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Sedimentation of Cu-rich intermetallics in liquid lead-free solders

Published online by Cambridge University Press:  31 January 2011

Jenn-Ming Song ,
Yu-Lin Shen  and
Hsin-Yi Chuang
Jenn-Ming Song*
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
Yu-Lin Shen
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
Hsin-Yi Chuang
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn–Ag and Sn–Zn solders. Experimental results show that for the intermetallics investigated, Cu–Sn and Cu–Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu–Zn compounds, which took place in the Sn–Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

Keywords

AlloySolderingCompound
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 12 , December 2007 , pp. 3432 - 3439
Copyright
Copyright © Materials Research Society 2007

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References

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