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The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188

Published online by Cambridge University Press:  31 January 2011

C.J. Boehlert ,
S.C. Longanbach ,
M. Nowell  and
S. Wright
C.J. Boehlert*
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824
S.C. Longanbach
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824
M. Nowell
Affiliation:
EDAX-TSL, Inc., Draper, Utah 84020
S. Wright
Affiliation:
EDAX-TSL, Inc., Draper, Utah 84020
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

In situ scanning electron microscopy was performed during elevated-temperature (⩽760 °C) tensile-creep deformation of a face-centered-cubic cobalt-based Udimet 188 alloy to characterize the deformation evolution and, in particular, the grain boundary-cracking evolution. In situ electron backscatter diffraction observations combined with in situ secondary electron imaging indicated that general high-angle grain boundaries were more susceptible to cracking than low-angle grain boundaries and coincident site-lattice boundaries. The extent of general high-angle grain-boundary cracking increased with increasing creep time. Grain-boundary cracking was also observed throughout subsurface locations as observed for postdeformed samples. The electron backscattered diffraction orientation mapping performed during in situ tensile-creep deformation proved to be a powerful means for characterizing the surface deformation evolution and in particular for quantifying the types of grain boundaries that preferentially cracked.

Keywords

CoGrain boundariesScanning electron microscopy (SEM)
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 2 , February 2008 , pp. 500 - 506
Copyright
Copyright © Materials Research Society 2007

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