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Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Published online by Cambridge University Press:  31 January 2011

A.C. Lewis ,
C. Eberl ,
K.J. Hemker  and
T.P. Weihs
A.C. Lewis*
Affiliation:
Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, Maryland 21218
C. Eberl
Affiliation:
Johns Hopkins University, Department of Mechanical Engineering, Baltimore, Maryland 21218
K.J. Hemker
Affiliation:
Johns Hopkins University, Departments of Materials Science and Engineering, and Mechanical Engineering, Baltimore, Maryland 21218
T.P. Weihs
Affiliation:
Johns Hopkins University, Departments of Materials Science and Engineering, and Mechanical Engineering, Baltimore, Maryland 21218
*
a) Address all correspondence to this author. e-mail: [email protected] Present address: Naval Research Laboratory, Multifunctional Materials Branch, Washington, DC, 20375.
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Abstract

Uniaxial tensile tests were performed on Cu/Nb multilayered foils to investigate yield strength and grain boundary strengthening in the layered foils at room temperature and in fine-grained Nb at 600 °C. At room temperature, yielding in Cu/Nb multilayered foils is controlled by deformation in both layers, and grain boundary strengthening is observed with a Hall–Petch slope (kRT) of 198 ± 56 MPa·μm1/2 at a strain rate of 10−4 s−1. At 600 °C, yielding in Cu/Nb multilayered foils is controlled by deformation in just the Nb layers. Hall–Petch strengthening is observed over a range of strain rates, but the Hall–Petch slope decreases from 197 ± 71 MPa·μm1/2 for a strain rate of 10−4 s−1 to only 25 ± 40 MPa·μm1/2 for a strain rate of 10−6 s−1. The significant drop in the Hall–Petch slope for Nb with decreasing strain rate indicates a change in the controlling deformation mechanism from dislocation glide to dislocation creep.

Keywords

Stress–strain relationshipNbGrain size
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 2 , February 2008 , pp. 376 - 382
Copyright
Copyright © Materials Research Society 2007

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References

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