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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Published online by Cambridge University Press:  03 March 2011

Y.C. Sohn ,
Jin Yu ,
S.K. Kang ,
D.Y. Shih  and
T.Y. Lee
Y.C. Sohn*
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
S.K. Kang
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
D.Y. Shih
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
T.Y. Lee
Affiliation:
Department of Materials Science and Engineering, Hanbat National University, San 16-1, DukMyoung-Dong, Yuseong-Gu, Deajeon 305-764, Korea
*
a)Address all correspondence to this author.e-mail: [email protected]
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Abstract

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt% P), and solder thickness (120 versus .200 μm). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 °C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni3Sn4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni3P layer formed a Ni3SnP layer and Ni3Sn4 IMCs spalled off the Ni3SnP surface. Dewetting of solder from the Ni3SnP layer, however, did not occur even after spalling of most IMCs.

Keywords

PlatingPackagingPaste
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 8 , August 2004 , pp. 2428 - 2436
Copyright
Copyright © Materials Research Society 2004

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