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Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

Published online by Cambridge University Press:  17 November 2011

Dong Min Jang  and
Jin Yu
Dong Min Jang
Affiliation:
Samsung Electronics, Hwasung-City, Gyeongii-Do 445-701, Korea
Jin Yu*
Affiliation:
Electronic Packaging Laboratory, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Yuseong-gu, Daejeon 305-701, Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Ternary electroless nickel, NiXP, films were produced by adding salts of Mo, Re, Tl, Cu, W, Co, Fe, Zn, and Mn to conventional electroless Ni baths and subsequently reacted with Sn-3.5Ag solder. From the full width at the half maximum (FWHM) data, as-plated NiXP films can be categorized into two groups: one is close to the FWHM value of nanocrystalline Ni5P film and the other is close to amorphous Ni9P film. Alloying elements in the electrolessly plated under-bump metallurgy that effectively suppressed intermetallic compound (IMC) spalling were Mn, Zn, Re, Fe, and W, whereas Tl exacerbated spalling. The roles of Cu, Mo, and Co were less clear due to a lack of data. Based on scanning electron microscopy observations, a spalling map was presented, which showed elemental demarcation lines of IMC spalling in the X-P coordinates.

Keywords

SolderingBondingPackaging
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 24 , 28 December 2011 , pp. 3032 - 3037
Copyright
Copyright © Materials Research Society 2011

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