Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-24T10:47:49.439Z Has data issue: false hasContentIssue false
  • English
  • Français

Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples

Published online by Cambridge University Press:  06 November 2013

Sinn-wen Chen ,
Che-wei Hsu ,
Shih-kang Lin  and
Chia-ming Hsu
Sinn-wen Chen*
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
Che-wei Hsu
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
Shih-kang Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan; Promotion Center for Global Materials Research, National Cheng Kung University, Tainan 701, Taiwan; and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan 701, Taiwan
Chia-ming Hsu
Affiliation:
Department of Chemical Engineering, National United University, Miaoli 360, Taiwan
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Interfacial reactions at 100 and 150 °C in the Sn–20.48 at.% In–3.05 at.% Ag (Sn–20.0 wt% In–2.8 wt% Ag)/Ni couples are studied. Three unusual phenomena are observed. First, liquation is found in Sn–20.48 at.% In–3.05 at.% Ag (Sn–In–Ag)/Ni couples that are reacted at 150 °C, which is lower than the melting points of both the solder and the Ni substrate. In addition to the Ni3Sn4 phase, liquid phase is formed in the reaction layer. Second, the liquid phase disappears and isothermal solidification occurs when there is prolonged isothermal heat treatment at 150 °C. The results are similar to those for transient liquid phase bonding. Third, the thickness of the reaction layer in Sn–In–Ag/Ni couples that are reacted for 1440 h at 150 °C is 40 times thicker than that of those reacted at 100 °C. The reaction mechanisms for these three unusual phenomena: liquation, isothermal solidification, and an extraordinary increase in the reaction rate for only 50 °C difference in temperature are elaborated and are related to each other.

Keywords

interfacial reactionliquationisothermal solidificationPb-free solder
Type
Articles
Information
Journal of Materials Research , Volume 28 , Issue 23 , 14 December 2013 , pp. 3257 - 3260
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Kang, S.K. and Ramachandran, V.: Growth-kinetics of intermetallic phases at the liquid Sn and solid Ni interface. Scr. Metall. 14(4), 421 (1980).Google Scholar
Chen, S.W., Chen, C.C., and Chang, C.H.: Interfacial reactions in Sn/Ni-7 wt.%V couple. Scr. Mater. 56(6), 453 (2007).Google Scholar
Haimovich, J.: Intermetallic compound growth in tin and tin-lead platings over nickel and its effects on solderability. Weld. J. 68(3), S102 (1989).Google Scholar
Chuang, T.H., Huang, K.W., and Lin, W.H.: Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions. J. Electron. Mater. 33(4), 374 (2004).CrossRefGoogle Scholar
Wu, H.M., Wu, F.C., and Chuang, T.H.: Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads. J. Electron. Mater. 34(11), 1385 (2005).Google Scholar
Huang, C.Y. and Chen, S.W.: Interfacial reactions in In-Sn/Ni couples and phase equilibria of the In-Sn-Ni system. J. Electron. Mater. 31(2), 152 (2002).CrossRefGoogle Scholar
Okamoto, H.: In-Ni (indium-nickel). J. Phase Equilib. 24(4), 379 (2003).Google Scholar
Okamoto, H.: In-Sn (indium-tin). J. Phase Equilib. Diffus. 27(3), 313 (2006).Google Scholar
Yeh, C.H., Chang, L.S., and Straumal, B.: Study on the solidus line in Sn-rich region of Sn-In phase diagram. J. Phase Equilib. Diffus. 30(3), 254 (2009).CrossRefGoogle Scholar
Chen, C.M. and Chen, S.W.: Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures. Acta Mater. 50(9), 2461 (2002).Google Scholar
Chen, S.W. and Lin, S.K.: Effects of temperature on interfacial reactions in gamma-InSn4/Ni couples. J. Mater. Res. 21(5), 1161 (2006).Google Scholar
Lin, S.K. and Chen, S.W.: Interfacial reactions in the Sn-20 at.% In/Cu and Sn-20 at.% In/Ni couples at 160 degrees C. J. Mater. Res. 21(7), 1712 (2006).Google Scholar
Chen, S.W., Lee, W.Y., Hsu, C.M., Yang, C.F., Hsu, H.Y., and Wu, H.J.: Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag interfacial reactions. Mater. Chem. Phys. 128(3), 357 (2011).Google Scholar
Macdonald, W.D. and Eagar, T.W.: Transient liquid-phase bonding. Annu. Rev. Mater. Sci. 22, 23 (1992).Google Scholar
Vanloo, F.J.J.: Multiphase diffusion in binary and ternary solid-state systems. Prog. Solid State Chem. 20(1), 47 (1990).Google Scholar