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The grain refinement mechanism of electrodeposited copper

Published online by Cambridge University Press:  31 January 2011

Guoyong Wang ,
Zhonghao Jiang ,
Jianshe Lian  and
Qing Jiang
Jianshe Lian*
Affiliation:
Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
Qing Jiang
Affiliation:
Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Microstructure features of five electrodeposited coppers with different grain sizes were systematically characterized by using transmission electron microscopy (TEM) observations and x-ray diffraction (XRD) analysis. Based on the experimental observations, two mechanisms for the grain refinement in electrodeposited copper were identified: (i) twin–twin intersection can directly create grains with large-angle boundaries as small as 10 nm and (ii) grains can also be refined via formation of dislocation cells, transformation of dislocation cell walls into sub-boundaries with small misorientations, and evolution of sub-boundaries into highly misoriented grain boundaries. Besides, dislocations are also effective to cut twin lamellas into pieces and make twin boundaries curved and round.

Keywords

CuMicrostructureNanostructure
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 10 , October 2009 , pp. 3226 - 3236
Copyright
Copyright © Materials Research Society 2009

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