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Influence of stacking-fault energy on the accommodation of severe shear strain in Cu-Al alloys during equal-channel angular pressing

Published online by Cambridge University Press:  31 January 2011

Xianghai An ,
Qingyun Lin ,
Shen Qu ,
Gang Yang ,
Shiding Wu  and
Zhe-Feng Zhang
Shen Qu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Gang Yang
Affiliation:
Central Iron and Steel Research Institute, Beijing 100081, China
Shiding Wu*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Zhe-Feng Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
*
a) e-mail: [email protected]
b) e-mail: [email protected]
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Abstract

X-ray diffraction (XRD) and transmission electron microscope (TEM) investigations have been carried out to decode the influence of stacking-fault energy (SFE) on the accommodation of large shear deformation in Cu-Al alloys subjected to one-pass equal-channel angular pressing. XRD results exhibit that the microstrain and density of dislocations initially increased with the reduction in the SFE, whereas they sharply decreased with a further decrease in SFE. By systematic TEM observations, we noticed that the accommodation mechanism of intense shear strain was gradually transformed from dislocation slip to deformation twin when SFE was lowered. Meanwhile, twin intersections and internal twins were also observed in the Cu-Al alloy with extremely low SFE. Due to the large external plastic deformation, microscale shear bands, as an inherent deformation mechanism, are increasingly significant to help carry the high local plasticity because low SFE facilitates the formation of shear bands.

Keywords

AlloyCold workingMicrostructure
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 12 , December 2009 , pp. 3636 - 3646
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1.Valiev, R.Z., Islamgaliev, R.K., and Alexandrov, I.V.: Bulk nanostructured materials from severe plastic deformation. Prog. Mater. Sci. 45, 103 (2000).CrossRefGoogle Scholar
2.Valiev, R.Z. and Langdon, T.G.: Principles of equal-channel angular pressing as a processing tool for grain refinement. Prog. Mater. Sci. 51, 881 (2006).CrossRefGoogle Scholar
3.Gleiter, H.: Nanostructured materials: Basic concepts and microstructure. Acta Mater. 48, 1 (2000).CrossRefGoogle Scholar
4.Iwahashi, Y., Horita, Z., Nemoto, M., and Langdon, T.G.: The process of grain refinement in equal-channel angular pressing. Acta Mater. 46, 3317 (1998).CrossRefGoogle Scholar
5.Dalla Torre, F., Lapovok, R., Sandlin, J., Thomson, P.F., Davies, C.H.J., and Pereloma, E.V.: Microstructures and properties of copper processed by equal channel angular extrusion for 1–16 passes. Acta Mater. 52, 4819 (2004).CrossRefGoogle Scholar
6.Xue, Q., Beyerlein, I.J., Alexander, D.J., and Gray, G.T. III: Mechanisms for initial grain refinement in OFHC copper during equal channel angular pressing. Acta Mater. 55, 655 (2007).CrossRefGoogle Scholar
7.Han, W.Z., Zhang, Z.F., Wu, S.D., and Li, S.X.: Influences of crystallographic orientations on deformation mechanism and grain refinement of Al single crystals subjected to one-pass equal-channel angular pressing. Acta Mater. 55, 5889 (2007).CrossRefGoogle Scholar
8.Huang, C.X., Wang, K., Wu, S.D., Zhang, Z.F., Li, G.Y., and Li, S.X.: Deformation twinning in polycrystalline copper at room temperature and low strain rate. Acta Mater. 54, 655 (2006).CrossRefGoogle Scholar
9.Komura, S., Horita, Z., and Nemoto, M.: Influence of stacking fault energy on microstructural development in equal channel angular pressing. J. Mater. Res. 14, 4044 (1999).CrossRefGoogle Scholar
10.Huang, C.X., Gao, Y.L., Yang, G., Wu, S.D., Li, G.Y., and Li, S.X.: Bulk nanocrystalline stainless steel fabricated by equal channel angular pressing. J. Mater. Res. 21, 1687 (2006).CrossRefGoogle Scholar
11.An, X.H., Han, W.Z., Huang, C.X., Zhang, P., Yang, G., Wu, S.D., and Zhang, Z.F.: High strength and utilizable ductility of bulk ultrafine-grained Cu–Al alloys. Appl. Phys. Lett. 92, 201915 (2008).CrossRefGoogle Scholar
12.Yapici, G.G., Karaman, I., Luo, Z.P., Maier, H.J., and Chumlyakov, Y.I.: Microstructural refinement and deformation twinning during severe plastic deformation of 316L stainless steel at high temperatures. J. Mater. Res. 19, 2268 (2004).CrossRefGoogle Scholar
13.Qu, S., An, X.H., Yang, H.J., Huang, C.X., Yang, G., Zang, Q.S., Wang, Z.G., Wu, S.D., and Zhang, Z.F.: Microstructural evolution and mechanical properties of Cu–Al alloys subjected to equal channel angular pressing. Acta Mater. 57, 1586 (2009).CrossRefGoogle Scholar
14.Han, W.Z., Wu, S.D., Huang, C.X., Li, S.X., and Zhang, Z.F.: Orientation design for enhancing deformation twinning in Cu single crystal subjected to equal channel angular pressing. Adv. Em. Mater. 10, 1110 (2008).CrossRefGoogle Scholar
15.Zhilyaev, A.P., Nurislamova, G.V., Kim, B-K., Baro, M.D., Szpunar, J.A., and Langdon, T.G.: Experimental parameters influencing grain refinement and microstructural evolution during high-pressure torsion. Acta Mater. 51, 753 (2003).CrossRefGoogle Scholar
16.Xu, C., Horita, Z., and Langdon, T.G.: The evolution of homogeneity in processing by high-pressure torsion. Acta Mater. 55, 203 (2007).CrossRefGoogle Scholar
17.Zhao, Y.H., Zhu, Y.T., Liao, X.Z., Horita, Z., and Langdon, T.G.: Tailoring stacking fault energy for high ductility and high strength in ultrafine grained Cu and its alloy. Appl. Phys. Lett. 89, 121906 (2006).CrossRefGoogle Scholar
18.Saito, Y., Utsunomiya, H., Tsuji, N., and Sakai, T.: Novel ultra-high straining process for bulk materials—Development of the accumulative roll-bonding (ARB) process. Acta Mater. 47, 579 (1999).CrossRefGoogle Scholar
19.Wang, Y.M., Chen, M.W., Sheng, H.W., and Ma, E.: Nanocrystalline grain structures developed in commercial purity Cu by low-temperature cold rolling. J. Mater. Res. 17, 3004 (2002).CrossRefGoogle Scholar
20.Li, Y.S., Tao, N.R., and Lu, K.: Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures. Acta Mater. 56, 230 (2008).CrossRefGoogle Scholar
21.Zhang, Y., Tao, N.R., and Lu, K.: Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles. Acta Mater. 56, 2429 (2008).CrossRefGoogle Scholar
22.Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation. Acta Mater. 57, 761 (2009).CrossRefGoogle Scholar
23.Han, B.Q., Mohamed, F.A., and Lavernia, E.J.: Mechanical properties of iron processed by severe plastic deformation. Metall. Mater. Trans. A 34, 71 (2003).CrossRefGoogle Scholar
24.Shin, D.H., Kim, I., Kim, J., Kim, Y.S., and Semiatin, S.L.: Microstructure development during equal-channel angular pressing of titanium. Acta Mater. 51, 983 (2003).CrossRefGoogle Scholar
25.Meyers, M.A. and Chawla, K.K.: Mechanical Behavior of Materials (Prentice Hall, NJ, 1999).Google Scholar
26.Dieter, G.E.: Mechanical Metallurgy, 3rd ed. (McGraw-Hill, Boston, 1986).Google Scholar
27.Hirth, J.P.: Theory of Dislocation, 2nd ed. (John Wiley & Sons, 1982).Google Scholar
28.Humphreys, F.J. and Hatherly, M.: Recrystallization and Related Annealing Phenomena, 2nd ed. (Elsevier, Oxford, 2004).Google Scholar
29.Han, W.Z., Zhang, Z.F., Wu, S.D., and Li, S.X.: Combined effects of crystallographic orientation, stacking fault energy and grain size on deformation twinning in FCC crystals. Philos. Mag. 88, 3011 (2008).CrossRefGoogle Scholar
30.Zhilyaev, A.P., Kim, B-K., Szpunar, J.A., Baró, M.D., and Langdon, T.G.: The microstructural characteristics of ultrafine-grained nickel. Mater. Sci. Eng., A 391, 377 (2005).CrossRefGoogle Scholar
31.Wang, Z.W., Wang, Y.B., Liao, X.Z., Zhao, Y.H., Lavernia, E.J., Zhu, Y.T., Horita, Z., and Langdon, T.G.: Influence of stacking fault energy on deformation mechanism and dislocation storage capacity in ultrafine-grained materials. Scr. Mater. 60, 52 (2009).CrossRefGoogle Scholar
32.Iwahashi, Y., Wang, J.T., Horita, Z., Nemoto, M., and Langdon, T.G.: Principle of equal-channel angular pressing for the processing of ultra-fine grained materials. Scr. Mater. 35, 143 (1996).CrossRefGoogle Scholar
33.Klug, H.P. and Alexander, L.E.: Diffraction Procedures for Polycrystalline and Amorphous Materials (Wiley, New York, 1974).Google Scholar
34.Rohatgi, A. and Vecchio, K.S.: The variation of dislocation density as a function of the stacking fault energy in shock-deformed FCC materials. Mater. Sci. Em., A 328, 256 (2002).Google Scholar
35.Williamson, G.K. and Smallman, R.E.: Dislocation densities in some annealed and cold-worked metals from measurements on the x-ray Debye-Scherrer spectrum. Philos. Mag. 1, 34 (1956).CrossRefGoogle Scholar
36.Hughes, D.A., Hansen, N., and Bammann, D.J.: Geometrically necessary boundaries, incidental dislocation boundaries and geometrically necessary dislocations. Scr. Mater. 48, 147 (2003).CrossRefGoogle Scholar
37.Ashby, M.F.: The deformation of plastically non-homogeneous materials. Philos. Mag. 21, 399 (1970).CrossRefGoogle Scholar
38.Gao, H., Huang, Y., Nix, W.D., and Hutchinson, J.W.: Mechanism-based strain gradient plasticity—I. Theory. J. Mech. Phys. Solids 47, 1263 (1999).CrossRefGoogle Scholar
39.Hatherly, M. and Malin, A.S.: Deformation of copper and low stacking-fault energy, copper base alloys. Met. Tech. 6, 308 (1979).CrossRefGoogle Scholar
40.Hong, S.I.: Cyclic stress-strain response and slip mode modification in fatigue of f.c.c. solid solutions. Scr. Mater. 44, 995 (2001).CrossRefGoogle Scholar
41.Paul, H., Driver, J.H., and Jasieński, Z.: Shear banding and recrystallization nucleation in a Cu–2%Al alloy single crystal. Acta Mater. 50, 815 (2002).CrossRefGoogle Scholar
42.Müllner, P. and Romanov, A.E.: Internal twinning in deformation twinning. Acta Mater. 48, 2323 (2000).CrossRefGoogle Scholar
43.Kuhlmann-Wilsdorf, D.: Theory of plastic deformation: Properties of low-energy dislocation structures. Mater. Sci. Eng., A 113, 1 (1989).CrossRefGoogle Scholar
44.Kuhlmann-Wilsdorf, D.: Deformation bands, the LEDS theory, and their importance in texture development: Part II. Theoretical conclusions. Metall. Mater. Trans. A 35, 369 (2004).CrossRefGoogle Scholar
45.Gubicza, J., Chinh, N.Q., Lábár, J.L., Hegedüs, Z., Xu, C., and Langdon, T.G.: Microstructure and yield strength of severely deformed silver. Scr. Mater. 58, 775 (2008).CrossRefGoogle Scholar