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Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films

Published online by Cambridge University Press:  23 November 2011

Mu-Lung Che ,
Jun-Yuan Teng ,
Po-Cheng Lai  and
Jihperng Leu
Mu-Lung Che
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Taiwan 30010, Republic of China
Jun-Yuan Teng
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Taiwan 30010, Republic of China
Po-Cheng Lai
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Taiwan 30010, Republic of China
Jihperng Leu*
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Taiwan 30010, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Two high-temperature pore generators (porogens) have been used to study the effect of porogen structure on moisture uptake and k-value in methylsilsesquioxane/porogen hybrid films and their corresponding porous films in a postintegration porogen removal scheme. Poly(styrene-b-4-vinylpyridine) containing di-block structure and pyridine polar group leads to higher moisture uptake and k-value in the hybrid films as compared to poly(styrene-block-butadiene-block-styrene) with symmetrical structure and nonpolar groups. Moreover, the moisture uptake behavior in both as-prepared hybrid films is in physical sorption mode based on their reversible adsorption–desorption curve measured by quartz crystal microbalance. After porogen removal, the k-values of porous films are favorably not influenced by porogen structures, and their moisture uptake is as low as 1.78 wt% even at 40 vol.% porosity. However, based on the simulation of the modified-Rayleigh model, the porous films are found to possess 0.4 vol.% chemisorbed moisture on the pore surface, resulting in 17–23% deviation from the ideal k-values.

Keywords

DielectricWaterAdsorption
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 23 , 14 December 2011 , pp. 2987 - 2995
Copyright
Copyright © Materials Research Society 2011

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