Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-28T17:57:18.363Z Has data issue: false hasContentIssue false
  • English
  • Français

High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100)

Published online by Cambridge University Press:  31 January 2011

R. R. Kunz ,
H. R. Clark ,
P. M. Nitishin ,
M. Rothschild  and
B. S. Ahern
R. R. Kunz
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
H. R. Clark
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
P. M. Nitishin
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
M. Rothschild
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
B. S. Ahern
Affiliation:
Rome Air Development Center, Hanscom Air Force Base, Massachusetts 07131–5000
Get access

Abstract

Si(100) wafers were prepared by both diamond turning and standard lapping and polishing techniques. For single-point diamond machining, characterization of subsurface damage resulting from ductile-regime machining identified a plastic-yield zone consisting of slip planes and dislocation networks extending 1 to 3 μm deep despite surface root-mean-square roughness values as low as 5 nm. For conventional lapping and polishing using alumina grit, a transition from brittle to ductile yield was observed for grit sizes less than 300 nm. Subsurface damage depth correlated to surface roughness in a more straightforward manner than for the diamond point machining. Completely damage-free material removal was obtained only when a chemical component to the polishing was present.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 5 , May 1996 , pp. 1228 - 1237
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Blake, P. N. and Scattergood, R. O., J. Am. Ceram. Soc. 73, 949 (1990).CrossRefGoogle Scholar
2.Bifano, T., Bow, T., and Scattergood, R. O., Proc. SPIE 966, 108 (1988).CrossRefGoogle Scholar
3.Cook, L. M., in Technical Digest on Science of Optical Finishing, 1990 (Optical Society of America, Washington, D.C., 1990), pp. 9–12.Google Scholar
4.Blackley, W. S. and Scattergood, R. O., Precision Eng. 13, 95 (1991).CrossRefGoogle Scholar
5.Syn, C. K., Taylor, J. S., Donaldson, R. R., and Shimada, S., Proc. Jpn. Soc. Precision Eng., 1988 Spring Meeting, Kawasaki, Japan, March 1988.Google Scholar
6.Blackley, W. S. and Scattergood, R. O., J. Am. Ceram. Soc. 73, 3113 (1990).CrossRefGoogle Scholar
7.Chen, C. P. and Leipold, M. H., Ceram. Bull. 59, 469 (1980).Google Scholar
8.Johansson, S. and Schweitz, J-A., J. Am. Ceram. Soc. 71, 617 (1988).CrossRefGoogle Scholar
9.Johansson, S., Schweitz, J-A., and Lagerlof, K. P. D., J. Am. Ceram. Soc. 72, 1136 (1989).CrossRefGoogle Scholar