Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-30T19:00:47.432Z Has data issue: false hasContentIssue false
  • English
  • Français

Novel polyelectrolyte–Al2O3/SiO2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

Published online by Cambridge University Press:  03 January 2019

Tianxian Wang  and
Hong Lei Open the ORCID record for Hong Lei [Opens in a new window]
Tianxian Wang
Affiliation:
Research Center of Nano Science and Technology, Shanghai University, Shanghai 200444, China
Hong Lei*
Affiliation:
Research Center of Nano Science and Technology, Shanghai University, Shanghai 200444, China; and School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

A new type of polyelectrolyte–Al2O3/SiO2 composite nanoparticle with excellent dispersibility and superior polishing performance was successfully fabricated using a facile method. Silica acted as a bifunctional molecule by attaching to alumina via covalent bond and adsorbing polyelectrolytes by electrostatic interaction. The material removal rate of the polyelectrolyte–Al2O3/SiO2 abrasive was 30% higher than that of the pure Al2O3 abrasive. In addition, the sapphire surface was much smoother. The material removal mechanism was investigated during CMP using the microcontact and wear model. The enhanced removal rate was mainly attributed to the well-dispersed particles, which can accelerate mechanical removal process. The remarkably smooth surface was due to the decrease in penetration depth of the abrasive into the wafer. The results of this study provided a feasible strategy to satisfy the high efficiency and damage-free polishing requirements for sapphire planarization.

Keywords

new polyelectrolyte–Al2O3/SiO2 abrasivechemical mechanical polishingmechanismmaterial removal rateroughnesssapphire
Type
Article
Information
Journal of Materials Research , Volume 34 , Issue 6 , 28 March 2019 , pp. 1073 - 1082
Copyright
Copyright © Materials Research Society 2019 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Oksenberg, E., Sanders, E., Popovitz-Biro, R., Houben, L., and Joselevich, E.: Surface-guided CsPbBr3 perovskite nanowires on flat and faceted sapphire with size-dependent photoluminescence and fast photoconductive response. Nano Lett. 18, 424 (2017).CrossRefGoogle ScholarPubMed
Montagne, A., Pathak, S., Maeder, X., and Michler, J.: Plasticity and fracture of sapphire at room temperature: Load-controlled microcompression of four different orientations. Ceram. Int. 40, 2083 (2014).CrossRefGoogle Scholar
Chen, L., Liu, B.L., Ge, M.Y., Ma, Y.Q., Abbas, A.N., and Zhou, C.W.: Step-edge-guided nucleation and growth of aligned WSe2 on sapphire via a layer-over-layer growth mode. ACS Nano 9, 8368 (2015).CrossRefGoogle Scholar
Chambers, S.A., Droubay, T., Jennison, D.R., and Mattsson, T.R.: Laminar growth of ultrathin metal films on metal oxides: Co on hydroxylated alpha-Al2O3 (0001). Science 297, 827 (2002).CrossRefGoogle Scholar
Tseng, K.C., Yen, Y.T., Thomas, S.R., and Tsai, H.W.: A facile chemical-mechanical polishing lift-off transfer process toward large scale Cu(In, Ga)Se2 thin-film solar cells on arbitrary substrates. Nanoscale 8, 5181 (2016).CrossRefGoogle ScholarPubMed
Lin, Y.C., Jariwala, B., Bersch, B.M., and Xu, K.: Realizing large-scale electronic-grade two-dimensional semiconductors. ACS Nano 12, 965 (2018).CrossRefGoogle ScholarPubMed
Shih, T.S., Wei, P.S., and Wu, C.L.: Effect of abrasives on the glossiness and reflectance of anodized aluminum alloys. J. Mater. Sci. 43, 1851 (2008).CrossRefGoogle Scholar
Jin-Hyung, P., Hao, C., Yi, S.H., Jea-Gun, P., and Ungyu, P.: Effect of abrasive material properties on polishing rate selectivity of nitrogen-doped Ge2Sb2Te5 to SiO2 film in chemical mechanical polishing. J. Mater. Res. 23, 3323 (2008).Google Scholar
Galvin, S.P., Griffin, B.J., and Browne, J.: Imaging of surface strain and polishing artefacts in fused silica by environmental scanning electron microscopy. J. Mater. Sci. 36, 5683 (2001).CrossRefGoogle Scholar
Krishnan, M., Nalaskowski, J.W., and Cook, L.M.: Chemical mechanical planarization: Slurry chemistry, materials, and mechanisms. Chem. Rev. 110, 178 (2010).CrossRefGoogle ScholarPubMed
Abaneshwar, P., George, F., and Li, S.: The effect of polymer hardness, pore size, and porosity on the performance of thermoplastic polyurethane-based chemical mechanical polishing pads. J. Mater. Res. 28, 2380 (2013).Google Scholar
Chen, Y., Li, Z., Qin, J., and Chen, A.: Monodispersed mesoporous silica (mSiO2) spheres as abrasives for improved chemical mechanical planarization performance. J. Mater. Sci. 51, 5811 (2016).CrossRefGoogle Scholar
Zhang, Z., Liu, W., Song, Z., and Hu, X.: Two-step chemical mechanical polishing of sapphire substrate. J. Electrochem. Soc. 157, H688 (2010).CrossRefGoogle Scholar
Shi, X., Pan, G., Zhou, Y., Xu, L., Zou, C., and Gong, H.: A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing. Surf. Coat. Technol. 270, 206 (2015).CrossRefGoogle Scholar
He, Q.: Experimental study on polishing performance of CeO2 and nano-SiO2 mixed abrasive. Appl. Nanosci. 8, 1 (2018).CrossRefGoogle Scholar
Luo, Q.F., Lu, J., and Xu, X.P.: A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools. Wear 350–351, 99 (2016).CrossRefGoogle Scholar
Ahn, Y., Yoon, J.Y., Baek, C.W., and Kim, Y.K.: Chemical mechanical polishing by colloidal silica-based slurry for micro-scratch reduction. Wear 257, 785 (2004).CrossRefGoogle Scholar
Park, S.S., Cho, C.H., and Ahn, Y.: Hydrodynamic analysis of chemical mechanical polishing process. Tribol. Int. 33, 723 (2000).CrossRefGoogle Scholar
Hassanzadeh-Tabrizi, S.A., Mazaheri, M., Aminzare, M., and Sadrnezhaad, S.K.: Reverse precipitation synthesis and characterization of CeO2 nanopowder. J. Alloys Compd. 491, 499 (2010).CrossRefGoogle Scholar
Abiade, J.T., Choi, W., and Singh, R.K.: Effect of ph on ceria silica interactions during chemical mechanical polishing. J. Mater. Res. 20, 1139 (2005).CrossRefGoogle Scholar
Lei, H., Jiang, L., and Chen, R.: Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate. Powder Technol. 219, 99 (2012).CrossRefGoogle Scholar
Xu, Y., Lu, J., and Xu, X.: Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing. Appl. Surf. Sci. 389, 713 (2016).CrossRefGoogle Scholar
Lu, Z., Lee, S., Gorantla, V.R.K., Babu, S.V., and Matijevic, E.: Effects of mixed abrasives in chemical mechanical polishing of oxide films. J. Mater. Res. 18, 2323 (2003).CrossRefGoogle Scholar
Liu, T. and Lei, H.: Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers. Appl. Surf. Sci. 413, 16 (2017).CrossRefGoogle Scholar
Alliaume, A. and Charpentier, A.: Silica abrasives containing solid cores and mesoporous shells: Synthesis, characterization and polishing behavior for SiO2 film. J. Alloys Compd. 663, 60 (2016).Google Scholar
Chen, Y., Zuo, C., Li, Z., and Chen, A.: Design of ceria grafted mesoporous silica composite particles for high-efficiency and damage-free oxide chemical mechanical polishing. J. Alloys Compd. 736, 276 (2018).CrossRefGoogle Scholar
Peedikakkandy, L., Kalita, L., Kavle, P., Kadam, A., Gujar, V., Arcot, M., and Bhargava, P.: Preparation of spherical ceria coated silica nanoparticle abrasives for CMP application. Appl. Surf. Sci. 357, 1306 (2015).CrossRefGoogle Scholar
Chen, A., Mu, W., and Chen, Y.: Compressive elastic moduli and polishing performance of non-rigid core/shell structured PS/SiO2 composite abrasives evaluated by AFM. Appl. Surf. Sci. 290, 433 (2014).CrossRefGoogle Scholar
Lei, Z., Wang, H., Zhang, Z., Fei, Q., Liu, W., and Song, Z.: Preparation of monodisperse polystyrene/silica core–shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper. Appl. Surf. Sci. 258, 1217 (2011).Google Scholar
Yang, J., Lind, J.U., and Trogler, W.C.: Synthesis of hollow silica and titania nanospheres. Chem. Mater. 20, 2875 (2012).CrossRefGoogle Scholar
Coutinho, C.A., Mudhivarthi, S.R., Kumar, A., and Gupta, V.K.: Novel ceria-polymer microcomposites for chemical mechanical polishing. Appl. Surf. Sci. 255, 3090 (2008).CrossRefGoogle Scholar
Chaudhuri, R.G. and Paria, S.: Core/shell nanoparticles: Classes properties synthesis mechanisms characterization and applications. Chem. Rev. 112, 2373 (2012).CrossRefGoogle Scholar
Penta, N.K., Dandu Veera, P.R., and Babu, S.V.: Role of poly(diallyldimethylammonium chloride) in selective polishing of polysilicon over silicon dioxide and silicon nitride films. Langmuir 27, 3502 (2011).CrossRefGoogle ScholarPubMed
Zhou, W.C., Li, K.W., Wei, Y.L., Hao, P., Chi, M.B., Liu, Y.S., and Wu, Y.H.: Ultrasensitive label-free optical microfiber coupler biosensor for detection of cardiac troponin I based on interference turning point effect. Biosens. Bioelectron. 106, 99 (2018).CrossRefGoogle ScholarPubMed
Martins, J.G., De, A.O., Garcia, P.S., Kipper, M.J., and Martins, A.F.: Durable pectin/chitosan membranes with self-assembling water resistance and enhanced mechanical properties. Carbohydr. Polym. 188, 136 (2018).CrossRefGoogle ScholarPubMed
Ryan, J.D., Mengistie, D.A., Gabrielsson, R., Lund, A., and Muller, C.: Machine-washable PEDOT: PSS dyed silk yarns for electronic textiles. ACS Appl. Mater. Interfaces 9, 9045 (2017).CrossRefGoogle ScholarPubMed
Yang, Y.L., Chen, M.T., Zou, S.Q., Yang, X.L., Long, T.E., and He, Z.: Efficient recovery of polyelectrolyte draw solutes in forward osmosis towards sustainable water treatment. Desalination 422, 134 (2017).CrossRefGoogle Scholar
Haver, L.V. and Nayar, S.: Polyelectrolyte flocculants in harvesting microalgal biomass for food and feed applications. Algal Res. 24, 167 (2017).CrossRefGoogle Scholar
Wang, N.X., Ji, S.L., Zhang, G.J., Li, J., and Wang, L.: Self-assembly of graphene oxide and polyelectrolyte complex nanohybrid membranes for nanofiltration and pervaporation. Chem. Eng. J. 213, 318 (2012).CrossRefGoogle Scholar
Liu, J.F., Gilbert Min, A., and Ducker, W.A.: AFM study of adsorption of cationic surfactants and cationic polyelectrolytes at the silica–water interface. Langmuir 17, 4895 (2001).CrossRefGoogle Scholar
Hanada, T. and Soga, N.: Coordination and bond character of silicon and aluminum ions in amorphous thin films in the system SiO2–Al2O3. J. Am. Ceram. Soc. 65, c84 (2010).CrossRefGoogle Scholar
Messing, G.L., Hirano, S., and Hausner, H.: Ceramic Powder Science III (The American Ceramic Society, Columbus, 1990); p. 241.Google Scholar
Schwarz, B. and Schönhoff, M.: Surface potential driven swelling of polyelectrolyte multilayers. Langmuir 18, 2964 (2002).CrossRefGoogle Scholar
Li, H. and Tripp, C.P.: Infrared study of the interaction of charged silica particles with TiO2 particles containing adsorbed cationic and anionic polyelectrolytes. Langmuir 21, 2585 (2005).CrossRefGoogle ScholarPubMed
Penta, N.K., Veera, P.R., and Babu, S.V.: Charge density and pH effects on polycation adsorption on poly-Si, SiO2, and Si3N4 films and impact on removal during chemical mechanical polishing. ACS Appl. Mater. Interfaces 3, 4126 (2011).CrossRefGoogle ScholarPubMed
Lee, H., Lee, D., and Jeong, H.: Mechanical aspects of the chemical mechanical polishing process: A review. Int. J. Precis. Eng. Manuf. 17, 525 (2016).CrossRefGoogle Scholar
Pitts, J.R., Thomas, T.M., Czanderna, A.W., and Passler, M.: XPS and ISS of submonolayer coverage of Ag on SiO2. Appl. Surf. Sci. 26, 107 (1986).CrossRefGoogle Scholar
Barr, T.L.: An ESCA study of termination of the passivation of elemental metals. J. Phys. Chem. 16, 1801 (1978).CrossRefGoogle Scholar
Zhao, Y. and Chang, L.: A micro-contact and wear model for chemical–mechanical polishing of silicon wafers. Wear 25, 220 (2002).CrossRefGoogle Scholar
Kramer, G., Estel, K., Schmitt, F.J., and Jacobasch, H.J.: Laterally resolved measurement of interaction forces between surfaces that are partly covered with polyelectrolytes. J. Colloid Interface Sci. 208, 302 (1998).CrossRefGoogle ScholarPubMed