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In situ Transmission Electron Microscopy Observations of Toughening Mechanisms in Ultra-fine Grained Columnar Aluminum Thin Films

Published online by Cambridge University Press:  01 July 2005

K. Hattar
Affiliation:
Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801
J. Han
Affiliation:
Department of Mechanical and Industrial Engineering, University of Illinois, Urbana, Illinois 61801
M.T.A. Saif
Affiliation:
Department of Mechanical and Industrial Engineering, University of Illinois, Urbana, Illinois 61801
I.M. Robertson*
Affiliation:
Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801
*
a)Address all correspondence to this author. e-mail: [email protected] This author was an editor of this focus issue during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/publications/jmr/policy.html.
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Abstract

A unique straining device, fabricated using microlithographic techniques, has been developed to permit real-time investigation in the transmission electron microscope (TEM) of the deformation and failure mechanisms in ultrafine-grained aluminum. The tensile specimen is a freestanding thin film with a columnar microstructure that has a uniform cross-section (100 × 0.125 μm) and a gauge length of 300 μm. In situ TEM straining experiments show the fracture mode is intergranular with no accompanying general plasticity. Propagating cracks were halted at large grains, and crack blunting occurred through grain-boundary-mediated processes. The blunting process was accompanied by dislocation emission and deformation twinning in the grain responsible for arresting the crack. Voids or microcracks nucleated and grew on grain boundaries ahead of the arrested crack, and crack advance occurred through linkage of the microcracks and the primary crack.

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Articles
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1Swygenhoven, H.V., Spaczer, M., Farkas, D. and Caro, A.: The role of grain size and the presence of low and high angle grain boundaries in the deformation mechanism of nanophase Ni: A molecular-dynamics computer simulation. Nanostruc. Mater. 12, 323 (1999).CrossRefGoogle Scholar
2Swygenhoven, H.V., Spaczer, M., Caro, A. and Farkas, D.: Competing plastic deformation mechanisms in nanophase metals. Phys. Rev. B 60, 22 (1999).CrossRefGoogle Scholar
3Swygenhoven, H.V., Farkas, D. and Caro, A.: Grain-boundary structures in polycrystalline metals at the nanoscale. Phys. Rev. B 62, 831 (2000).CrossRefGoogle Scholar
4Yamakov, V., Wolf, D., Salazar, M., Phillpot, S.R. and Gleiter, H.: Length-scale effects in the nucleation of extended dislocations in nanocrystalline Al by molecular-dynamics simulation. Acta Mater. 49, 2713 (2001).CrossRefGoogle Scholar
5Farkas, D., Van Swygenhoven, H. and Derlet, P.M.: Intergranular fracture in nanocrystalline metals. Phys. Rev. B 66, 060101 (2002).CrossRefGoogle Scholar
6Kadau, K., Germann, T.C., Lomdahl, P.S., Holian, B.L., Kadau, D., Entel, P., Kreth, M., Westerhoff, F. and Wolf, D.E.: Molecular-dynamics study of mechanical deformation in nano-crystalline aluminum. Metall. Mater. Trans. A 35A, 2719 (2004).CrossRefGoogle Scholar
7Froseth, A.G., Derlet, P.M. and Van Swygenhoven, H.: Dislocations emitted from nanocrystalline grain boundaries: Nucleation and splitting distance. Acta Mater. 52, 5863 (2004).Google Scholar
8Qi, Y. and Cheng, Y-T.: In Molecular Dynamic Simulation of Deformation and Fracture in Nanocrystalline Ag and Nano-composite AgNi, Presented at the MRS 2004 Fall Meeting, Boston, MA. V6.7.Google Scholar
9Yamakov, V., Wolf, D., Phillpot, S.R., Mukherjee, A.K. and Gleiter, H.: Deformation-mechanism map for nanocrystalline metals by molecular-dynamics simulation. Nat. Mater. 3, 43 (2004).CrossRefGoogle ScholarPubMed
10Swygenhoven, H.V., Derlet, P.M. and Frøseth, A.G.: Stacking fault energies and slip in nanocrystalline metals. Nat. Mater. 3, 399 (2004).CrossRefGoogle ScholarPubMed
11Derlet, P.M. and Van Swygenhoven, H.: The role played by two parallel free surfaces in the deformation mechanism of nanocrystalline metals: A molecular dynamics simulation. Philos. Mag. 82, 1 (2002).CrossRefGoogle Scholar
12Shan, Z., Stach, E.A., Wiezorek, J.M.K., Knapp, J.A., Forstaedt, D.M. and Mao, S.X.: Grain boundary-mediated plasticity in nanocrystalline nickel. Science 305, 654 (2004).Google Scholar
13Mitra, R., Chiou, W-A. and Weertman, J.R.: In situ study of deformation mechanisms in sputtered free-standing nanocrystalline nickel films. J. Mater. Res. 19, 1029 (2004).Google Scholar
14Milligan, W.W., Hackney, S.A., Ke, M. and Aifantis, E.C.: In situ studies of deformation and fracture in nanophase materials. Nanostruc. Mater. 2, 267 (1993).CrossRefGoogle Scholar
15Kumar, K.S., Van Swygenhoven, H. and Suresh, S.: Mechanical behavior of nanocrystalline metals and alloys. Acta Mater. 51, 5743 (2003).Google Scholar
16Kumar, K.S., Suresh, S., Chisholm, M.F., Horton, J.A. and Wang, P.: Deformation of electrodeposited nanocrystalline nickel. Acta Mater. 51, 387 (2003).CrossRefGoogle Scholar
17Hugo, R.C., Kung, H., Weertman, J.R., Mitra, R., Knapp, J.A. and Follstaedt, D.M.: In-situ TEM tensile testing of DC magnetron sputtered and pulsed laser deposited Ni thin films. Acta Mater. 51, 1937 (2003).CrossRefGoogle Scholar
18Haque, M.A. and Saif, M.T.A.: Deformation mechanisms in free-standing nanoscale thin films: a quantitative in-situ TEM study. Proc. Natl. Acad. Sci. U.S.A. 101, 6335 (2004).CrossRefGoogle Scholar
19Haque, M.A. and Saif, M.T.A.: A review of MEMS-based microscale and nanoscale tensile and bending testing. Expt. Mech. 43, 248 (2003).CrossRefGoogle Scholar
20Haque, M.A. and Saif, M.T.A.: Application of MEMS force sensors for in situ mechanical characterization of nano-scale thin films in SEM and TEM. Sens. Actuators A. 97–98, 239 (2002).CrossRefGoogle Scholar
21Haque, M.A. and Saif, M.T.A.: Microscale materials testing using MEMS actuators. J. Microelectromech. Syst. 10, 146 (2001).CrossRefGoogle Scholar
22Saif, M.T.A., Zhang, S., Haque, A. and Hsia, K.J.: Effect of native Al2O3 on the elastic response of nanoscale Al films. Acta Mater. 50, 2779 (2002).CrossRefGoogle Scholar
23 The dynamic events can be difficult to appreciate from the static images presented in published images. Representative videos showing the events described in the manuscript can be found at http://robertson.mse.uiuc.edu/Hattar/hattar.htm.Google Scholar
24Haque, M.A. and Saif, M.T.A.: Mechanical behavior of 30–50 nm thick aluminum films under uniaxial tension. Scripta Mater. 47, 863 (2002).CrossRefGoogle Scholar
25Lee, T.C., Robertson, I.M. and Birnbaum, H.K.: HVEM in situ deformation study of nickel doped with sulfur. Acta Metall. 37, 407 (1989).CrossRefGoogle Scholar
26Witkin, D., Lee, Z., Rodriguez, R., Nutt, S. and Lavernia, E.: Al–Mg alloy engineered with bimodal grain size for high strength and increased ductility. Scripta Mater. 49, 297 (2003).CrossRefGoogle Scholar
27Van Swygenhoven, H., Torre, F. Dalla and Victoria, M.: Nanocrystalline electrodeposited Ni: Microstructure and tensile properties. Acta Mater. 50, 3957 (2002).Google Scholar
28Sanders, P.G., Eastman, J.A. and Weertman, J.R.: Elastic and tensile behavior of nanocrystalline copper and palladium. Acta Mater. 45, 4019 (1997).CrossRefGoogle Scholar
29Wang, Y.M. and Ma, E.: Strain hardening, strain rate sensitivity, and ductility of nanostructured metals. Mater. Sci. Eng. A 375–377, 46 (2004).Google Scholar
30Ebrahimi, F., Zhai, Q. and Kong, D.: Deformation and fracture of electrodeposited copper. Scripta Mater. 39, 315 (1998).CrossRefGoogle Scholar
31Hattar, K. and Robertson, I.M. (2005, unpublished).Google Scholar
32Liao, X.Z., Zhou, F., Lavernia, E.J., Srinivasan, S.G., Baskes, M.I., He, D.W. and Zhu, Y.T.: Deformation mechanism in nanocrystalline Al: Partial dislocation slip. Appl. Phys. Lett. 83, 632 (2003).Google Scholar
33Robertson, I.M.: Microtwin formation in deformed nickel. Philos. Mag. A. Phys. Condens. Matter Defects Mech. Prop. 54, 821 (1986).Google Scholar
34Zhu, Y.T., Liao, X.Z., Srinivasan, S.G., Zhao, Y.H., Baskes, M.I., Zhou, F. and Lavernia, E.J.: Nucleation and growth of deformation twins in nanocrystalline aluminum. Appl. Phys. Lett. 85, 5049 (2004).CrossRefGoogle Scholar
35Gao, H., Zhang, L., Nix, W.D., Thompson, C.V. and Arzt, E.: Crack-like grain-boundary diffusion wedges in thin metal films. Acta Mater. 47, 2865 (1999).Google Scholar
36Balk, T.J., Dehm, G. and Arzt, E. Parallel glide: A fundamentally different type of dislocation motion in ultrathin metal films, in Multiscale Phenomena in Materials—Experiments and Modeling Related to Mechanical Behavior, edited by Zbib, H.M., Lassila, D.H., Levine, L.E., and Hemker, K.J. (Mater. Res. Soc. Symp. Proc. 779, Warrendale, PA, 2003), p. 87.Google Scholar
37Nix, W.D.: Mechanical properties of thin films. Metall. Mater. Trans. A. 20A, 2217 (1989).CrossRefGoogle Scholar
38Freund, L.B.: Stability of a dislocation threading a strained layer on a substrate. J. Appl. Mech., Trans. ASME 54, 553 (1987).CrossRefGoogle Scholar
39Hattar, K., Han, J., Saif, T. and Robertson, I.M. Development and application of a MEMS-based in situ TEM straining device for ultra-fine grained metallic systems, in Conference Proceedings from the Microscopy and Microanlysis Society, edited by And, I.M.erson, Price, R., Hall, E., Clark, E., S. McKernan. (Cambridge University Press, Cambridge, U.K., 2004), p. 50.Google Scholar