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Improving the interface adherence at sealings in solid oxide cell stacks

Published online by Cambridge University Press:  08 February 2019

Ilaria Ritucci*
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Ragnar Kiebach
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Belma Talic
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Li Han
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Philipp Zielke
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Peter V. Hendriksen
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
Henrik L. Frandsen
Affiliation:
Department of Energy Conversion and Storage, Technical University of Denmark, DK-4000 Roskilde, Denmark
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Thermal cycling of planar solid oxide cell (SOC) stacks can lead to failure due to thermal stresses arising from differences in thermal expansion of the stack’s materials. The interfaces between the cell, interconnect, and sealing are particularly critical. Hence, understanding possible failure mechanisms at the interfaces and developing robust sealing concepts are important for stack reliability. In this work, the mechanical performance of interfaces in the sealing region of SOC stacks is studied. Joints comprising Crofer22APU (preoxidized or coated with MnCo2O4 or Al2O3) are sealed using V11 glass. The fracture energy of the joints is measured, and the fractured interfaces are analyzed using microscopy. The results show that choosing the right coating solution would increase the fracture energy of the sealing area by more than 70%. We demonstrate that the test methodology could also be used to test the adhesion of thin coatings on metallic substrates.

Type
Invited Paper
Copyright
Copyright © Materials Research Society 2019 

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