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Textures of thin copper films

Published online by Cambridge University Press:  31 January 2011

W-M. Kuschke ,
A. Kretschmann ,
R-M. Keller ,
R. P. Vinci ,
C. Kaufmann  and
E. Arzt
W-M. Kuschke
Affiliation:
Max-Planck-Institut für Metallforschung and Institut für Metallkunde der Universität Stuttgart, Seestr. 71, 70174 Stuttgart, Germany
A. Kretschmann
Affiliation:
Max-Planck-Institut für Metallforschung and Institut für Metallkunde der Universität Stuttgart, Seestr. 71, 70174 Stuttgart, Germany
R-M. Keller
Affiliation:
Max-Planck-Institut für Metallforschung and Institut für Metallkunde der Universität Stuttgart, Seestr. 71, 70174 Stuttgart, Germany
R. P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305-2205
C. Kaufmann
Affiliation:
TU Chemnitz-Zwickau, Fakultät für Elektrotechnik und Informationstechnik, Zentrum für Mikrotechnologien, Reichenhainer Str. 70, 09126 Chemnitz, Germany
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung and Institut für Metallkunde der Universität Stuttgart, Seestr. 71, 70174 Stuttgart, Germany
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Abstract

The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presence or absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVD vs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 10 , October 1998 , pp. 2962 - 2968
Copyright
Copyright © Materials Research Society 1998

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References

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