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Transmission electron microscopy of an ultrasonically consolidated copper–aluminum interface

Published online by Cambridge University Press:  28 July 2014

Jennifer M. Sietins ,
John W. Gillespie Jr.  and
Suresh G. Advani
Jennifer M. Sietins*
Affiliation:
Department of Material Science and Engineering, University of Delaware, Newark, DE 19716, USA; and Center for Composite Materials, University of Delaware, Newark, DE 19716, USA
John W. Gillespie Jr.
Affiliation:
Department of Material Science and Engineering, University of Delaware, Newark, DE 19716, USA; Center for Composite Materials, University of Delaware, Newark, DE 19716, USA; Department of Civil and Environmental Engineering, University of Delaware, Newark, DE 19716, USA; and Department of Mechanical Engineering, University of Delaware, Newark, DE 19716, USA
Suresh G. Advani
Affiliation:
Center for Composite Materials, University of Delaware, Newark, DE 19716, USA; and Department of Mechanical Engineering, University of Delaware, Newark, DE 19716, USA
*
b)Address all correspondence to this author.e-mail: [email protected]
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Abstract

Ultrasonic consolidation is a rapid manufacturing process for metal matrix composite (MMC) preimpregnated composite (prepreg) tapes or foils. One of the main advantages of this manufacturing technique over traditional MMC methods is the ability to produce multimaterial structures through the layer-by-layer build-up procedure. The interface of an ultrasonically consolidated bimaterial interface has not been studied on the nanometer scale through transmission electron microscopy (TEM), which can help better understand the bonding mechanisms. An ultrasonically consolidated copper–aluminum (Cu–Al) interface was explored through TEM, through which a 1-µm recrystallized subgrain region was observed on the aluminum side and dislocation pile-up was viewed between the subgrain and bulk aluminum interface. Phase changes were suspected due to varying contrast bands parallel to the Cu–Al interface and were confirmed through an x-ray energy dispersive spectroscopy (XEDS) linescan. An apparent diffusion coefficient was calculated, which supported bulk diffusion at the measured welding temperature of 493 °C and subgrain size of 20–50 nm.

Keywords

transmission electron microscopydiffusionphase transformation
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 17: Focus Issue: The Materials Science of Additive Manufacturing , 14 September 2014 , pp. 1970 - 1977
Copyright
Copyright © Materials Research Society 2014 

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