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Growth stresses and viscosity of thermal oxides on silicon and polysilicon

Published online by Cambridge University Press:  01 January 2006

H. Kahn ,
N. Jing ,
M. Huh  and
A.H. Heuer
H. Kahn*
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio 44106-7204
N. Jing
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio 44106-7204
M. Huh
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio 44106-7204
A.H. Heuer
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio 44106-7204
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Stresses in thermally grown SiO2 films on silicon have traditionally been determined by substrate curvature measurements. This technique is useful for studying stresses in thin films, but it cannot be used to investigate stresses generated in the substrate during film growth. In the present work, we used microelectromechanical systems-based microstrain gauge devices fabricated from single-crystal and polycrystalline silicon (henceforth silicon and polysilicon, respectively) to measure oxidation-induced stresses in both dry and wet oxidizing ambients. Our microstrain gauges had thicknesses on the micrometer scale, and were themselves used as the substrates to be oxidized. Stresses could be detected in both the SiO2 scales and the silicon and polysilicon substrates. In the SiO2 scales, the stresses were compressive and exhibited viscoelastic relaxation. The as-grown compressive stresses were greater for wet oxidation than they were for dry oxidation, and greater in scales grown on polysilicon than they were in scales grown on silicon. The viscosity of thermally grown SiO2 was the same whether scales formed by wet or dry oxidation, and the same for oxide scales on silicon and polysilicon. Significant compressive stresses were also generated in polysilicon during oxidation, but not in silicon.

Keywords

Microelectrical mechanical (MEMS)Oxidation/annealingThermal stresses
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 1 , January 2006 , pp. 209 - 214
Copyright
Copyright © Materials Research Society 2006

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References

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