Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-24T09:55:35.067Z Has data issue: false hasContentIssue false

A Thermo-Chemical Surface Treatment of AlN Powder for the Aqueous Processing of AlN Ceramics

Published online by Cambridge University Press:  03 March 2011

S.M. Olhero
Affiliation:
Department of Ceramics and Glass Engineering, CICECO, University of Aveiro, 3810-193 Aveiro, Portugal
S. Novak
Affiliation:
Engineering Ceramics Department, Jožef Stefan Institute, SI-1000 Ljubljana, Slovenia
M. Oliveira
Affiliation:
Department of Ceramics and Glass Engineering, CICECO, University of Aveiro, 3810-193 Aveiro, Portugal
K. Krnel
Affiliation:
Engineering Ceramics Department, Jožef Stefan Institute, SI-1000 Ljubljana, Slovenia
T. Kosmac
Affiliation:
Engineering Ceramics Department, Jožef Stefan Institute, SI-1000 Ljubljana, Slovenia
J.M.F. Ferreira
Affiliation:
Department of Ceramics and Glass Engineering, CICECO, University of Aveiro, 3810-193 Aveiro, Portugal
Get access

Abstract

Dense aluminum nitride ceramics were prepared by sintering green bodies at 1750 °C for 2 h. These green bodies were prepared by aqueous slip-casting from a powder that was surface-treated to prevent hydrolysis. The surface treatment of the aluminum nitride (AlN) powder consisted of dispersing the powder in warm-water solutions of aluminum dihydrogenphosphate Al(H2PO4)3. Different treatment temperatures in the range 30–80 °C were tested. For all the tested temperatures, the surface-treated AlN powder was found to be water-resistant, even after drying and/or redispersion. Various commercial dispersants were tested for their effectiveness, and the amount of dispersant was optimized in terms of a high solids loading of the suspension and an acceptable viscosity for slip casting. Based on these studies, a stable aqueous suspension of AlN powder, treated at 60 °C, with a total solids loading of 50 vol%, was prepared using CaF2 as a sintering additive. The well-dispersed powder made it possible to prepare green samples with close particle packing and relatively high sintered densities; that is, more than 96% of the theoretical density.

Type
Articles
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Iwase, N., Ueno, F., Yasumoto, T., Asai, H. and Anzai, K., Advancing Microelectronics 1-2, 24 (1994).Google Scholar
2Prohaska, G.W. and Miller, G.R. in Advanced Electronic Packaging Materials edited by Barfknecht, A.T., Partridge, J.P., Chen, C.J., and Li, C-Y., (Mater. Res. Soc. Symp. Proc. 167, Pittsburgh, PA, 1990) p. 215.Google Scholar
3Greil, P., Kulig, M., Hotza, D., Lange, H. and Tischtau, R., J. Eur. Ceram. Soc. 13, 229 (1994).CrossRefGoogle Scholar
4Oliveira, M., Olhero, S., Rocha, J. and Ferreira, J.M.F., J. Colloid Interface Sci. 261, 456 (2003).CrossRefGoogle Scholar
5Groat, E.A. and Mroz, T.J., Am. Ceram. Soc. Bull. 73, 75 (1994).Google Scholar
6Shimizu, Y., Hatano, J., Hyodo, T. and Egashira, M., J. Am. Ceram. Soc. 83, 2793 (2000).CrossRefGoogle Scholar
7Shimizu, Y., Kawanabe, K., Taky, Y., Takao, Y. and Egashira, M. in Ceramic Processing Science and Technology, Ceramic Transactions, edited by Hausner, H., Messing, G.L., and Hirano, S. (American Ceramic Society, Westerville, OH, 1995), 51 pp. 403407.Google Scholar
8Kosmac, T., Krnel, K. and Kos, K., International Patent No. WO 99/12850, 18.03 (1999).Google Scholar
9Uenishi, M.Hashizume, Y. and Yokote, T. U.S. Patent No. 4 923 689 (8 May 1990).Google Scholar
10Koh, Y-H., Choi, J-J. and Kim, H-E., J. Am. Ceram. Soc. 83, 306 (2000).CrossRefGoogle Scholar
11Krnel, K. and Kosmac, T., J. Am. Ceram. Soc. 83, 1375 (2000).CrossRefGoogle Scholar
12Shan, H.B., Zhu, Y. and Zhang, Z.T., British Ceramic Transactions 98, 146 (1999).CrossRefGoogle Scholar
13Krnel, K. and Kosmac, T., J. Eur. Ceram. Soc. 21, 2075 (2001).CrossRefGoogle Scholar
14Reetz, T., Monch, B. and Saupe, M., Ceramic Floor International/Ber. Deutsche Keramische Gesellschaft 69, 464 (1992).Google Scholar
15Fukumoto, S., Hookabe, T. and Tsubakino, H., J. Mater. Sci. 35, 2743 (2000).CrossRefGoogle Scholar
16Tarì, G., Ferreira, J.M.F., Fonseca, A.T. and Lyckfeldt, O., J. Eur. Ceram. Soc. 18, 249 (1998).CrossRefGoogle Scholar
17Olhero, S.M., and Ferreira, J.M.F., Powder Technology 139, 69–75 (2004).CrossRefGoogle Scholar
18Collins, E.A., Hoffmann, D.J. and Soni, P.L., J. Colloid Interface Sci, 71, 21 (1979).CrossRefGoogle Scholar
19Tarì, G., Ferreira, J.M.F. and Lyckfeldt, O., J. Eur. Ceram. Soc. 18, 479 (1998).CrossRefGoogle Scholar