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Gate dielectric reliability and instability in GaN metal-insulator-semiconductor high-electron-mobility transistors for power electronics

Published online by Cambridge University Press:  26 September 2017

Jesús A. del Alamo Open the ORCID record for Jesús A. del Alamo [Opens in a new window] ,
Alex Guo  and
Shireen Warnock
Jesús A. del Alamo*
Affiliation:
Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
Alex Guo
Affiliation:
Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
Shireen Warnock
Affiliation:
Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

GaN field-effect transistors with impressive power switching characteristics have been demonstrated. Preventing their widespread field deployment are reliability and instability concerns. Some emanate from the use of a dielectric in the gate stack. Under typical operation, the gate dielectric comes periodically under intense electric field. This causes trapping and detrapping of electrons and introduces transient shifts in the threshold voltage, a phenomenon known as Bias-Temperature Instability (BTI). A high electric field also results in the formation of defects inside the dielectric. Over time, the defects accumulate and eventually result in the abrupt creation of a conducting path that shorts the dielectric and renders the device inoperable. This process, known as Time-Dependent Dielectric Breakdown (TDDB), often imposes a maximum lifetime for the FET technology. This article presents a methodology for the study of BTI and TDDB in insulated-gate GaN FETs. Our findings paint a picture of BTI and TDDB that in many respects is similar to that of Si transistors but with some unique characteristics. Understanding the physics and developing appropriate lifetime models is essential to enabling the deployment of this important new power electronics technology.

Keywords

electrical propertieselectronic materialsemiconducting
Type
Invited Feature Paper
Information
Journal of Materials Research , Volume 32 , Issue 18 , 28 September 2017 , pp. 3458 - 3468
Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Don W. Shaw

This paper has been selected as an Invited Feature Paper.

References

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