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The properties of thermal hillocks as a function of linewidth and process parameter in Al-on-chemical-vapor-deposited W films

Published online by Cambridge University Press:  31 January 2011

Carey A. Pico  and
Tom D. Bonifield
Carey A. Pico
Affiliation:
Texas Instruments, Inc., Corporate Research, Development, and Engineering, P.O. Box 655012, MS 944, Dallas, Texas 75265
Tom D. Bonifield
Affiliation:
Texas Instruments, Inc., Corporate Research, Development, and Engineering, P.O. Box 655012, MS 944, Dallas, Texas 75265
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Abstract

The formation of hillocks has been studied as a function of process parameter in patterned and unpatterned Al98.5wt. %Si1.0wt. %Cu0.5wt. % films deposited on chemical-vapor-deposited W-coated substrates. The effects of linewidth, substrate temperature during film deposition, and sintering time and temperature on hillock size were investigated. Three types of hillocks are found: the “surface hillocks”, the “side hillock”, and the “line hillock”. These are further classified by their shapes. The surface hillock and side hillock, which have been seen previously, form on patterned metal lines having linewidths greater than the larger Al alloy grain sizes (~3 μm). None is seen on linewidths between 0.9 and 2 μm where long-range grain boundary diffusion cannot occur. A new type of hillock, the line hillock, is seen to occur on metal structures having linewidths of 0.6 μm. The line hillock is inconsistent with the current understanding of hillock formation and may present severe restrictions on the downsizing of ultra-large-scale integrated devices.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 5 , May 1993 , pp. 1010 - 1018
Copyright
Copyright © Materials Research Society 1993

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