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Micromechanical modeling of ferroelectric films

Published online by Cambridge University Press:  01 March 2006

J.E. Huber
J.E. Huber*
Affiliation:
Department of Engineering Science, University of Oxford, Oxford OX1 3PJ, United Kingdom
*
a) Address all correspondence to this author. e-mail: [email protected] This paper was selected as the Outstanding Meeting Paper for the 2005 MRS Spring Meeting Symposium CC Proceedings, Vol. 881E.
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Abstract

Ferroelectric films are growing in significance as non-volatile memory devices, sensors, and microactuators. The stress state of the film, induced by processing or constraints such as the substrate, strongly affects device behavior. Thus, it is important to be able to model the coupled and constrained behavior of film material. This work presents a preliminary study of the application of micromechanical modeling to ferroelectric films. A self-consistent micromechanics model developed for bulk ferroelectrics is adapted for thin film behavior by incorporating several features of the microstructure, mechanical clamping by the substrate, residual stresses, and the crystallographic orientation of the film.

Keywords

FerroelectricFilmSimulation
Type
Outstanding Meeting Papers
Information
Journal of Materials Research , Volume 21 , Issue 3 , March 2006 , pp. 557 - 562
Copyright
Copyright © Materials Research Society 2006

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References

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