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Microstructure and thermal stability of an ultrafine Al/Al2O3 composite

Published online by Cambridge University Press:  31 January 2011

Zhiqing Yang
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People's Republic of China
Lianlong He
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People's Republic of China
Ji Chen
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People's Republic of China
Hongtao Cong
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People's Republic of China
Hengqiang Ye
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People's Republic of China
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Abstract

Studies were carried out on the microstructure and thermal stability of an ultrafine Al/Al2O3 composite with high strength and low density. Transmission electron microscopy indicated that Al2O3 shells remained undeformed below 550 °C, which limited grain growth of Al. Both transmission electron microscopy and x-ray diffraction analysis indicated that no obvious grain growth of Al with time occurred upon annealing at 620 °C. After almost all the alumina shells were destroyed following annealing at 620 °C, the Al2O3 fragments with various morphologies distributed in the material could still limit the migration of Al grain boundaries to increase the thermal stability of the material. After Al melted and resolidified, the grain sizes of Al were still about 200 nm. The bulk composite sample showed good dimensional stability. Even if the Al grains melted, the network of Al2O3 fragments kept the sample from deforming due to the wetting of Al2O3 network with liquid Al.

Type
Articles
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

Sánchez-López, J.C., González-Elipe, A.R., and Ferández, A., J. Mater. Res. 13, 703 (1998).CrossRefGoogle Scholar
Apte, P., Suits, B.H., and Siegel, R.W., Nanostruct. Mater. 9, 501 (1997).CrossRefGoogle Scholar
Sun, X.K., Cong, H.T., Sun, M., and Yang, M.C., Metall. Mater. Trans. 31A, 1017 (2000).CrossRefGoogle Scholar
Sánchez-López, J.C., González-Elipe, A.R., Conde, C.F., Conde, A., Morant, C., and Sanz, J.M., Nanostruct. Mater. 7, 813 (1996).CrossRefGoogle Scholar
Li, D.X., Ping, D.H., Ye, H.Q., Qin, X.Y., and Wu, X.J., Mater. Lett. 18, 29 (1993).CrossRefGoogle Scholar
Ping, D.H., Li, D.X., and Ye, H.Q., J. Mater. Sci. Lett. 14, 1536 (1995).CrossRefGoogle Scholar
Huang, J.Y., Ye, L.L., Wu, Y.K., and Ye, H.Q., Acta Mater. 44, 1781 (1996).CrossRefGoogle Scholar
Suits, B.H., Apte, P., Wilken, D.E., and Siegel, R.W., Nanostruct. Mater. 6, 609 (1995).CrossRefGoogle Scholar
Yang, Z.Q., He, L.L., Chen, J., Cong, H.T., and Ye, H.Q., Chin, . J. Mater. Res. 16, 225 (2002).Google Scholar
Saka, H., Nishikawa, Y., and Imura, T., Philos. Mag. A 57, 895 (1988).CrossRefGoogle Scholar
Jiang, H.G., Ruhle, M., and Lavernia, E.J., J. Mater. Res. 14, 549 (1999).CrossRefGoogle Scholar
Delannay, F., Froyen, L., and Deruyttere, A., J. Mater. Sci. 22, 1 (1987).CrossRefGoogle Scholar
Li, J., Rare Met. 10, 255 (1991).Google Scholar
Oh, S.Y., Cornie, J.A., and Russell, K.C., Metall. Trans. 20A, 527 (1989).CrossRefGoogle Scholar
Trumble, K.P., Acta Mater. 46, 2363 (1998).CrossRefGoogle Scholar
Smithells, J.C., Metals Reference Book (Butterworth, London, U.K., 1962), Vol. 2, p. 698.Google Scholar
Campbell, T., Kalia, R.K., Nakano, A., Vashishta, P., Ogata, S., and Rodgers, S., Phys. Rev. Lett. 82, 4866 (1999).CrossRefGoogle Scholar