paik, U.: The role of 2-methyl-2,4-pentanediol modifier and its interaction with poly(vinyl butyral) binder in BaTiO3 and Li2O-B2O3-BaO-SiO2 glass suspensions. Colloids Surf. A 224, 83 (2003).CrossRefGoogle Scholar
16.Paik, U., Hackley, V.A., Lee, J. and Lee, S.: Effect of poly(acrylic acid) and poly(vinyl alcohol) on the solubility of colloidal BaTiO3 in an aqueous medium. J. Mater. Res. 18, 1266 (2003).CrossRefGoogle Scholar
17.Wang, L., Sigmund, W.M. and Aldinger, F.: Systematic approach for dispersion of silicon nitride powder in organic media: II. Dispersion of the powder. J. Am. Ceram. Soc. 83, 697 (2000).CrossRefGoogle Scholar
18.Cho, J.M. Surface forces of colloidal particles from micrometer to nanometer. Doctoral Thesis, Department of Material Science and Engineering, University of Florida, Gainesville, FL (2003), p. 65.Google Scholar
19.Lee, S.W. and Sigmund, W.M.: AFM study of repulsive van der Waals forces between Teflon AFTM thin film and silica or alumina. Colloids Surf. A 204, 43 (2002).CrossRefGoogle Scholar
20.Ducker, W.A., Senden, T.J. and Pashley, R.M.: Direct measurement of colloidal forces using an atomic force microscope. Nature 353, 239 (1991).CrossRefGoogle Scholar
21.Zhang, J., Uchida, E., Uyama, Y. and Ikada, Y.: Electrostatic interaction between ionic polymer grafted surfaces studied by atomic force microscopy. J. Colloid Interface Sci. 188, 431 (1997).CrossRefGoogle Scholar
22.Andersson, K.M. and Bergstrom, L.: DLVO interactions of tungsten oxide and cobalt oxide surfaces measured with the colloidal probe technique. J. Colloid. Interface Sci. 246, 309 (2002).CrossRefGoogle ScholarPubMed
23.Vedula, R.R. and Spencer, H.G.: Adsorption of poly(acrylic acid) on titania (anatasse) and zirconia colloids. Colloids Surf. 58, 99 (1991).CrossRefGoogle Scholar
24.Choibowski, S. and Wisniewska, M.: Study of electrokinetic properties and structure of adsorbed layers of polyacrylic acid and polyacrylamide at Fe2O3-polymer solution interface. Colloids Surf. A 208, 131 (2002).CrossRefGoogle Scholar
25.Liufu, S., Xiao, H. and Li, Y.: Adsorption of poly(acrylic acid) onto the surface of titanium dioxide and the colloidal stability of aqueous suspension. J. Colloid. Interface Sci. 281, 155 (2005).CrossRefGoogle ScholarPubMed
26.Hackley, V.A. and Paik, U.: Handbook on Ultrasonic and Dielectric Characterization Techniques for Suspended Particulates (Am. Ceram. Soc., Westerville, OH, 1998), p. 191.Google Scholar
27.Hackley, V.A.: Colloidal processing of silicon nitride with poly(acrylic acid): I, adsorption and electrostatic interactions. J. Am. Ceram. Soc. 80, 2315 (1997).CrossRefGoogle Scholar
28.Hunter, R.J.: Introduction to Modern Colloid Science. (Oxford University Press, New York, 1993), p. 204.Google Scholar
29.Kim, S.K., Sohn, H.M., Paik, U., Katoh, T. and Park, J.G.: A reverse selectivity ceria slurry for the damascene gate chemical-mechanical planarization process. Jpn. J. App. Phys. 43, 7434 (2004).CrossRefGoogle Scholar
30.Katoh, T., Kang, H.G., Paik, U. and Park, J.G.: Effects of abrasive morphology and surfactant concentration on polishing rate of ceria slurry. Jpn. J. App. Phys. 42, 1150 (2003).CrossRefGoogle Scholar